Mechanical Properties Of Copper Research Articles

Study on the Permeability and Mechanical Properties of Copper Powder/Mesh Porous Plates

Study on the Permeability and Mechanical Properties of Copper Powder/Mesh Porous Plates

Preliminary investigation on the tensile properties of FDM printed PLA/ copper composite

Recently, the rapid manufacturing of custom polymer-based composite components has been revolutionized by the Fused deposition modeling (FDM) process. Understanding the fundamental mechanical behaviours of these FDM-printed components is essential for engineering applications. FDM has been highly used inadditive manufacturing (AM) due to its ability to process complex parts with the lowest cost and accurate dimensions. The materials used are thermoplastic polymers, which are in the form of a filament. The aim of this study is to create testing specimens with varying infill percentages (25%, 50%, and 75%) and infill patterns (rectilinear, honeycomb, grid, concentric, and triangle) using the FDM technique on Polylactic acid (PLA) and PLA/Copper. The specimen is printed in accordance with the ASTM standard for tensile testing, which is ASTM D638. Following that, the mechanical properties of copper are assessed using tensile testing. The results demonstrate that the infill pattern for a triangle PLA/Copper specimen and concentric PLA specimen for 75% infill percentage produced the best performance in tensile strength; meanwhile, the grid copper pattern has the weakest properties among all the patterns. This research will be helpful to enhance the mechanical properties of the products in the electronics applications.

Estimation of the Barocryodeformation Effect on the Microstructure and Mechanical Properties of Copper

Estimation of the Barocryodeformation Effect on the Microstructure and Mechanical Properties of Copper

Estimation of the Barocryodeformation Effect on the Microstructure and Mechanical Properties of Copper

Estimation of the Barocryodeformation Effect on the Microstructure and Mechanical Properties of Copper

Development of the hardness, three-point bending, and wear behavior of self-lubricating Cu-5Gr/Al2O3-Cr3C2 hybrid composites

This research aims to assess the mechanical characteristics of high-performance copper composites made utilizing powder metallurgy. The composites were produced by adding reinforcement elements (Al2O3-Cr3C2) at different rates (3-6–9 wt.%) into copper-graphite (Cu-5Gr) via hot pressing technique. The microstructure, hardness, three-point bending and wear performance were analysed. The results determined that hybrid reinforced composites exhibited higher density, hardness and bending strength compared to Cu-Gr composites. The highest hardness of 73.02 HB was found in the CG-4 (copper graphit-4) sample. The maximum bending stress of 151.06 MPa occurred in sample CG-2. In addition, it was observed that the wear resistance increased significantly with the addition of the hybrid reinforcements. The lowest specific wear rate of 7.961 × 10−7 mm3/N.m occurred in sample CG-6. As a result, 15.92%, 58.16% and 83.21% improvements were achieved in hardness, bending strength and wear performance, respectively. The current work indicates that certain mechanical properties of copper can be improved via the powder metallurgy process and the addition of reinforcements which could expand the applications and use of this metal in different industries.

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Abstract Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Despite its status, it is not without its challenges. Inkjet technology has gained much attention due to its low cost, low-material consumption, and capability for mass manufacturing. The preferred conductive metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given toward photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the electrical and mechanical properties of copper. With the process developed, the resistivity of printed copper was found to be five times the bulk copper. In regards to adhesion to the polyimide film, mechanical shear load to failure was found to be within 15–20 gF. To demonstrate the complete process, commercial-off-the-shelf components are also mounted on the additively printed pads. Statistically, control charting technique is implemented to understand any process variation over long duration of prints.

