Millisecond-range Flash Lamp Annealing Research Articles

B20 Weyl Semimetal CoSi Film Fabricated by Flash-Lamp Annealing.

B20-CoSi is a newly discovered Weyl semimetal that crystallizes into a noncentrosymmetric crystal structure. However, the investigation of B20-CoSi has so far been focused on bulk materials, whereas the growth of thin films on technology-relevant substrates is a prerequisite for most practical applications. In this study, we have used millisecond-range flash-lamp annealing, a nonequilibrium solid-state reaction, to grow B20-CoSi thin films. By optimizing the annealing parameters, we were able to obtain thin films with a pure B20-CoSi phase. The magnetic and transport measurements indicate the appearance of the charge density wave and chiral anomaly. Our work presents a promising method for preparing thin films of most binary B20 transition-metal silicides, which are candidates for topological Weyl semimetals.

Controlled Silicidation of Silicon Nanowires Using Flash Lamp Annealing.

Among other new device concepts, nickel silicide (NiSix)-based Schottky barrier nanowire transistors are projected to supplement down-scaling of the complementary metal-oxide semiconductor (CMOS) technology as its physical limits are reached. Control over the NiSix phase and its intrusions into the nanowire is essential for superior performance and down-scaling of these devices. Several works have shown control over the phase, but control over the intrusion lengths has remained a challenge. To overcome this, we report a novel millisecond-range flash lamp annealing (FLA)-based silicidation process. Nanowires are fabricated on silicon-on-insulator substrates using a top-down approach. Subsequently, Ni silicidation experiments are carried out using FLA. It is demonstrated that this silicidation process gives unprecedented control over the silicide intrusions. Scanning electron microscopy and high-resolution transmission electron microscopy are performed for structural characterization of the silicide. FLA temperatures are estimated with the help of simulations.

B20–MnSi films grown on Si(100) substrates with magnetic skyrmion signature

Magnetic skyrmions have been suggested as information carriers for future spintronic devices. As the first material with experimentally confirmed skyrmions, B20-type MnSi was the research focus for more than a decade. Although B20–MnSi films have been successfully grown on Si(111) substrates, there is no report about B20–MnSi films on Si(100) substrates, which would be more preferred for practical applications. In this letter, we present the first preparation of B20–MnSi on Si(100) substrates. It is realized by sub-second solid-state reaction between Mn and Si via flash-lamp annealing at ambient pressure. The regrown layer shows an enhanced Curie temperature of 43 K compared with bulk B20–MnSi. The magnetic skyrmion signature is obtained in our films by magnetic and transport measurements. The millisecond-range flash-lamp annealing provides a promising avenue for the fabrication of Si-based skyrmionic devices.

Chlorine doping of MoSe2 flakes by ion implantation.

The efficient integration of transition metal dichalcogenides (TMDs) into the current electronic device technology requires mastering the techniques of effective tuning of their optoelectronic properties. Specifically, controllable doping is essential. For conventional bulk semiconductors, ion implantation is the most developed method offering stable and tunable doping. In this work, we demonstrate n-type doping in MoSe2 flakes realized by low-energy ion implantation of Cl+ ions followed by millisecond-range flash lamp annealing (FLA). We further show that FLA for 3 ms with a peak temperature of about 1000 °C is enough to recrystallize implanted MoSe2. The Cl distribution in few-layer-thick MoSe2 is measured by secondary ion mass spectrometry. An increase in the electron concentration with increasing Cl fluence is determined from the softening and red shift of the Raman-active A1g phonon mode due to the Fano effect. The electrical measurements confirm the n-type doping of Cl-implanted MoSe2. A comparison of the results of our density functional theory calculations and experimental temperature-dependent micro-Raman spectroscopy data indicates that Cl atoms are incorporated into the atomic network of MoSe2 as substitutional donor impurities.

