Multiple Electronic Components Research Articles

Lattice Boltzmann simulation of natural convection heat transfer phenomenon for thermal management of multiple electronic components

Thermal management of electronic components is becoming a vital necessity in view of the rapid development of electronics technology. It is a concern imposed by the miniaturization of electronic chipsets. The present work addresses this issue numerically, using the lattice Boltzmann method (LBM). It consists of an air-filled heat sink containing multiple protruding electronic components. The problem is modelled using 2D continuity, momentum, and energy conservation equations. The thermal and dynamic fluid flow are analysed for various enclosure inclinations (0°, 45°, and 90°) and Rayleigh numbers (Ra=103-106). A twin protruding heat sources are considered at the bottom wall. The top cold wall can be at a uniform temperature (case 1) or consisting of two protruding sinks maintained at a constant temperature (case 2). The results showed that the maximum heat transfer rate corresponding to Nusselt number (Nu¯=5.51) is achieved for Ra=106 on the hot wall for the horizontal cavity in case 1, illustrating the cavity with top cold uniform wall. Indeed, the heat transfer is improved by 80% by varying the Rayleigh number (Ra) from 103 to 106. Furthermore, for case 2 with a twin cold protruding, a quite complicated heat transfer behaviour is observed on the hot wall. For Ra>106, the horizontal cavity outperforms the other cavities in terms of heat transfer rate, however the horizontal position is the less performant for Ra<104. With a horizontal disposition and Ra=106, the heat exchange ratio is improved by 32.32% in case 2 compared to case 1. The outcomes of this study provide insights into design and implementation of natural convection cooling solutions for electronic devices, which can have significant practical implications in various industries.

Passive thermal management strategy for cooling multiple portable electronic components: Hybrid nanoparticles enhanced phase change materials as an innovative solution

Modern electronics technologies have given great interest to phase change materials (PCMs). The present work is in line with this philosophy and deals with the effectiveness of a PCM-based heat sink and nanoparticles in insertion for thermal management of several electronic components. Present numerical study explores the solid-liquid phase change process of n-eicosane in an enclosure considered for cooling of electronics in the presence of one, two, and three protruding electronic components. To improve thermal management capability, four types of nanoparticles, namely, silver (Ag), magnesium oxide (MgO), multi-walled carbon nanotube (MWCNT), and silicon dioxide (SiO2), are inserted into the n-eicosane by single and hybrid ways at volume fractions ranging from 0 % to 4%, and by introducing a lateral fin playing the role of a motherboard. It should be noted that this study is interested in analysing the combined effects of the volume fraction of inserted nanoparticles ranging from 0 % to 4%, the type of inserted nanoparticles, and the number of electronic components installed at the heat sink on the overall heat transfer and flow structure of the fluid PCM. For this purpose, a mathematical model has been developed for the formulation of the governing equations of the conjugate natural convection. The enthalpy-porosity technique is applied for modelling the phase change process. Results reveal a significant relationship between the melting time and the operating temperature of the electronic component. A long phase change process is characterized by a high utilization of latent heat and subsequently the heat rejection becomes efficient. Hence, the longer melting times result in reduced operating temperatures. By insertion of SiO2-MWCNT hybrid nanoparticles, the melting time is increased by approximately 92 % compared to pure PCM, and the plateau temperature is mitigated by 11 °C by using one component in the enclosure. Furthermore, by increasing the number of electronic components, the flow structure, thermal field and melting front become more uniform. Thus, it can be recommended to use three electronic components with a lower heat generation rate instead of using one electronic component with three times higher heat dissipation in a PCM-based cooling system.

From CO2 to Electricity: Photosynthesis‐Based Functionally Cooperating Mini‐Generator

AbstractRecently, the global warming and climate changes have aroused focus of attentions. Hence, there is an increased demand to capture, utilize, and sequestrate the greenhouse gas, i.e., carbon dioxide (CO2), for promising applications. Functionally cooperating mini‐generators are a kind of self‐propelled smart devices that can harvest environmental energy and convert it to electricity through Faraday's law. But traditional mini‐generators are based on an energy‐consuming process appealing for energy consumption from high‐grade state to low‐grade one. Herein, a mini‐generator based on photosynthesis with CO2 as the fuel is designed. The generator can convert the internal energy of O2 bubbles produced by photosynthesis to electricity. This is an energy conversion from the lowest energy state to the applicable energy. Based on the high‐efficiency photosynthesis of hydrophyte, spontaneously water‐dissolved CO2 can afford to induce regularly cycled surfacing‐diving motion, and the induced electrical output can simultaneously actuate multiple electronic components. Owing to the weather sensitivity of the photosynthesis, the system can be used to monitor weather through reading the changes of output electrical signals. By integrating the artificial smart device with natural plants, this research will promote the applications of miniaturized devices toward green development.

