Non-stick On Pad Research Articles

Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation

With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this paper focused on the elimination of non-stick on pad (NSOP) assembly defect at the wirebond process. Fishbone analysis and why-why analysis were done to comprehensively investigate the root-cause and eventually address the problem. High NSOP rejection rate was identified to be attributed to clamp and insert design, and was verified through series of analysis, design of experiment (DOE) and validation runs. Results revealed that by using the modified clamp and insert design with more holes would address NSOP rejection with around 90% defect reduction.

Challenges and Resolution for Copper Wirebonding on Tapeless Leadframe Chip-on-Lead Technology

This technical paper discusses a methodological and systematic way of resolving key challenges during introduction of Chip-On-Lead package specifically wirebonding issues that leads to production dilemma during production ramp-up of products using copper wire in tapeless leadframe. The project was intended to determine the “Red-X” or the major cause of yield detractors that may lead to quality issue during wirebonding process.
 Problem solving tools were showcased in this paper such as Data Analysis, Cause and Effect, Design-of–Experiment (DOE) and mechanical dimensional analysis which provided substantial impact in determining the real root-cause of the problem. Step-by-step elimination of variables was achieved with the use of statistical engineering tools. Outcome of the project eliminated the occurrence of Non-Stick-On-Pad (NSOP) during wirebonding process without cost involved and just optimizing the available in-house resources. The improvements also enhanced the quality of the product after final test which on the other hand lower the risk of having potential customer complaint in the future.

Reducing non-stick on pad for wire bond: A review

One of the largest losses in semiconductor assembly operations is non-stick on pad (NSOP) failures. NSOP failures are costly as the entire device will need to be rejected if there is one such failure on any bond pad. The review is aimed to look at the failure modes associated with poor bond pad quality, its causes and effects, and the known detection/prevention methods.