The paper establishes a relationship between the solutions for cracks located in the isotropy plane of a transversely isotropic piezoceramic medium and opened (without friction) by rigid inclusions and the solutions for cracks in a purely elastic medium. This makes it possible to calculate the stress intensity factor (SIF) for cracks in an electroelastic medium from the SIF for an elastic isotropic material, without the need to solve the electroelastic problem. The use of the approach is exemplified by a penny-shaped crack opened by either a disk-shaped rigid inclusion of constant thickness or a rigid oblate spheroidal inclusion in an electroelastic medium