Soft X-ray absorption study of tantalum incorporation in titanium oxide films: Impact of flash-lamp annealing

The impact of Ta incorporation (up to ~21 at.%) in titanium dioxide (TiO2) films subjected to post-deposition millisecond-range flash-lamp annealing (FLA) is addressed. Phase formation with short-range information was established by means of soft X-ray absorption near-edge structure (XANES) in combination with standard X-ray diffraction. As-grown films are X-ray amorphous, but display a significant structural improvement upon FLA. Up to relatively large Ta concentrations (~ 12 at.%), FLA can be used to effectively incorporate Ta into a nanocrystalline anatase TiO2 phase, although its structural quality deteriorates progressively with the Ta content. For the intermediate Ta range between 12 and 17 at.%, the structure of the FLA films is highly disordered, being unable to overcome the initial distorted arrangement. In any case, rutile- or Ta2O5-like environments emerge for low and high contents, respectively. Finally, for the highest Ta content (~21 at.%), the formation of good-quality nanocrystalline Ta2O5 phase occurs after FLA. As assessed by XANES, the structural evolution upon FLA seems to be determined by the initial (amorphous) structure. Lastly, all the samples are highly transparent from the visible to the near-infrared region, and the band-gap can be tailored from ~3.2 to ~3.8 eV with increasing the amount of incorporated Ta.

Ultra-fast annealing manipulated spinodal nano-decomposition in Mn-implanted Ge

In the present work, millisecond-range flash lamp annealing is used to recrystallize Mn-implanted Ge. Through systematic investigations of structural and magnetic properties, we find that the flash lamp annealing produces a phase mixture consisting of spinodally decomposed Mn-rich ferromagnetic clusters within a paramagnetic-like matrix with randomly distributed Mn atoms. Increasing the annealing energy density from 46, via 50, to 56 J cm−2 causes the segregation of Mn atoms into clusters, as proven by transmission electron microscopy analysis and quantitatively confirmed by magnetization measurements. According to x-ray absorption spectroscopy, the dilute Mn ions within Ge are in d5 electronic configuration. This Mn-doped Ge shows paramagnetism, as evidenced by the unsaturated magnetic-field-dependent x-ray magnetic circular dichroism signal. Our study reveals how spinodal decomposition occurs and influences the formation of ferromagnetic Mn-rich Ge–Mn nanoclusters.

Formation of n- and p-type regions in individual Si/SiO2 core/shell nanowires by ion beam doping

A method for cross-sectional doping of individual Si/SiO2 core/shell nanowires (NWs) is presented. P and B atoms are laterally implanted at different depths in the Si core. The healing of the implantation-related damage together with the electrical activation of the dopants takes place via solid phase epitaxy driven by millisecond-range flash lamp annealing. Electrical measurements through a bevel formed along the NW enabled us to demonstrate the concurrent formation of n- and p-type regions in individual Si/SiO2 core/shell NWs. These results might pave the way for ion beam doping of nanostructured semiconductors produced by using either top-down or bottom-up approaches.

In situ ohmic contact formation for n-type Ge via non-equilibrium processing

Highly scaled nanoelectronics requires effective channel doping above 5 × 1019 cm−3 together with ohmic contacts with extremely low specific contact resistivity. Nowadays, Ge becomes very attractive for modern optoelectronics due to the high carrier mobility and the quasi-direct bandgap, but n-type Ge doped above 5 × 1019 cm−3 is metastable and thus difficult to be achieved. In this letter, we report on the formation of low-resistivity ohmic contacts in highly n-type doped Ge via non-equilibrium thermal processing consisting of millisecond-range flash lamp annealing. This is a single-step process that allows for the formation of a 90 nm thick NiGe layer with a very sharp interface between NiGe and Ge. The measured carrier concentration in Ge is above 9 × 1019 cm−3 with a specific contact resistivity of 1.2 × 10−6 Ω cm2. Simultaneously, both the diffusion and the electrical deactivation of P are fully suppressed.

