Mechanical Strength Of Solder Joints Research Articles

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

PurposeAs the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.Design/methodology/approachThe present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.FindingsTypical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.Originality/valueIn addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip Technology

Abstract In flip chip assembly, the smaller solder ball is used in chip and substrate joint. This may have an adverse influence on the reliability of electronic products. Thus, the mechanical strength of solder joint is an important topic for the major reliability in electronic assembly technology. We found the intermetallic compound (IMC) crack issue for Electroless Ni(P) / Electroless Pd(P) / Immersion Au (ENEPIG) Interposer product. In this study, we analyzed the failure samples, for ENEPIG processes verified to find out the IMC crack root cause. The interposer pad structure for these samples was manufactured by ENEPIG process, in which the formation of the oxidation layer is affected by the duration that the sample is exposed on top of Ni bath. These samples print solder paste were performed multi-times reflow for ENEPIG and solder interfacial reaction observation to clarify the nickel oxidation influence on crack issue. These samples were observed and analyzed by Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), Transmission Electron Microscope (TEM), and Energy-Dispersive X-ray Spectroscopy (EDX). The interface strength between ENEPIG and solder were tested by hot bump pull test (HBP), and also has the adhesion analysis. The results show that with the shorter exposure on top of nickel bath is no nickel oxidation formed and the interface has a higher pull strength, with a longer exposure on top of nickel bath had more nickel oxidation formed in the ENEPIG interface and also reveal lower pull strength. Therefore, the IMC crack was induced by the void at ENEPIG interface, which was the reaction of nickel oxidation and Au chemical, and the control of the exposure time on top of nickel bath can inhibit the oxidation formation to reduce the IMC crack risk.

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

PurposeThe purpose of this paper is to evaluate the influence of solder powders sizes applied in soldering materials used for Package-on-Package (PoP) system manufacture as well as other factors on reliability and mechanical strength of created solder joints in three-dimensional (3D) PoP structures.Design/methodology/approachThe design of experiments based on the Genichi Taguchi method were used in the investigation. The main factors covered different printed circuit board (PCB) coatings, soldering materials with solder powders sizes from Types 3 to 7 and soldering profiles. The reliability of 3D PoP structures was determined by measurements of resistance of daisy-chain solder joints systems during thermal shocks (TS) cycles. The mechanical strength of solder joints in 3D PoP structures was determined by measurements of a shear force of “Top” layer of 3D structures at T0 and after 1,500 TS. The ANOVA was used for results assessment.FindingsThe size of solder powders applied in soldering materials had small (10 per cent) influence on mechanical strength of solder joints in 3D PoP structures. Small size of solder powder had positive effect on solder joints reliability in 3D PoP structures. Especially important was the selection of solder paste for “Bottom” layer of 3D PoP system (influence 17 per cent). Incorrect soldering profile (influence 46 per cent) or wrong selected PCB coating (influence 35 per cent) can very easily reduce the positive impact of soldering materials on solder joints reliability. It was stated that as low as possible soldering profile and organic solderability preservative (OSP) coating in the case of single-sided PCB are the best for 3D PoP structures due to their reliability.Originality/valueThis paper explains how different sizes of solder powders used nowadays in solder pastes influence on reliability and mechanical strength of the solder joints in 3D PoP structures. The contribution, in numerical values, of soldering materials, soldering profile and PCB coating on 3D PoP structures solder joints reliability as well as recommendations improving reliability of 3D PoP structures solder joints were presented.

Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn3 was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn3 transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints.

Mechanical reliability of solder joints in PCBs assembled in surface mount technology

Purpose – The purpose of this paper is to determine the dependence of mechanical strength of solder joints on printed circuit boards from the soldering process parameters and operating conditions of the electronic device. Design/methodology/approach – The research was performed using the Taguchi method of planning of experiments. Evaluation of the quality of solder joints was made on the basis of microscopic observations, X-ray analysis and measurements of shear force of solder joints. Findings – The carried out research has shown the influence of the individual parameters of the soldering process on the mechanical strength of solder joints and the mechanism of damage of solder joints under the influence of shear force. Originality/value – The authors present results of their research using advanced techniques of experimental design and analysis of results. In this study, original approach was used to simulate the operational conditions of electronic devices including thermal imaging technology.

