One-step Polycondensation Procedure Research Articles

Enhancement of Ultraviolet Light Resistance of Colorless and Transparent Semi-Alicyclic Polyimide Nanocomposite Films via the Incorporation of Hindered Amine Light Stabilizers for Potential Applications in Flexible Optoelectronics.

Optically transparent polymer films with excellent thermal and ultraviolet (UV) resistance have been highly desired in advanced optoelectronic fields, such as flexible substrates for photovoltaic devices. Colorless and transparent polyimide (CPI) films simultaneously possess the good thermal stability and optical transparency. However, conventional CPI films usually suffered from the UV exposure and have to face the deterioration of optical properties during the long-term service in UV environments. In the current work, the commercially available hindered amine light stabilizers (HALS) were tried to be incorporated into the semi-alicyclic CPI matrix with the aim of enhancing the UV exposure stability. For this target, a CPI-0 film was first prepared from hydrogenated pyromellitic dianhydride (HPMDA) and 2,2′-dimethylbenzidine (DMBZ) via a one-step polycondensation procedure. Then, the commercially available HALS were incorporated into the CPI-0 (HPMDA-DMBZ) film matrix to afford four series of CPI/HALS composite films. Experimental results indicated that the Tinuvin® 791 HALS showed the best miscibility with the CPI-0 film matrix and the derived CPI-D series of composite films exhibited the best optical transmittances. The CPI-D nanocomposite films showed apparently enhanced UV exposure stability via incorporation of the 791 additives. For the pristine CPI-0 film, after the UV exposure for 6 h, the optical properties, including the transmittance at the wavelength of 350 nm (T350), lightness (L*), yellow indices (b*), and haze obviously deteriorated with the T350 values from 55.7% to 17.5%, the L* values from 95.12 to 91.38, the b* values from 3.38 to 21.95, and the haze values from 1.46% to 9.33%. However, for the CPI-D-10 film (791: CPI-0 = 1.0 wt%, weight percent), the optical parameters were highly maintained with the T350 values from 61.4% to 53.8%, the L* values from 95.46 to 95.36, the b* values from 1.84 to 1.51, and the haze values from 0.69% to 3.34% under the same UV aging conditions.

Synthesis and characterization of ternary copolyimides derived from aromatic dianhydride and aromatic diisocyanates

A series of polyimide (PI) copolymers were synthesized via a one-step polycondensation procedure from benzophenone-3,3′,4,4′-tetracarboxylic acid dianhydride, toluene diisocyanate (TDI), and 4,4′-methylene bis(phenyl isocyanate) (MDI) with various mole ratios of TDI and MDI ranging from 70:30 to 100:0. The inherent viscosities of the resulting PIs were in the range of 0.51–0.80 dL g−1. The prepared PIs showed good solubility in common organic as well as in less polar solvents. All copolymers afforded tough and flexible films that had good thermal stability with glass transition temperature of 308–325°C and the temperatures of 5% weight loss in air and nitrogen being 420 and 460°C, respectively. The resultant PI films with thickness about 15 μm exhibited high transparency (>88%) in visible region (400–700 nm). Also, the cured PI films possessed good mechanical properties with tensile strength of 60.52–69.31 MPa and tensile modulus of 0.98–1.30 GPa.

Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides

Novel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4-aminophenoxy)phenyl]pyridine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54–0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (Tg) of 221.7–310.5 °C, the temperature at 10 % weight loss of 524.1–579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %.

Sul-containing fluorinated polyimides for optical waveguide device

Novel sul-containing fluorinated polyimides have been synthesized by the reaction of 2,2′-bis-(trifluoromethyl)-4,4′-diaminodiphenyl sulfide (TFDAS) with 1,4-bis-(3,4-dicarboxyphenoxy)benzene dianhydride (HQDPA), 2,2′-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), 4,4′-oxydiphthalicanhydride (ODPA) or 3,4,3′,4′-biphenyl-tetracarboxylic acid dianhydride ( s-BPDA). The fluorinated polyimides, prepared by a one-step polycondensation procedure, have good solubility in many solvents, such as N-methyl-2-pyrrolidinone (NMP), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), cyclohexanone, tetrahydrofuran (THF) and m-cresol. The molecular weights ( M n's) and polydispersities ( M n/ M w's) of polyimides were in the range of 1.24 × 10 5 to 3.21 × 10 5 and 1.59–2.20, respectively. The polymers exhibit excellent thermal stabilities, with glass-transition temperatures ( T g) at 221–275 °C and the 5% weight-loss temperature are above 531 °C. After crosslinking, these polymers show higher thermal stability. The films of polymers have high optical transparency. The novel sul-containing fluorinated polyimides also have low absorption at both 1310 and 1550 nm wavelength windows. Rib-type optical waveguide device was fabricated using the fluorinated polyimides and the near-field mode pattern of the waveguide was demonstrated.