Optical Packaging Technology Research Articles

Advanced Packaging Technology for High Density Silicon Photonics Transceiver Engines

Next generation high-density/high-data rate silicon photonics solutions will require advanced packaging technologies. Those include 3D integration, smaller micro-bumps or even bump-less chip-to-chip/wafer bonding technologies, advanced heatsinking and compatibility with optical packaging technologies. We will discuss results on wafer level optical assembly, 3D silicon photonics and future options to support the optical interconnect roadmap.

Recent Trends in Optical Packaging Technologies

Recent Trends in Optical Packaging Technologies

Recent Progress and Prospects on Optical Packaging Technology

Recent Progress and Prospects on Optical Packaging Technology

Looking Back on Activities of Optical Packaging Technology Committee

Looking Back on Activities of Optical Packaging Technology Committee

Optical Packaging Technology for On-Board Optical Interconnection

Optical Packaging Technology for On-Board Optical Interconnection

光回路実装技術の現状と将来展望

光回路実装技術の現状と将来展望

NIR Fluorescence Imaging Systems with Optical Packaging Technology

【Bioimaging has advanced the field of nanomedicine, drug delivery, and tissue engineering by directly visualizing the dynamic mechanism of diagnostic agents or therapeutic drugs in the body. In particular, wide-field, planar, near-infrared (NIR) fluorescence imaging has the potential to revolutionize human surgery by providing real-time image guidance to surgeons for target tissues to be resected and vital tissues to be preserved. In this review, we introduce the principles of NIR fluorescence imaging and analyze currently available NIR fluorescence imaging systems with special focus on optical source and packaging. We also introduce the evolution of the FLARE intraoperative imaging technology as an example for image-guided surgery.】

Large‐tolerant “OptoBump” interface for interchip optical interconnections

AbstractOptical interconnection technology for optical interboard and interchip connections will be an important technology in the next‐generation communication equipment seeking a high‐capacity throughput at the terabit per second level. With the objective of establishing an economical optical packaging technology, we propose an “optical I/O chip package,” which is an optical package for the hybrid integration of optoelectric (O/E) devices and LSI chips that can be mounted on a printed‐circuit board by standard surface mount technology (SMT). In this paper, we propose the OptoBump interface as the optical interconnection between the optical package and the board that connects these two elements by forming the microlens on both and using collimated light. Accommodating the fibers on the board and connecting the connectors become unnecessary because the connections having large beam diameters are able to tolerate offsets in the SMT mounting position. First, we calculated the required collimated beam diameter of 104 µm under the assumption of an SMT accuracy of ±50 µm. Next, we applied ray tracing to estimate the optical losses of the 45° mirror at the polymer optical waveguide facet integrated into the printed‐circuit substrate and clearly exhibited the incident beam conditions with both improved losses and tolerances. And we integrated the polymer microlens into the polymer optical waveguide and the surface‐emitting laser (VCSEL) and experimentally evaluated the optical coupling performance between them. The results verified a 1‐dB tolerance at ±50 µm and demonstrated the effectiveness of this proposal. © 2002 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 86(1): 1–8, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.10025

Foreword to the Special Issue on Optical Packaging Technology

Foreword to the Special Issue on Optical Packaging Technology

絵解き・光実装技術入門 第６回 最終回 光実装技術の将来展望 夢

絵解き・光実装技術入門 第６回 最終回 光実装技術の将来展望 夢

Advanced optical packaging technology for practical integrated photonic modules

AbstractFor optical communication technology, which has been pushing for higher speed and larger capacity in the transmission trunk lines, the urgent tasks are not only improvements in performance but also the expansion of applicable areas by introducing new functions and moving into new phases.For optical fibers to be applicable in access net, subscriber loop, intrastation transmission systems, and interprocessor connections, the realization of optical links that are easy to use, easy to fabricate; and inexpensive, is strongly demanded. Also, the appearance of optical nodes everywhere in the broad bandwidth network that will be the backbone of the multimedia society would not be too far off. Research on integrated optical devices and circuits that have new structures for waveguide‐type devices, array components, or two‐dimensional devices, is continuing to progress to meet these demands.To mount these devices and circuits compactly and inexpensively into packages and modules, innovative packaging techniques have to be developed correspondingly. From this viewpoint, this paper reviews optical packaging technology, which holds the key to the realization of integrated photonics.