Structural and optical studies of Pr implanted ZnO films subjected to a long-time or ultra-fast thermal annealing

Epitaxial thin ZnO films grown by Atomic Layer Deposition were implanted with 150keV Pr ions to a fluence of 1×1015at/cm2. Implanted samples were subjected to two different kinds of annealing: rapid thermal annealing (RTA) and millisecond-range flash lamp annealing (FLA). Structural properties of implanted and annealed ZnO and the optical response were evaluated by the Channeling Rutherford Backscattering Spectrometry (RBS/c), High-resolution X-ray diffraction and Photoluminescence Spectroscopy (PL), respectively. The results shown, that both annealing techniques lead to recrystallization of the ZnO lattice, that was damaged during the ion implantation. Upon RTA performed at 800°C a return of Zn atoms from interstitial to their regular site positions is accompanied by rejection of primarily substitutional Pr atoms to the interstitial sites. Consequently, it leads to the out-diffusion and precipitation of Pr atoms on the surface. In contrast to RTA, the diffusion of implanted Pr during a millisecond range FLA treatment is completely suppressed. Despite differences in location of Pr inside the ZnO matrix after FLA and RTA, both annealing techniques lead to the optical activation of Pr3+. Interestingly, our RBS/c study for as implanted layers also revealed the anomalous damage peak, called intermediate peak (IP) located between the expected surface and the bulk damage peak. The PL spectra clearly suggest, that the defect which forms the IP, can be assigned to Zn interstitials. The long-time annealing at 800°C in oxygen atmosphere causes the complete removal of the IP.

Room-temperature short-wavelength infrared Si photodetector

The optoelectronic applications of Si are restricted to the visible and near-infrared spectral range due to its 1.12 eV-indirect band gap. Sub-band gap light detection in Si, for instance, has been a long-standing scientific challenge for many decades since most photons with sub-band gap energies pass through Si unabsorbed. This fundamental shortcoming, however, can be overcome by introducing non-equilibrium deep-level dopant concentrations into Si, which results in the formation of an impurity band allowing for strong sub-band gap absorption. Here, we present steady-state room-temperature short-wavelength infrared p-n photodiodes from single-crystalline Si hyperdoped with Se concentrations as high as 9 × 1020 cm−3, which are introduced by a robust and reliable non-equilibrium processing consisting of ion implantation followed by millisecond-range flash lamp annealing. We provide a detailed description of the material properties, working principle and performance of the photodiodes as well as the main features in the studied wavelength region. This work fundamentally contributes to establish the short-wavelength infrared detection by hyperdoped Si in the forefront of the state-of-the-art of short-IR Si photonics.

The photoluminescence response to structural changes of Yb implanted ZnO crystals subjected to non-equilibrium processing

In this paper, we present the detailed study of optical and structural properties of Yb implanted single ZnO crystals. Hydrothermally grown wurtzite (0001) ZnO crystals were implanted with 150 keV Yb ions to fluencies of 5 × 1014 and 1 × 1015 at/cm2. After ion implantation, two different types of annealing were performed: rapid thermal annealing (RTA) and millisecond range flash lamp annealing (FLA). Crystalline quality, damage recovery, and Yb lattice site location were evaluated by the Channeling Rutherford Backscattering Spectrometry (RBS/c). It is shown that independent of the used annealing technique, defects formed in ZnO during ion implantation can be removed. Upon RTA performed at the temperature higher than 800 °C, strong out-diffusion of implanted Yb atoms and precipitation on the surface takes place. Consequently, the degradation of the photoluminescence (PL) efficiency is observed. The diffusion of implanted Yb during millisecond range FLA does not occur for such experimental conditions. Moreover, FLA treatment for 20 ms leads to the formation of single crystalline ZnO layer with Yb incorporated in the substitutional lattice sites. According to RBS/c and PL data, Yb atoms substituted in the Zn sublattice are predominantly in the 2+ oxidation state. The most intensive PL has been observed after annealing at 800 °C for 20 min which is accompanied with the reduction of Yb substitutional fraction and formation of octahedron Yb-oxygen clusters within ZnO.

