We propose the use of multi-pole nanoelectromechanical (NEM) relays for routing multi-bit signals within a coarse-grained reconfigurable array (CGRA). We describe a CMOS-compatible multi-pole relay design that can be integrated in 3-D and improves area utilization by 40% over a prior design. We then demonstrate a method for placing multiple contacts on a relay that can reduce contact resistance variation by 40× over a circular placement strategy. Additionally, we develop static and dynamic SPICE models (calibrated to accurate finite element models) for predicting circuit-level performance with these devices. Finally, we establish a methodology for integrating these relays into an industry-standard digital design flow. Using our multi-pole relay design, we perform post-layout simulation of a hybrid CMOS-NEMS CGRA processing element (PE) tile in 40 nm technology. We achieve up to 19% lower area and 10% lower power at iso-delay, compared to a CMOS-only CGRA PE tile. The results show a way to bridge the performance gap between programmable logic devices (such as CGRAs) and application-specific integrated circuits using NEMS technology.
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