Interfacial Reaction and Mechanical Characterization of Sn–Ag–Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition

The solderability of an Au/Pd(P)/Cu trilayer structure (thickness 0.15 μm/0.6–1.0 μm/20 μm) was investigated by use of a scanning electron microscope equipped with an electron backscatter diffraction system, electron probe microanalysis, and high-speed ball shear (HSBS) testing. Thick Pd(P) deposition, particularly the structure with a Pd(P) thickness of 1.0 μm, resulted in a substantial amount of (Pd,Cu)Sn4 intermetallic compound in the solder matrix after reflow. This phase gradually resettled at the interface and formed a dense layer of (Pd,Cu)Sn4 over (Cu,Pd)6Sn5 during solid-state reaction. A Cu–Pd–Sn isotherm was examined to explain the formation and resettlement of (Pd,Cu)Sn4. The (Pd,Cu)Sn4/(Cu,Pd)6Sn5 dual layer at the interface was a crack initiation site in HSBS testing, and led to substantial degradation of the mechanical strength of solder joints, indicating that thick Pd(P) deposition should be avoided to prevent the Pd-induced embrittlement.

리플로우 시간에 따른 Pb-free 솔더/Ni 및 Cu 기판 접합부의 전단강도 평가

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to investigate the influence of SiC nano-particles addition on the microstructure, thermal behavior, and corresponding mechanical properties of SAC(105) solder alloys. Results show that the addition of SiC nanoparticles into the SAC(105) alloy melt prompts the formation of primary β-Sn phase with small sub-grain size in the solidified structure. The SiC nanoparticles can offer an additional nucleation sites for the formation of refined Ag3Sn and Cu6Sn5 IMCs. The hard SiC particles and refined IMCs with small spacing could obstruct the dislocation slipping and thus, lead to a strong dispersion strengthening mechanism in the composite solder. As a result, the composite SAC(105)/SiC solder displayed a higher ultimate tensile strength and 0.2 % yield strength (0.2 %YS) than that of plain SAC(105) solder. The addition of SiC nano-sized particles can also effectively reduce the undercooling and pasty range, while the melting temperature is maintained at the SAC(105) level, indicating that the novel composite solder is fit for existing soldering process.

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

Intermetallic compound formation at the interface between Sn-3.0Ag-0.5Cu (SAC) solders and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish and the mechanical strength of the solder joints were investigated at various Pd thicknesses (0 μm to 0.5 μm). The solder joints were fabricated on the ENEPIG surface finish with SAC solder via reflow soldering under various conditions. The (Cu,Ni)6Sn5 phase formed at the SAC/ENEPIG interface after reflow in all samples. When samples were reflowed at 260°C for 5 s, only (Cu,Ni)6Sn5 was observed at the solder interfaces in samples with Pd thicknesses of 0.05 μm or less. However, the (Pd,Ni)Sn4 phase formed on (Cu,Ni)6Sn5 when the Pd thickness increased to 0.1 μm or greater. A thick and continuous (Pd,Ni)Sn4 layer formed over the (Cu,Ni)6Sn5 layer, especially when the Pd thickness was 0.3 μm or greater. High-speed ball shear test results showed that the interfacial strengths of the SAC/ENEPIG solder joints decreased under high strain rate due to weak interfacial fracture between (Pd,Ni)Sn4 and (Cu,Ni)6Sn5 interfaces when the Pd thickness was greater than 0.3 μm. In the samples reflowed at 260°C for 20 s, only (Cu,Ni)6Sn5 formed at the solder interfaces and the (Pd,Ni)Sn4 phase was not observed in the solder interfaces, regardless of Pd thickness. The shear strength of the SAC/ENIG solder joints was the lowest of the joints, and the mechanical strength of the SAC/ENEPIG solder joints was enhanced as the Pd thickness increased to 0.1 μm and maintained a nearly constant value when the Pd thickness was greater than 0.1 μm. No adverse effect on the shear strength values was observed due to the interfacial fracture between (Pd,Ni)Sn4 and (Cu,Ni)6Sn5 since the (Pd,Ni)Sn4 phase was already separated from the (Cu,Ni)6Sn5 interface. These results indicate that the interfacial microstructures and mechanical strength of solder joints strongly depend on the Pd thickness and reflow conditions.

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Soldering experiments of chip scale package devices were carried out by means of diode laser soldering system with Sn–Ag–Cu solders. In addition, pull tests and a scanning electron microscope were used to analyse the effect of processing parameters on mechanical strength of solder joints. Viscoplastic finite element simulation was utilised to predict solder joint reliability for different package geometry under accelerated temperature cycling conditions. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed soldering time, an optimal power and package geometry exists, while the optimal mechanical properties of microjoints are gained.

