Modeling Of High-speed Interconnects Research Articles

Machine Learning for the Performance Assessment of High-Speed Links

This paper investigates the application of support vector machine to the modeling of high-speed interconnects with largely varying and/or highly uncertain design parameters. The proposed method relies on a robust and well-established mathematical framework, yielding accurate surrogates of complex dynamical systems. An identification procedure based on the observation of a small set of system responses allows generating compact parametric relations, which can be used for design optimization and/or stochastic analysis. The feasibility and strength of the method are demonstrated based on a benchmark function and on the statistical assessment of a realistic printed circuit board interconnect, highlighting the main features and benefits of this technique over state-of-the-art solutions. Emphasis is given to the effects of the initial sample size and of input noise on the model estimation.

Fast Broadband Modeling of Traces Connecting Vias in Printed Circuit Boards Using Broadband Green’s Function Method

In this paper, the broadband Green’s function with low wavenumber extraction (BBGFL) is applied to modeling of traces connecting vias in arbitrarily shaped power/ground planes of printed circuit boards (PCBs). The proposed modeling method is a hybrid technique based on mode decomposition: BBGFL is used to fast compute the vias in power/ground planes, MoM is used to calculate the impedance matrix of the traces, and a physical circuit model is then applied to combine the vias and traces in the power/ground planes. The present method is compared to the method of moments (MoM) and the commercial tool HFSS. Results show that the results of the present technique are in good agreement with MoM and HFSS on the radiated emissions from PCBs. BBGFL is several hundred times faster than HFSS in CPU time for broadband simulations. The technique provides a fast broadband solution for system-level modeling of high-speed interconnects with vias and traces in electronic design automation design and applications.

Modeling of High-Speed Interconnects for Signal Integrity Analysis: Part I

Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed.

Time-domain modeling of high-speed interconnects by modified method of characteristics

In this paper, a new model of lossy transmission lines is presented for the time-domain simulation of high-speed interconnects. This model is based on the modified method of characteristics (MMC). The characteristic functions are first approximated by applying lower order Taylor series in the frequency domain, and then a set of simple recursive formulas are obtained in the time domain. The formulas, which involve tracking performances between two ends of a transmission line, are similar to those derived by the method of characteristics for lossless and undistorted lossy transmission lines. The algorithm, based on the proposed MMC model, can efficiently evaluate transient responses of high-speed interconnects. It only uses the quantities at two ends of the lines, requiring less computation time and less memory space than required by other methods. Examples indicate that the new method has high accuracy and is very efficient for the time-domain simulation of interconnects in high-speed integrated circuits.

Electromagnetic model order reduction for system-level modeling

Reduced-order modeling of an electromagnetic system is understood as the approximation of a continuous or discrete model of the system by one of substantially lower order, yet capable of capturing the electromagnetic behavior of the original one with sufficient engineering accuracy. Specific methodologies for model order reduction of distributed electromagnetic systems are discussed in this paper. It is shown that electromagnetic model order reduction enhances computational efficiency and, thus, facilitates system-level modeling and computer simulation of multifunctional systems. The proposed methodologies are demonstrated through applications to the reduced-order modeling of high-speed interconnects, electromagnetic waveguides, and microstrip antennas.