Mechanical properties of gradient structured copper obtained by ultrasonic surface rolling

In this study, the gradient structure of copper was obtained by ultrasonic surface rolling process, and its effect on the mechanical properties of copper was systematically investigated. The obtained gradient structure comprises a nanocrystalline layer (NL, 60–130 μm in thickness) of equiaxed grains, deformed layer (DL, 40–180 μm in thickness) of deformed grains and center layer (CL) of equiaxed grains. From CL to NL, the grain size decreases from 50 to 0.1 μm. The yield strength of the samples with gradient structure increases by 76% (from 125.53 to 225.32 MPa) and tensile strength increases by 16% (from 240.40 to 257.24 MPa), owing to the combined strengthening effect of fine grains, dislocations, and textures of gradient structure. This study helps to guide the design and optimization of the copper microstructure to improve the comprehensive mechanical properties. • The gradient structure of copper was obtained by ultrasonic surface rolling. • The gradient structure comprises nanocrystalline, deformed, and center layers. • The gradient structure is a key factor correlating to strength and elongation.

Temperature and indenter radius effects on mechanical properties of copper during nanoindentation: a molecular dynamic simulation study

Temperature and indenter radius effects on mechanical properties of copper during nanoindentation: a molecular dynamic simulation study

Numerical modeling and experimental investigation on the effect of rotation speed on microstructural evaluation and mechanical properties of copper during friction stir processing

In the present work, the effect of different parameters of friction stir processing (FSP) on microstructure and mechanical properties of pure copper were investigated numerically and experimentally. Three different tool rotation speed (900, 1200 and 1500 rpm) and a constant traverse speed (60 mm/min) were used as FSP parameters. To model the microstructure of stir zone (SZ) which undergos the dynamic recrystallization (DRX) and grain growth, Zener-Hollomom parameter were used to predict the grain size. In the first step the temperature distribution was formulated and solved by a commercial software COMSOL Multiphysics. An analytical model were then utilized to calculate the strain rate distribution in SZ using MATLAB. Finally, strain rate and temperature were imposed to Zener-Hollomon equation to predict the grain size. The results of modeling indicated that by increasing the rotation speed, the Z parameters decreased and subsequently the grain size increased. The predicted grain size were in a good agreement with the experimental results. The mechanical properties also improved by grain refinement.

The microstructure and mechanical properties of copper in electrically assisted tension

This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from ductile to brittle. With the increase of pulse frequency, the grain size increases, the reduction of cross section decreases firstly and then increases. The increase of temperature due to applying of electropulse is considered as the main reason for the retardation of mechanical property and the change of fracture mode. Copper sulfide is found on the fracture surface, which may be the root cause for the electricity-induced embrittlement. Recrystallization induced by the presence of electricity inhibits the embrittlement and improves the plasticity of material. For undeformed copper, direct electrically assisted forming processing will decrease its plasticity, by contrast, for heavily deformed the copper, electrically assisted forming can reduce the flow stress and improve the plasticity.

Evolution of the Microstructure and Mechanical Properties of Copper during the Rolling–ECAP Process

Evolution of the Microstructure and Mechanical Properties of Copper during the Rolling–ECAP Process

Microstructure and Properties of the Copper Alloyed with Ag and Ti Powders Using Fiber Laser.

The scope of the work covers the development of the relationship between the chemical composition of surface-modified copper and the diffusion of alloy elements as well as the microstructure and mechanical properties. This article presents the impact of laser alloying with titanium and silver powders on the microstructure and mechanical properties of copper. In order to investigate the phenomena occurring during the laser alloying process, microstructural studies were performed using scanning electron microscopy (SEM), optical microscopy, and energy dispersive x-ray spectroscopic (EDS) analysis of the chemical composition in micro-areas. In addition, to test the properties of the resulting alloy, abrasion resistance, hardness measurement at low loading force, and conductivity measurements were performed. As a result of alloying with Ag and Ti powders, three distinct zones were indeed recognized: re-melting zone (RZ), diffusion zone (DZ), and heat affected zone (HAZ). The surface modification that results from laser alloying increases the hardness as well as the abrasion resistance of the material. Overall, it was found that laser alloying with Ti powder increased the strength of the copper surface layer due to the formation of intermetallic phases (Cu3Ti2). It was also found that laser alloying with Ag powder changed the mechanical properties of the surface layer due to the solid solution strengthening.