Design of Real-Time Monitoring System for Cutting Fluids

The paper describes the design and implementation of a cutting fluid monitoring system, as well as the design and development of an algorithm to increase the life of the cutting fluid in the machine tool reservoir. Cutting fluids are the most common type of coolant in machining. During its use, it becomes contaminated and gradually degrades until it needs to be replaced with fresh fluid. To increase its effective service life, its parameters should be monitored at regular intervals, and corrective measures such as topping up the fluid quantity and adding inhibitors and additives should be taken if necessary. For this purpose, a conceptual design of a monitoring device was developed, and a prototype device was subsequently manufactured. The device is designed as a floating probe in the storage tank. Therefore, its shape had to be designed to accommodate multiple sensors, batteries, and electronic components while remaining floating and watertight. The designed prototype was made by additive manufacturing and placed in a cutting fluid while being measured at regular intervals. In the event of non-compliant parameters, the algorithm generated corrective actions, and the machine operator could take the required steps to significantly increase the lifetime of the cutting fluid.

Composite fault diagnosis of analog circuit system using chaotic game optimization-assisted deep ELM-AE

When multiple electronic components in an analog circuit fail simultaneously, since its high complexity, it is arduous to establish an accurate fault model and diagnose the composite faults precisely. Traditional approach for composite fault diagnosis is severely constrained since it excessively relies on domain expertise and signal processing technology. The rapid development of deep learning provides a new idea for it. In this study, an improved strategy based on deep extreme learning machine with autoencoder (DELM-AE) is proposed, which possesses more prominent capability on feature extraction and representation. The proposed method first utilizes multiple extreme learning machine with autoencoder (ELM-AE) to adaptively extract the hidden features from original collected signals layer by layer, which does not need to design representative features manually. Subsequently, efficient classification will be conducted based on extreme learning machine algorithm. All parameter values of the proposed network are determined at one time, eliminating the iterative updating process. To further enhance the performance of DELM-AE on feature extraction and classification, a novel chaos game optimization algorithm (CGO) is introduced to optimize the initial network parameters. The experimental results on two typical test circuits demonstrate that the proposed method, CGO-DELM-AE, can effectively diagnose the composite faults of analog circuit.

PIC micro-controller based synchronization of two fractional order jerk systems

The paper studies a 3D Chaotic Jerk oscillator with fractional derivatives. An approach is proposed to implement it on a PIC16F877A microcontroller in order to reduce the requirements for multiple analogue electronic components such as resistors, capacitors, coils, multipliers, operational amplifiers, which are very bulky and consume a lot of power. The behaviours of the underlying system are analysed analytically, numerically and experimentally. It comes from this analysis that the fractional model exhibits chaotic dynamics when for parameters for which the equivalent integer derivative system exhibits limit-cycles. The synchronization under two closed initial conditions is also studied, highlighting one of the most common applications of the chaos concept.

An AlGaN/GaN Lateral Bidirectional Current-Regulating Diode with Two Symmetrical Hybrid Ohmic-Schottky Structures.

Bidirectional current-regulating ability is needed for AC light emitting diode (LED) drivers. In previous studies, various rectifier circuits have been used to provide constant bidirectional current. However, the usage of multiple electronic components can lead to additional costs and power consumption. In this work, a novel AlGaN/GaN lateral bidirectional current-regulating diode (B-CRD) featuring two symmetrical hybrid-trench electrodes is proposed and demonstrated by TCAD Sentaurus (California USA) from Synopsys corporation. Through shortly connecting the Ohmic contact and trench Schottky contact, the unidirectional invariant current can be obtained even with the applied voltage spanning a large range of 0–200 V. Furthermore, with the combination of two symmetrical hybrid-trench electrodes at each side of the device, the proposed B-CRD can deliver an excellent steady current in different directions. Through the TCAD simulation results, it was found that the device’s critical characteristics (namely knee voltage and current density) can be flexibly modulated by tailoring the depth and length of the trench Schottky contact. Meanwhile, it was also demonstrated through the device/circuit mixed-mode simulation that the proposed B-CRD can respond to the change in voltage in a few nanoseconds. Such a new functionality combined with excellent performance may make the proposed B-CRD attractive in some special fields where the bidirectional current-limiting function is needed.