Cu Substrates with Different Grain Sizes

Cu 6 Sn 5 and Cu 3 Sn are easily formed at the interface between Sn and Cu during reflow and aging processes. Thick Cu-Sn compounds at the interface become brittle, reducing the mechanical strength of solder joints and increasing the consumption of under bump metallization (UBM). It is noted that intermetallic compound (IMC) growth and substrate consumption are affected by factors such as substrate fabrication, substrate orientation, and substrate microstructure. In this study, to determine the effects of substrate grain size on IMC growth and substrate consumption, pure Sn solder was reflowed on annealed Cu substrates with different grain sizes at 250°C for 30 s to 600 s. It was revealed that Cu substrates with smaller grain sizes exhibited reduced IMC growth. In addition, the interdiffusion coefficients of Cu 6 Sn 5 and Cu 3 Sn were decreased for the Cu substrate with the smaller grain size. The influence of the Cu substrate grain size on IMC growth and substrate consumption is discussed.

The effect of cooling rate on the dendritic spacing and morphology of Ag 3Sn intermetallic particles of a SnAg solder alloy

The size and morphology of intermetallic compounds of Sn–Ag solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to characterize the as-cast microstructure of a Sn–2 wt.% Ag solder alloy, and to correlate the resulting scale of the dendritic matrix and the morphology of the Ag 3Sn intermetallic compound (IMC) with the corresponding solidification cooling rate. Pre-heated low-carbon steel molds and a water-cooled solidification apparatus were used permitting a significant range of solidification cooling rates to be experimentally examined. It is shown that under very slow cooling conditions (0.02 °C/s) the microstructure of the sample is formed by a coarse dendritic matrix and a mixture of fiber and plate-like Ag 3Sn IMC in the interdendritic region with the fibers located along the board line separating the matrix. For cooling rates from 0.15 to 1.15 °C/s a mixture of spheroid and fiber-like IMC and secondary dendrite arm spacings between 15 and 40 μm, with the spheroids located in the center of the interdendritic region. At higher cooling rates, of about 8 °C/s only Ag 3Sn spheroids (of about 0.5 μm in diameter) prevail in the eutectic mixture.

Reliability study of the electroless Ni–P layer against solder alloy

Copper (Cu) has been widely used in the under bump metallurgy of chip and substrate metallization for chip packaging. However, due to the rapid formation of Cu–Sn intermetallic compound (IMC) at the tin-based solder/Cu interface during solder reaction, the reliability of this type of solder joint is a serious concern. In this work, electroless nickel–phosphorous (Ni–P) layer was deposited on the Cu pad of the flexible substrate as a diffusion barrier between Cu and the solder materials. The deposition was carried out in a commercial acidic sodium hypophosphite bath at 85 °C for different pH values. It was found that for the same deposition time period, higher pH bath composition (mild acidic) yields thicker Ni–P layer with lower phosphorous content. Solder balls having composition 62%Sn–36%Pb–2%Ag were reflowed at 240 °C for 1 to 180 min on three types of electroless Ni–P layers deposited at the pH value of 4, 4.8 and 6, respectively. Thermal stability of the electroless Ni–P barrier layer against the Sn–36%Pb–2%Ag solder reflowed for different time periods was examined by scanning electron microscopy equipped with energy dispersed X-ray. Solder ball shear test was performed in order to find out the relationship between the mechanical strength of solder joints and the characteristics of the electroless Ni–P layer deposited. The layer deposited in the pH 4 acidic bath showed the weak barrier against reflow soldering whereas layer deposited in pH 6 acidic bath showed better barrier against reflow soldering. Mechanical strength of the joints were deteriorated quickly in the layer deposited at pH 4 acidic bath, which was found to be thin and has a high phosphorous content. From the cross-sectional studies and fracture surface analyses, it was found that the appearance of the dark crystalline phosphorous-rich Ni layer weakened the interface and hence lower solder ball shear strength. Ni–Sn IMC formed at the interfaces was found to be more stable at the low phosphorous content (∼14 at.%) layer. Electroless Ni–P deposited at mild acidic bath resulting phosphorous content of around 14 at.% is suggested as the best barrier layer for Sn–36%Pb–2%Ag solder.