Dual-frequency capacitive micromachined ultrasonic transducers (CMUTs) are introduced for multiscale imaging applications, where a single array transducer can be used for both deep low-resolution imaging and shallow high-resolution imaging. These transducers consist of low- and high-frequency membranes interlaced within each subarray element. They are fabricated using a modified sacrificial release process. Successful performance is demonstrated using wafer-level vibrometer testing, as well as acoustic testing on wirebonded dies consisting of arrays of 2- and 9-MHz elements of up to 64 elements for each subarray. The arrays are demonstrated to provide multiscale, multiresolution imaging using wire phantoms and can span frequencies from 2 MHz up to as high as 17 MHz. Peak transmit sensitivities of 27 and 7.5 kPa/V are achieved with the low- and high-frequency subarrays, respectively. At 16-mm imaging depth, lateral spatial resolution achieved is 0.84 and 0.33 mm for low- and high-frequency subarrays, respectively. The signal-to-noise ratio of the low-frequency subarray is significantly higher for deep targets compared to the high-frequency subarray. The array achieves multiband imaging capabilities difficult to achieve with current transducer technologies and may have applications to multipurpose probes and novel contrast agent imaging schemes.