MEMS Inspection Research Articles

Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization.

A micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive. However, effective inspection and characterization metrology systems are needed to ensure the functional reliability of MEMS. This study presents a system based on digital holography as a tool for MEMS metrology. Digital holography has gained increasing attention in the past 20 years. With the fast development and decreasing cost of sensor arrays, resolution of such systems has increased broadening potential applications. Thus, it has attracted attention from both research and industry sides as a potential reliable tool for industrial metrology. Indeed, by recording the interference pattern between an object beam (which contains sample height information) and a reference beam on a CCD camera, one can retrieve the quantitative phase information of an object. However, most of digital holographic systems are bulky and thus not easy to implement on industry production lines. The novelty of the system presented is that it is lens-less and thus very compact. In this study, it is shown that the Compact Digital Holographic Microscope (CDHM) can be used to evaluate several characteristics typically consider as criteria in MEMS inspections. The surface profiles of MEMS in both static and dynamic conditions are presented. Comparison with AFM is investigated to validate the accuracy of the CDHM.

Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization

A micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive. However, effective inspection and characterization metrology systems are needed to ensure the functional reliability of MEMS. This study presents a system based on digital holography as a tool for MEMS metrology. Digital holography has gained increasing attention in the past 20 years. With the fast development and decreasing cost of sensor arrays, resolution of such systems has increased broadening potential applications. Thus, it has attracted attention from both research and industry sides as a potential reliable tool for industrial metrology. Indeed, by recording the interference pattern between an object beam (which contains sample height information) and a reference beam on a CCD camera, one can retrieve the quantitative phase information of an object. However, most of digital holographic systems are bulky and thus not easy to implement on industry production lines. The novelty of the system presented is that it is lens-less and thus very compact. In this study, it is shown that the Compact Digital Holographic Microscope (CDHM) can be used to evaluate several characteristics typically consider as criteria in MEMS inspections. The surface profiles of MEMS in both static and dynamic conditions are presented. Comparison with AFM is investigated to validate the accuracy of the CDHM.

Micromachined array-type Mirau interferometer for parallel inspection of MEMS

We present the development of an array type of micromachined Mirau interferometers, operating in the regime of low coherence interferometry (LCI) and adapted for massively parallel inspection of MEMS. The system is a combination of free-space micro-optical technologies and silicon micromachining, based on the vertical assembly of two glass wafers. The probing wafer carries an array of refractive microlenses, diffractive gratings to correct chromatic and spherical aberrations and reference micro-mirrors. The semitransparent beam splitter plate is based on the deposition of a dielectric multilayer, sandwiched between two glass wafers. The interferometer matrix is the key element of a novel inspection system aimed to perform parallel inspection of MEMS. The fabricated demonstrator, including 5 × 5 channels, allows consequently decreasing the measurement time by a factor of 25. In the following, the details of fabrication processes of the micro-optical components and their assembly are described. The feasibility of the LCI is demonstrated for the measurement of a wafer of MEMS sensors.

Review of MEMS metrology solutions

This paper serves as a review of current solutions for MEMS metrology. This survey provides an extensive and in-depth review of the current tools and their fundamental limitations. Techniques that are reviewed include tools that are extensions of semiconductor tools, scaled down versions of conventional metrology tools and entirely novel methods for MEMS inspection.