Influence of Alternating Short-Cycle Bending on the Mechanical Properties of Copper, α-Titanium and the Mild Steel DC01

The influence of alternating bending loads as they occur during roller levelling on the mechanical properties of sheet metals is not yet fully understood. A detailed knowledge of the influence of the commonly used levelling process on the resulting properties of sheet material is needed in particular for the design of subsequent processes with narrow process windows. To investigate the mechanical property changes during loading conditions similar to roller levelling, sheet samples of mild steel DC01, α-titanium and pure copper (CU-DHP) were subjected to alternating bending loads with different amplitudes for up to 9.5 bending cycles. An isotropic hardening behavior according to a Voce description could be shown for the DC01 deep drawing steel with a strong dependence on the load amplitude applied per cycle. A strengthening behavior that depends on the loading amplitude could be observed for α-titanium as well. In contrast, pure copper featured minor changes with a tendency to soften. For all three materials, changes in springback were present after one bending cycle.

Effect of defects on mechanical properties of graphene/copper/h-BN layered composites

Combining two or more materials with different properties, the composites can not only inherit the advantages of the original components, but also play a synergistic effect, and then produce more excellent performance. In this paper, the numerical models of three types of layered composites were established, and then the geometric imperfections (circular and square nanopore) were created in layered composites. By using molecular dynamics method, the mechanical properties of defective layered composites have been studied, and the effects of dimensions, numbers and position of defects on mechanical properties have also been investigated. Finally, the strengthening effects of graphene and other 2D materials on mechanical properties of copper were compared. The results show that the mechanical properties of layered nanostructures generally decrease with the increase in the size of nanoholes. It can be observed that the negative effect of circular nanoholes on mechanical properties of layered nanostructures is weaker than that of square nanoholes. As a result, an important conclusion can be achieved that these hexagonal rings of defective BN/Cu/BN layered nanostructure is easily destroyed and decomposed than that of defective G/Cu/G layered nanostructure. Ultimately, it can be concluded that these nanoholes are best placed in G/Cu/G layered nanostructure when nanoholes are formed in the layered structure.

Considering the use of niobium and titanium to enhance electrical and mechanical properties of copper at higher operational temperature application

Electrical energy transmission materials (cables) are required to have a good combination of high-strength and high electrical conductivity properties, to avoid loss of electrical power between places of production and places of usage. In this study, pure Copper (Cu), Niobium (Nb) and Titanium (Ti) powders of the same purity and particles sizes of 99.0% and − 325 meshes respectively, were used. Niobium and titanium were added to the matrix of pure copper to form the specimens (Cu-2wt% Nb, Cu-5wt% Nb, Cu-2 wt% Ti and Cu-5wt% Ti), were consolidated at sintering temperature of 650 °C by the use of spark plasma sintering (SPS) techniques. Their electrical conductivity, densities, relative densities, hardness, corrosion, wear resistance and microstructure was investigated in this study. The results show that addition of 2 and 5 volume percent of Nb improved the electrical conductivity of Cu at elevated temperature, strength, corrosion and wear resistance of Cu better than that of titanium. Also addition of 2 volume percent of Ti was observed to improve the electrical conductivity of Cu and was stable at elevated temperature just like Cu-2wt% Nb and Cu-5wt% Nb. However, the study revealed that niobium addition to Cu will give better electrical conductivity and mechanical properties improvement than titanium in electrical cables applications.

Enhancing the electrical and mechanical properties of copper by introducing nanocarbon derived from polydopamine coating

Introduction of nanocarbon into metal matrices has shown promising improvement over the base metals. In this study, we examine the effect of a new nanocarbon phase – carbonized polydopamine (cPDA) – on the electrical, thermal, and mechanical properties of sintered copper. The composite samples exhibited better electrical conductivity, thermal diffusivity, hardness and wear resistance. Composites with a low cPDA concentration (0.4 vol%) possessed the best electrical conductivity and mechanical properties, while composite samples with higher cPDA concentrations (3.5 vol %) showed significantly enhanced thermal diffusivity as high as 104.5 mm2/s that is 63.5% higher than the sintered Cu sample.

