MEMS Thermal Shear Stress Sensor Research Articles

A parametrized three-dimensional model for MEMS thermal shear-stress sensors

This paper presents an accurate and efficient model of MEMS thermal shear-stress sensors featuring a thin-film hotwire on a vacuum-isolated dielectric diaphragm. We consider three-dimensional (3-D) heat transfer in sensors operating in constant-temperature mode, and describe sensor response with a functional relationship between dimensionless forms of hotwire power and shear stress. This relationship is parametrized by the diaphragm aspect ratio and two additional dimensionless parameters that represent heat conduction in the hotwire and diaphragm. Closed-form correlations are obtained to represent this relationship, yielding a MEMS sensor model that is highly efficient while retaining the accuracy of three-dimensional heat transfer analysis. The model is compared with experimental data, and the agreement in the total and net hotwire power, the latter being a small second-order quantity induced by the applied shear stress, is respectively within 0.5% and 11% when uncertainties in sensor geometry and material properties are taken into account. The model is then used to elucidate thermal boundary layer characteristics for MEMS sensors, and in particular, quantitatively show that the relatively thick thermal boundary layer renders classical shear-stress sensor theory invalid for MEMS sensors operating in air. The model is also used to systematically study the effects of geometry and material properties on MEMS sensor behavior, yielding insights useful as practical design guidelines.

A MEMS multi-sensor chip for gas flow sensing

This paper reports the development of a MEMS multi-sensor chip that enables the simultaneous measurements of shear stress, pressure, and temperature inside microchannels. On the multi-sensor chip, five sensor clusters, which consist of shear-stress, pressure, and temperature sensors, are arranged in a one-dimensional array. The multi-sensor chip has been characterized in a rectangular microchannel using both incompressible and compressible gas flows. A simple normalization method has proven to be effective in the reduction of the sensitivity variation of the shear-stress sensors. It has also been found out that the classical theory for conventional hot-film sensors needs to be modified for the MEMS thermal shear-stress sensors. Furthermore, flow rate measurements based on both differential pressure and thermal anemometry principles have been demonstrated using the multi-sensor chip.

Experiments and simulations of MEMS thermal sensors for wall shear-stress measurements in aerodynamic control applications

MEMS thermal shear-stress sensors exploit heat-transfer effects to measure the shear stress exerted by an air flow on its solid boundary, and have promising applications in aerodynamic control. Classical theory for conventional, macroscale thermal shear-stress sensors states that the rate of heat removed by the flow from the sensor is proportional to the 1/3-power of the shear stress. However, we have observed that this theory is inconsistent with experimental data from MEMS sensors. This paper seeks to develop an understanding of MEMS thermal shear-stress sensors through a study including both experimental and theoretical investigations. We first obtain experimental data that confirm the inadequacy of the classical theory by wind-tunnel testing of prototype MEMS shear-stress sensors with different dimensions and materials. A theoretical analysis is performed to identify that this inadequacy is due to the lack of a thin thermal boundary layer in the fluid flow at the sensor surface, and then a two-dimensional MEMS shear-stress sensor theory is presented. This theory incorporates important heat-transfer effects that are ignored by the classical theory, and consistently explains the experimental data obtained from prototype MEMS sensors. Moreover, the prototype MEMS sensors are studied with three-dimensional simulations, yielding results that quantitatively agree with experimental data. This work demonstrates that classical assumptions made for conventional thermal devices should be carefully examined for miniature MEMS devices.