Formation of silicon nanocrystals in silicon carbide using flash lamp annealing

During the formation of Si nanocrystals (Si NC) in SixC1−x layers via solid-phase crystallization, the unintended formation of nanocrystalline SiC reduces the minority carrier lifetime and therefore the performance of SixC1−x as an absorber layer in solar cells. A significant reduction in the annealing time may suppress the crystallization of the SiC matrix while maintaining the formation of Si NC. In this study, we investigated the crystallization of stoichiometric SiC and Si-rich SiC using conventional rapid thermal annealing (RTA) and nonequilibrium millisecond range flash lamp annealing (FLA). The investigated SixC1−x films were prepared by plasma-enhanced chemical vapor deposition and annealed at temperatures from 700 °C to 1100 °C for RTA and at flash energies between 34 J/cm2 and 62 J/cm2 for FLA. Grazing incidence X-ray diffraction and Fourier transformed infrared spectroscopy were conducted to investigate hydrogen effusion, Si and SiC NC growth, and SiC crystallinity. Both the Si content and the choice of the annealing process affect the crystallization behavior. It is shown that under certain conditions, FLA can be successfully utilized for the formation of Si NC in a SiC matrix, which closely resembles Si NC in a SiC matrix achieved by RTA. The samples must have excess Si, and the flash energy should not exceed 40 J/cm2 and 47 J/cm2 for Si0.63C0.37 and Si0.77C0.23 samples, respectively. Under these conditions, FLA succeeds in producing Si NC of a given size in less crystalline SiC than RTA does. This result is discussed in terms of nucleation and crystal growth using classical crystallization theory. For FLA and RTA samples, an opposite relationship between NC size and Si content was observed and attributed either to the dependence of H effusion on Si content or to the optical absorption properties of the materials, which also depend on the Si content.

Optoelectronic properties of ZnO film on silicon after SF6 plasma treatment and milliseconds annealing

Zinc oxide thin film is one of the most promising candidates for the transparent conductive layer in microelectronic and photovoltaic applications, due to its low resistivity and high transmittance in the visible spectral range. In this letter, we present optoelectronic and structural properties of fluorine doped ZnO films deposited at low temperature on a silicon substrate. The fluorine doping was made by post-deposition SF6 plasma treatment and activation by the millisecond range flash lamp annealing. Both the microstructural and optical investigations confirm the formation of a high-quality, highly doped n-type ZnO layer. The current-voltage characteristics show a heterojunction between n+-ZnO and Si. Moreover, it is shown that the SF6 plasma treatment efficiently passivates the surface state and bulk defects in the ZnO film.

Synthesis and characterization of MnAs and MnP nanoclusters embedded in III–V semiconductors

We report on a systematic study of the synthesis and magnetism of hybrid ferromagnetic semiconductors comprised of MnAs and MnP nanoclusters embedded in GaAs and InP matrices, respectively. Samples were prepared by Mn-ion implantation followed by millisecond-range flash lamp annealing. X-ray diffraction and Auger electron spectroscopy results confirm the formation of MnAs nanoclusters of sizes 150 ± 50 nm. Ferromagnetic properties of MnAs:GaAs (MnP:InP) hybrid systems are studied by magnetic force microscopy and superconducting quantum interference device magnetometry. We show that the magnetization at saturation and the ferromagnetic transition temperature , of MnAs:GaAs depend on the Mn-concentration and on the annealing energy density. While in the case of MnP:InP they are independent of the annealing energy density used. Ferromagnetism in such hybrid systems (ferromagnet–semiconductor) above 300 K makes them very attractive for applications in spintronic devices.

Hydrogen engineering via plasma immersion ion implantation and flash lamp annealing in silicon-based solar cell substrates

Higher conversion efficiencies while reducing costs at the same time is the ultimate goal driving the advancement of solar cell development. In this work, solar cell emitters are formed in Si substrates by plasma immersion ion implantation (PIII) of phosphine and posterior millisecond-range flash lamp annealing (FLA). In Si-based solar cells, hydrogen plays a fundamental role due to its excellent passivation properties. The optical and electrical properties of the fabricated emitters will be studied, with particular interest in their dependence on the hydrogen content present in the samples. The influence of different FLA annealing parameters and a comparison with traditional thermal treatments such as rapid thermal annealing (RTA) and furnace annealing (FA) will be presented. The samples treated by FLA at 1200 °C for 20 ms in forming gas show sheet resistance values of the order of 60 Ω/◻, and minority carrier diffusion lengths in the range of ∼200 μm without the use of a capping layer for surface passivation. Those results are significantly better than the ones observed from RTA or FA annealed samples. The simultaneous implantation of hydrogen during the doping process, combined with optimal FLA annealing parameters, gave promising results for the application of this technology in replacing the conventional POCl3 deposition and diffusion.