Evolution of the Microstructure and Mechanical Properties of Copper during the Pressing–Drawing Process

The effect of the new combined rolling–pressing technique of plastic deformation on the structure and mechanical properties of copper has been investigated in this work. The deformation was performed at room temperature and there were three cycles. Rolling–pressing technique was shown to significantly refine the structure of the commercial-purity copper. The strength of the copper workpieces increased by two times after three passes. The ultimate tensile strength and the yield strength increased from 235 to 482 MPa and from 198 to 405 MPa, respectively. The relative elongation and the relative reduction decreased by 8% and 7%, respectively. The ultrafine-grained structure with an average grain size of 2 μm was revealed to be stable to subsequent annealing up to 150°C.

Microstructure and mechanical properties of copper alloyed austempered grey cast iron

ABSTRACTAustempered grey cast iron (AGI) has emerged as a major engineering material in recent years because of its attractive mechanical properties. The main aim of this investigation is to assess the mechanical properties of copper alloyed AGI. Alloyed grey cast iron specimens are subjected to austempering heat treatment at six different temperatures for four different time periods. The resulting microstructures have been evaluated and characterised by means of light microscope and scanning electron microscope and X-Ray diffraction analysis. The microstructural features of AGI such as austenite content and its carbon content have been also found to influence the hardness, tensile properties and elongation. Both duration of the austempering time and the austempering temperature affect the mechanical properties of AGI. The hardness, tensile strength and ductility initially increase, and thereafter it decreases on longer periods of austempering. On the other hand hardness, tensile strength decreases as increasing austempering temperature, while ductility increases. The best combination of hardness 380BHN and strength 332 MPa; observed at 927°C of austenitising and 260°C of austempering temperature for 60 min.

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Equal channel angular pressing (ECAP) not only affects the mechanical properties of pure copper but also the electrochemical behavior of copper. Thus, it would be interesting to perform a comprehensive analysis from a practical perspective. A three-dimensional (3D) simulation is carried out to reveal the strain distribution and field emission scanning electron microscopy (FESEM) is employed to investigate the microstructural evolution of copper in the course of six ECAP passes. It is found that the ECAP must be repeated enough times to bring about a significant grain refinement. This processing route will lead to observation of an ascending trend in all mechanical properties of copper except total elongation. The dislocation density shows the same ascending trend before it becomes saturated at the sixth pass. In order for copper to regain the usual homogeneity with respect to hardness, six ECAP passes are necessary. On the other hand, potentiodynamic polarization tests and electrochemical impedance spectroscopy (EIS) are all employed to understand the electrochemical behavior of ECAPed copper when immersed in 0.1 M NaOH solution. After the sixth pass, copper shows its best passive and protective behavior in this solution. Furthermore, Mott–Schottky analysis indicates that although the passive film of ECAPed copper still behaves as a p-type semiconductor, it becomes less defective or less conductive as the number of applied ECAP passes increase. Consequently, the most stable passive film forms on a copper sample that has gone through six passes of ECAP.

Effect of Brass and Silver on Mechanical Properties of Copper

New innovation has been continuously carried out on alloy base metal with different metals, to know its effectiveness in terms of mechanical properties and the related ones. Copper and copper alloys are extensively used in various applications, due to its excellent electrical, thermal, and corrosion resistance properties. The addition of alloying elements increases the yield strength but reduces the hardness of the material. The current investigation is an attempt to add brass and silver metals in varying small proportion so as to bring about a modification in the strength of the material as well as the hardness of the material. The investigations reveal that the addition of brass and silver to copper, enhances the hardness, yield strength and tensile strength of the material whereas the percentage elongation of the material decreases with increased addition of brass and silver. Investigation of microstructures has been carried out.