Carbon Nanotube Packing Density Research Articles

Optimization of carbon nanotube ultracapacitor for cell design

We report a methodology to optimize vertically grown carbon nanotube (CNT) ultracapacitor (CNU) geometrical features such as CNT length, electrode-to-electrode separation, and CNT packing density. The electric field and electrolyte ionic motion within the CNU are critical in determining the device performance. Using a particle-based model (PBM) based on the molecular dynamics techniques we developed and reported previously, we compute the electric field in the device, keep track of the electrolyte ionic motion in the device volume, and evaluate the CNU electrical performance as a function of the aforementioned geometrical features. We show that the PBM predicts an optimal CNT density. Electrolyte ionic trapping occurs in the high CNT density regime, which limits the electrolyte ions from forming a double layer capacitance. In this regime, the CNU capacitance does not increase with the CNT packing density as expected, but dramatically decreases. Our results compare well with existing experimental data and the PBM methodology can be applied to an ultracapacitor built from any metallic electrode materials, as well as the vertical CNTs studied here.

Synthesis of Carbon Nanotube/Graphene Composites by One-Step Chemical Vapor Deposition for Electrodes of Electrochemical Capacitors

To control the packing density of carbon nanotubes (CNTs) and the number of graphene layers, carbon nanotube/graphene composites are directly grown on cobalt (Co) catalysts-coated nickel foam by one-step ambient pressure chemical vapor deposition (CVD) at different temperatures and times. The carbon nanotube/graphene composites grown by one-step CVD at 850°C for 10 min possess the highest specific capacitance. Furthermore, a lower growing temperature leads to a higher packing density of CNTs and a smaller number of layers of graphene. A shorter growing time also leads to a smaller number of layers of graphene.

Fabrication, Densification, and Replica Molding of 3D Carbon Nanotube Microstructures

The introduction of new materials and processes to microfabrication has, in large part, enabled many important advances in microsystems, lab-on-a-chip devices, and their applications. In particular, capabilities for cost-effective fabrication of polymer microstructures were transformed by the advent of soft lithography and other micromolding techniques (1, 2), and this led a revolution in applications of microfabrication to biomedical engineering and biology. Nevertheless, it remains challenging to fabricate microstructures with well-defined nanoscale surface textures, and to fabricate arbitrary 3D shapes at the micro-scale. Robustness of master molds and maintenance of shape integrity is especially important to achieve high fidelity replication of complex structures and preserving their nanoscale surface texture. The combination of hierarchical textures, and heterogeneous shapes, is a profound challenge to existing microfabrication methods that largely rely upon top-down etching using fixed mask templates. On the other hand, the bottom-up synthesis of nanostructures such as nanotubes and nanowires can offer new capabilities to microfabrication, in particular by taking advantage of the collective self-organization of nanostructures, and local control of their growth behavior with respect to microfabricated patterns. Our goal is to introduce vertically aligned carbon nanotubes (CNTs), which we refer to as CNT "forests", as a new microfabrication material. We present details of a suite of related methods recently developed by our group: fabrication of CNT forest microstructures by thermal CVD from lithographically patterned catalyst thin films; self-directed elastocapillary densification of CNT microstructures; and replica molding of polymer microstructures using CNT composite master molds. In particular, our work shows that self-directed capillary densification ("capillary forming"), which is performed by condensation of a solvent onto the substrate with CNT microstructures, significantly increases the packing density of CNTs. This process enables directed transformation of vertical CNT microstructures into straight, inclined, and twisted shapes, which have robust mechanical properties exceeding those of typical microfabrication polymers. This in turn enables formation of nanocomposite CNT master molds by capillary-driven infiltration of polymers. The replica structures exhibit the anisotropic nanoscale texture of the aligned CNTs, and can have walls with sub-micron thickness and aspect ratios exceeding 50:1. Integration of CNT microstructures in fabrication offers further opportunity to exploit the electrical and thermal properties of CNTs, and diverse capabilities for chemical and biochemical functionalization (3).

Fabrication and electrical integration of robust carbon nanotube micropillars by self-directed elastocapillary densification

Vertically aligned carbon nanotube (CNT) ‘forest’ microstructures fabricated by chemical vapor deposition (CVD) using patterned catalyst films typically have a low CNT density per unit area. As a result, CNT forests have poor bulk properties and are too fragile for integration with microfabrication processing. We introduce a new self-directed capillary densification method where a liquid is controllably condensed onto and evaporated from the CNT forests. Compared to prior approaches, where the substrate with CNTs is immersed in a liquid, our condensation approach gives significantly more uniform structures and enables precise control of the CNT packing density. We present a set of design rules and parametric studies of CNT micropillar densification by self-directed capillary action, and show that self-directed capillary densification enhances Young's modulus and electrical conductivity of CNT micropillars by more than three orders of magnitude. Owing to the outstanding properties of CNTs, this scalable process will be useful for the integration of CNTs as a functional material in microfabricated devices for mechanical, electrical, thermal and biomedical applications.