Integration of multiple electronic components on a microfibre towards an emerging electronic textile platform.

Electronic fibres have been considered one of the desired device platforms due to their dimensional compatibility with fabrics by weaving with yarns. However, a precise connecting process between each electronic fibre is essential to configure the desired electronic circuits or systems. Here, we present an integrated electronic fibre platform by fabricating electronic devices onto a one-dimensional microfibre substrate. Electronic components such as transistors, inverters, ring oscillators, and thermocouples are integrated together onto the outer surface of a fibre substrate with precise semiconductor and electrode patterns. Our results show that electronic components can be integrated on a single fibre with reliable operation. We evaluate the electronic properties of the chip on the fibre as a multifunctional electronic textile platform by testing their switching and data processing, as well as sensing or transducing units for detecting optical/thermal signals. The demonstration of the electronic fibre suggests significant proof of concepts for the realization of high performance with wearable electronic textile systems.

A taxonomy of attack mechanisms in the automotive domain

In the last decade, the automotive industry incorporated multiple electronic components into vehicles introducing various capabilities for adversaries to generate diverse types of attacks. In comparison to older types of vehicles, where the biggest concern was physical security, modern vehicles might be targeted remotely. As a result, multiple attack vectors aiming to disrupt different vehicle components emerged. Research and practice lack a comprehensive attack taxonomy for the automotive domain. In this regard, we conduct a systematic literature study, wherein 48 different attacks were identified and classified according to the proposed taxonomy of attack mechanisms. The taxonomy can be utilized by penetration testers in the automotive domain as well as to develop more sophisticated attacks by chaining multiple attack vectors together. In addition, we classify the identified attack vectors based on the following five dimensions: (1) AUTOSAR layers, (2) attack domains, (3) information security principles, (4) attack surfaces, and (5) attacker profile. The results indicate that the most applied attack vectors identified in literature are GPS spoofing, message injection, node impersonation, sybil, and wormhole attack, which are mostly applied to application and services layers of the AUTOSAR architecture.

Implementation of Symmetric Functions Using Memristive Nanocrossbar Arrays and their Application in Cryptography

VLSI technology makes the integration of multiple electronic components into a single electronic chip possible but Moore has already predicted that further miniaturization of VLSI chips will cause excess heat dissipation. Because of this impediment faced by this technology, the scientists have turned their focus to nano-technological alternatives to keep up the continuous device improvement and continue with the miniaturization procedure without facing any hurdle from the aspect of heat dissipation and space and time complexity. Memristor can be such a nano-alternative, which has the potential of very rapid execution, miniaturization and very low power consumption compared to transistor-based technology. The main objective of this paper is to show an application of symmetric function in cryptography. In order to do so, first, three-input and five-input symmetric functions are implemented in memristor-based nanocrossbar circuits. Then a dynamic circuit of symmetric functions is implemented where the input voltages convert the circuit to three-input or five-input symmetric function circuit as and when required. The simulation results show the satisfactory behavior of our proposed design.

Electronically Pattern Reconfigurable Antenna for IoT Applications

In this paper, an electronically pattern reconfigurable antenna for Internet of Things (IoT) applications is presented. The antenna consists of 4 wire-patches sharing the same ground plane. This radiating element can switch between four end-fire radiation states in less than 5 us and achieves a 290 MHz frequency bandwidth from 2.25 to 2.54 GHz. The results show that this antenna can realize a peak gain of 3.9 dBi at 2.44 GHz and a front-to-back ratio greater than 6.5 dB. A single low-power, low-insertion loss SP4T switch enables the radiation pattern steering. This approach avoids the use of multiple electronic components in the reconfiguration mechanism, thus accommodating the IoT microcontroller’s limited resource constraints. The antenna structure is compact and printed on two cost-effective FR-4 printed circuit boards (PCBs). Thanks to its high performance, small size, low cost, and low-power characteristics, the proposed structure is suitable for IoT applications.

