On-package Integration Research Articles

Next Generation Xeon Server Package Architecture

Abstract Semiconductor industry is moving towards more and more integration to provide more functionality and add value to the processor, thereby enabling better user experience. This integration can come in 3 categories: On-die integration, On-package integration, and On-board integration. On-board integration is the typical method being used for several generations and on-die and on-package integration architectures are getting more focus due to better performance and reduced power. The key vector to enable on-die/package architectures is reduced cost and maximum features for a given substrate and socket form factor. Silicon features are also moving at a faster pace compared to the board technology. This paper details a novel package (PoINT) architecture as well as the key technology challenges that were resolved to successfully enable this architecture.

3D package-integrated artificial magnetic conductor antenna arrays for 60 GHz transceivers

We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45° scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11 × 11 mm2 package area, has a measured gain of 17 dBi at broadside and 15 dBi at 45° scan angle, while the smaller array, occupying a 6.6 × 11 mm2 package area, has a gain of 15 dBi at broadside and 14 dBi at a 45° scan angle. These arrays are an ideal 3D-integrated package solution for 60 GHz radio transceivers.

Inkjet Printing of Multilayer Millimeter-Wave Yagi-Uda Antennas on Flexible Substrates

This letter presents two high-gain, multidirector Yagi-Uda antennas for use within the 24.5-GHz ISM band, realized through a multilayer, purely additive inkjet printing fabrication process on a flexible substrate. Multilayer material deposition is used to realize these 3-D antenna structures, including a fully printed 120- μm-thick dielectric substrate for microstrip-to-slotline feeding conversion. The antennas are fabricated, measured, and compared to simulated results showing good agreement and highlighting the reliable predictability of the printing process. An endfire realized gain of 8 dBi is achieved within the 24.5-GHz ISM band, presenting the highest-gain inkjet-printed antenna at this end of the millimeter-wave regime. The results of this work further demonstrate the feasibility of utilizing inkjet printing for low-cost, vertically integrated antenna structures for on-chip and on-package integration throughout the emerging field of high-frequency wireless electronics.

Space-Frequency Projection of Planar AMCs on Integrated Antennas for 60 GHz Radios

We present planar low-profile designs of an artificial magnetic conductor (AMC) appropriate for integration of planar antennas into small form-factor devices for wireless communications applications. These novel AMC designs have a single metallization layer with no vias, and the whole system is suitable for inexpensive on-package integration for 60-GHz radio transceivers. They allow simultaneously for projecting the AMC behavior directly on the antenna metallization layer, while eliminating surface waves and obeying package design rules. We also project on the frequency band where the integrated antenna presents good impedance matching and maximum radiation gain. The integrated antenna-AMC design presented has large bandwidth, small form factor suitable for on-package integration, and 6 dBi gain for single elements making it ideal for small directive on-package arrays for 60 GHz radio applications.

SOP Integration and Codesign of Antennas

The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.

Design of miniature multilayer on-package integrated image-reject filters

We present the design, implementation, and characterization of compact on-package integrated multilayer image-reject filters. The filter implemented in a novel lumped-element stripline configuration in a standard low-temperature cofired ceramic technology occupies an area of only 3.8 mm /spl times/ 2.4 mm /spl times/ 0.5 mm. A distinct feature of this filter is the optimal use of the parasitics of the lumped-element components to implement other components as an integral part of the filter by novel vertical deployments of planar structures. Measurement data of the prototype indicate 3 dB of insertion loss and 20 dB of return loss at the center frequency of 2.4 GHz, as well as 39-dB attenuation at the image frequency, suitable for Bluetooth applications. This paper demonstrates the feasibility of on-package integration of RF front-end elements where the transceiver module is built and, therefore, significantly reduces the development cost.