Carbon nanotube array vias for interconnect applications

The purpose of this study is to investigate the effect of carbon nanotube (CNT) growth parameters on CNT via resistance and examine the transverse motion of electrons in the CNT bundle vias. Single vias of 3.85×3.85 and 2.45×2.45μm2 correspond to 0.35×0.35μm2 6×6 and 4×4 array vias, respectively. With nickel catalyst, CNTs were grown by microwave plasma-enhanced chemical vapor deposition method. Two-terminal CNT via chains of single via and array vias were fabricated on the tantalum metal electrodes. The increase in pretreatment power or substrate temperature resulted in the decrease in CNT diameters and thus the increase in CNT packing density due to the etching effect of exciting hydrogen. This led to the decrease in CNT via resistance owing to more conducting channels. The increase in growth power or substrate temperature enhanced the CNT graphitization and hence yielded the decrease in CNT resistances as well as CNT via resistances. In the same via area, the CNT via resistance of array vias is lower than that of a single via. This could be ascribed to less tube-tube junctions and thus lower electrical resistance in the array vias. Accordingly, the transverse motion of electrons in the CNT bundle vias was demonstrated. Therefore, the integration of CNT array vias with CNT bundles is proposed for optimizing the conductivity of CNT vias in the global interconnects where the via dimensions are more alleviated.

Characterisation of carbon nanotube films deposited by electrophoretic deposition

Electrophoretic deposition (EPD) was shown to be a convenient method to fabricate uniform coatings of carbon nanotubes (CNTs) with desired thickness and excellent macroscopic homogeneity. The CNT deposition kinetics are controlled by the applied electric field and deposition time which, in turn, prove to be linearly correlated with the deposition yield and thickness. The CNT films were characterised by using a range of techniques including high resolution scanning electron microscopy, nanoindentation and atomic force microscopy. Nanoindentation results revealed differences in the local microstructure of CNT deposits leading to variations of Young’s modulus and hardness, which were ascribed to differences in the packing density of CNTs, as observed also by AFM. A mathematical model for the kinetic of EPD of CNTs based on Hamaker’s law was proposed and the predictions of the model were shown to be in good agreement with experimental results.

Performance Comparisons Between Carbon Nanotubes, Optical, and Cu for Future High-Performance On-Chip Interconnect Applications

Optical interconnects and carbon nanotubes (CNTs) present promising options for replacing the existing Cu-based global/semiglobal (optics and CNT) and local (CNT) wires. We quantify the performance of these novel interconnects and compare it with Cu/low-kappa wires for future high-performance integrated circuits. We find that for a local wire, a CNT bundle exhibits a smaller latency than Cu for a given geometry. In addition, by leveraging the superior electromigration properties of CNT and optimizing its geometry, the latency advantage can be further amplified. For semiglobal and global wires, we compare both optical and CNT options with Cu in terms of latency, energy efficiency/power dissipation, and bandwidth density. The above trends are studied with technology node. In addition, for a future technology node, we compare the relationship between bandwidth density, power density, and latency, thus alluding to the latency and power penalty to achieve a given bandwidth density. Optical wires have the lowest latency and the highest possible bandwidth density using wavelength division multiplexing, whereas a CNT bundle has a lower latency than Cu. The power density comparison is highly switching activity (SA) dependent, with high SA favoring optics. At low SA, optics is only power efficient compared to CNT for a bandwidth density beyond a critical value. Finally, we also quantify the impact of improvement in optical and CNT technology on the above comparisons. A small monolithically integrated detector and modulator capacitance for optical interconnects (~10 fF) yields a superior power density and latency even at relatively lower SA (~20%) but at high bandwidth density. At lower bandwidth density and SA lower than 20%, an improvement in mean free path and packing density of CNT can render it most energy efficient.

Packing density control of carbon nanotube emitters in an anodic aluminum oxide nano-template on a Si wafer

Carbon nanotubes (CNTs) emitters in the AAO templates on a silicon wafer were fabricated. The packing density of CNTs was changed in the order of 1 × 10 7 − 7 × 10 7 tips cm − 2 depending upon the concentration of hydrogen in the reactant gas mixture. The emission current density was strongly dependent upon the packing density of the CNT emitters. Low turn-on fields of 1.6–2.1 V/μm and field enhancement factor of 1900–4970 were observed.