Sustainably Powered, Multifunctional Flexible Feedback Implant by the Bifacial Design and Si Photovoltaics.

Advanced design and integration of functioning devices with secured power is of interest for many applications that require complicated, sophisticated, or multifunctional processes in confined environments such as in human bodies. Here, strategies for design and realization are introduced for multifunctional feedback implants with the bifacial design and silicon (Si) photovoltaics in flexible forms. The approaches provide efficient design spaces for flexible Si photovoltaics facing up for sustainable powering and multiple electronic components for feedback functions facing down for sensing, processing, and stimulating in human bodies. The computational and experimental results including in vivo assessments ensure feasibility of the approaches by demonstrating feedback multifunctions, power-harvesting in milliwatts, and mechanical compatibility for operations in live tissues. This work should useful for wide range of applications that require sustainable power and advanced multifunctions.

Structural and Electronic Characterization Through Spectroscopy Analysis of Gd-Gd₂O₃ Nanoparticles.

Based on the new necessity of residual dispensing of heavy metals (or even more, rare earths) that are part of the composition of multiple electronic components as the cellular phones or computers; this work reports the use of physical processes for taking advantage of elements from the electronic residues. Recycling and processing to generate nanomaterials is an attractive option, because the economic and ecologic perspectives. In this work, Gd-Gd₂O₃ nanoparticles (through a sonic-chemical method at room temperature assisted with Tannic acid as reduction agent), is reported. The structure characterization was performed over the samples using complementary techniques such as transmission electron microscopy, X-ray diffraction, Raman and infrared spectroscopies. The obtained results are related to self-assembling mechanisms. As a complement, Ultraviolet-visible absorbance data was used to determine some electronic properties such as band structure. Therefore, this work has demonstrated the possibility of synthesizing lanthanide nanoparticles without burning the samples.

Research on the Application of Big Data Ecology in College Physical Education and Training

As the demand for lightweight products in electronic products continues to increase, the demand for increased integration of products is becoming more and more urgent. Systematic package SiP refers to a package module system that combines multiple active electronic components with passive components to achieve a certain function. Through the effective packaging technology, the mechanical properties and thermal properties of the chip are greatly improved. According to the specific connection mode of the chip and the substrate, the packaging process can be mainly divided into wire bonding package and flip chip soldering, and 75% to 80% of the product package types are wire bonding packages. Although wire bonding packages have cost and reliability advantages, they still have I/O problems for IC packages, and wire bonding tools are still evolving. Flip-chip soldering has a shorter interconnect line, which results in a higher density of chip mounting. At the same time, the tools in these two technologies are constantly being updated, which makes the integration of chips more and more high.

Multiple Electronic Components and Lifshitz Transitions by Oxygen Wires Formation in Layered Cuprates and Nickelates

There is growing compelling experimental evidence that a quantum complex matter scenario made of multiple electronic components and competing quantum phases is needed to grab the key physics of high critical temperature (Tc) superconductivity in layered cuprates. While it is known that defect self-organization controls Tc, the mechanism remains an open issue. Here we focus on the theoretical prediction of the multiband electronic structure and the formation of broken Fermi surfaces generated by the self-organization of oxygen interstitials Oi atomic wires in the spacer layers in HgBa2CuO4+δ, La2CuO4+δ and La2NiO4+δ, by means of self-consistent Linear Muffin-Tin Orbital (LMTO) calculations. The electronic structure of a first phase of ordered Oi atomic wires and of a second glassy phase made of disordered Oi impurities have been studied through supercell calculations. We show the common features of the influence of Oi wires in the electronic structure in three types of materials. The ordering of Oi into wires leads to a separation of the electronic states between the Oi ensemble and the rest of the bulk. The wire formation first produces quantum confined localized states near the wire, which coexist with, Second, delocalized states in the Fermi surface (FS) of doped cuprates. A new scenario emerges for high Tc superconductivity, where Kitaev wires with Majorana bound states are proximity-coupled to a 2D d-wave superconductor.

