Wide bandgap GaN/AlGaN/GaN/SOI high-electron-mobility transistors (GaN/Si HEMTs) have recently grabbed interest in the semiconductor field as outstanding contenders for microwave and radio-frequency (RF) power amplification systems with their powerful capacities. Though the negative threshold voltage (Vth) property of GaN limits the practical application as an electronic system for static power consumption consideration, the current study demonstrates a novel method that can adjust Vth higher and without damaging the crystal lattice of the GaN channel materials by self-assembly monolayer doping. Also, the fabricated GaN/AlGaN/GaN/SOI HEMT devices exhibit excellent efficiency with enhancement of mobility and subthreshold slope in cryogenic temperatures using Fluorine-contained monolayer doping. This could unlock additional process options for the development of next-generation GaN/AlGaN/GaN/SOI HEMT with high mobility, catering to the advancements in 6G communication and circuits for low-orbit satellites.
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