The electrical, metallurgical, and mechanical behavior of the Ti films heat‐treated in a rapid thermal processor in and ambient in the temperature range of 550 to 750°C were studied. In addition, formation of the film by rapid thermal nitridation (RTN) in ambient and its barrier integrity were also studied as a function of the nitridation temperature and duration. n+ and p+‐type silicon and thermal oxide were used as substrates. Electron spectroscopy for chemical analysis, Rutherford backscattering spectroscopy, and sputtered neutral mass spectrometry were used to study the extent of the interactions between N, Ti, and Si as well as identification of the phase and its thickness. The thermal stability of the film as a diffusion barrier was investigated in the temperature range of 400 to 475°C. The diffusion barrier integrity of the film and its thermal stability were investigated via substrate junction leakage current and contact resistance measurements done on test structures fabricated using a complete 1.0 and 0.85 μm complimentary metal oxide semiconductor erasible programmable read‐only memory mask sets. Presented data shows that the decrease in the sheet resistance and the increase in the stress of the heat‐treated Ti films as the temperature increases are due to the presence of silicon in the Ti films. Similar results were obtained when heat‐treatment was carried out in ambient. The analytical analyses indicate that the thickest film which can be formed by the RTN process in ambient, in the temperature range of 590 to 750°C, is only 200 to 240 Å and is formed at about 600 to 610°C. The substrate junction leakage current data taken from the test structures indicate that the film formed by one‐step nitridation in ambient is not electrically and thermally reliable as a diffusion barrier for fabrication of the integrated circuit devices with shallow junctions (≤0.2 μm) regardless of the nitridation temperature and duration, and as‐deposited thickness of the Ti film. This short‐coming is attributed to an inadequate thickness of the film and the formation of (Ti‐Si‐Al) ternary solution. Finally, to overcome this problem, a multistep nitridation process was developed that produced the thickest film at the contacts and on the oxide layer (borophosphosilicate glass/borophosphosilicate tetraethyl orthosilicate), as well as a layer under the film at the contacts. The diffusion integrity of this bilayer was also evaluated via substrate junction leakage current and contact resistance measurements. The results indicate the suitability of this film as a diffusion barrier for submicron integrated circuit devices having shallow junctions. Furthermore, these results indicate that the presence of the layer under the layer at the contacts is essential if the film formed by RTN process in ambient is to be used as a diffusion barrier.