AgNPs@CNTs/Ag hybrid films on thiolated PET substrate for flexible electronics

As the baseplate and hinge of various components for the transmission of circuit signals, the flexible printed circuit (FPC) has become a vital component of flexible electronics. However, the bonding strength of the substrate/film which affects the practical application is usually weak, and carbon nanotubes (CNTs), an ideal reinforcement for enhancing metal-based films, show subdued performance for the interfacial wettability problem. Hereon, we presented a method for simultaneously modifying a flexible PET substrate and CNT by the same TES molecules. Consequently, adhesive strength of substrate/film was enhanced effectively to 12 N/cm and the interfacial wettability of CNTs and Ag matrix was improved in the form of coating Ag nanoparticles (AgNPs) on thiol-grafted CNTs to change the interface from “CNTs-Ag matrix” type to “AgNPs-Ag matrix” type, distinctly reducing the sheet resistance of hybrid films by 64.5% compared to pristine CNTs/Ag hybrid films and 90.9% to silver films, which mattered of great significance for hybrid films. What’s more, based on flexible AgNPs@CNTs/Ag hybrid films, multiple electronic components were integrated and perfectly worked, illustrating the practicability of AgNPs@CNTs/Ag hybrid films for flexible electronics.

Modular and Reconfigurable Stretchable Electronic Systems

AbstractElectronics offering modularity in design and function, i.e., modular electronics have enabled a wide gamut of applications, such as promotion of creativity, self‐assembling robots, and customizable consumer electronics. In particular, there is recently a fertile application domain within the rapidly growing needs in wearable technologies. Toward this application, it is proposed that stretchable, self‐healable, and mechanically tough materials will enable a highly desirable reconfigurable multifunctional and modular platform for wearable electronics. Here, the novel applications of tough self‐healing elastomer are reported to realize skin‐like modular electronics system,, i.e., stretchable, tough, self‐healable, and reconfigurable, in which multiple electronic components are electrically interconnected and can effectively communicate with each other digitally. The fabricated self‐healing conductive lines can also allow for components that can be readily cut, reconfigured, and reconnected by the user.

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator (LA) to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm3 is evaluated as the LA for two different system volumes (associated with two different condensers). Results demonstrated that the LA provided robust thermal performance as a function of FR for the entire range of heat loads tested. In addition, the present LA was more effective for a small volume system, 599 cm3, than for a large volume system, 1169 cm3, in which the relative size of the LA increased from 12.8% to 25% of the total system's volume.

The Road Map toward Room-Temperature Superconductivity: Manipulating Different Pairing Channels in Systems Composed of Multiple Electronic Components

While it is known that the amplification of the superconducting critical temperature TC is possible in a system of multiple electronic components in comparison with a single component system, many different road maps for room temperature superconductivity have been proposed for a variety of multicomponent scenarios. Here we focus on the scenario where the first electronic component is assumed to have a vanishing Fermi velocity corresponding to a case of the intermediate polaronic regime, and the second electronic component is in the weak coupling regime with standard high Fermi velocity using a mean field theory for multiband superconductivity. This roadmap is motivated by compelling experimental evidence for one component in the proximity of a Lifshitz transition in cuprates, diborides, and iron based superconductors. By keeping a constant and small exchange interaction between the two electron fluids, we search for the optimum coupling strength in the electronic polaronic component which gives the largest amplification of the superconducting critical temperature in comparison with the case of a single electronic component.

Small‐size LTE/WWAN planar printed antenna for ultrathin smartphone application

ABSTRACTA compact small‐size LTE/WWAN planar printed antenna for ultrathin smartphone application is presented, which achieves two wide operating bands of 647–972 MHz and 1605–2770 MHz to cover LTE (LTE700/2300/2500) and WWAN (GSM850/900/1800/1900/UMTS2100) bands. A feeding strip and an inverted M‐shaped parasitic shorting strip are combined to form the proposed coupled‐fed antenna with a simple structure and small size of 15 × 36 mm2. So it can be easily printed on the circuit board and it is convenient to adjust antenna performance. At the same time, a rectangular notch on the circuit board not only can be used to place the battery for ultrathin smartphone application but also changes the ground plane current path to achieve a better impedance matching, especially in the low‐band (698–960 MHz). Moreover, the proposed antenna allows tighter integration of multiple electronic components, such as USB, microphone. In addition, the design process and measured results of the proposed antenna are also provided below. © 2015 Wiley Periodicals, Inc. Microwave Opt Technol Lett 57:2116–2120, 2015