Manufacture Of Electronic Components Research Articles

From silicon shield to carbon lock‐in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020)

AbstractTaiwan plans to rapidly increase its industrial production capacity of electronic components while concurrently setting policies for its ecological transition. Given that the island is responsible for the manufacturing of a significant part of worldwide electronics components (including the most advanced CMOS technology nodes), the sustainability of the Taiwanese electronics industry is of critical interest. In this paper, we survey the environmental footprint of 16 Taiwanese electronic components manufacturers (ECMs) using corporate sustainability responsibility reports. Based on data from 2015 to 2020, we find out that the sample of ECMs in this study increased its greenhouse gas emissions by 7.5% per year, its final energy and electricity consumption by 8.8% and 8.9%, and its water usage by 6.1%. We show that the volume of manufactured electronic components and the environmental footprint compiled in this study are strongly correlated, which suggests that relative efficiency gains are not sufficient to curb the overall environmental footprint of ECMs on the island. Given the critical nature of the electronics industry for Taiwan's geopolitics and economics, the observed increase of energy consumption, and the slow renewable energy roll‐out, Taiwan could face a carbon lock‐in situation which will most likely prevent the achievement of carbon reduction goals and sustainability policies on the island.

Line Balancing Study Using Value Stream Mapping Tool on Lean Manufacturing: A Case Study in an Electronic Industry

XY Electronics, a leading international company in electronic components manufacturing, is confronting significant production constraints that adversely affect output, lead times, and operational expenses. This study examines the manufacturing line for product A using Value Stream Mapping to analyze process times and identify bottlenecks where takt times are exceeded. It focuses on areas surpassing production cycle times and aims to enhance line utilization through better line balancing and waste reduction. The results reveal that the header assembly, along with coplanarity and pre-testing 3, are major bottlenecks, which significantly impact productivity. By optimizing task allocation, refining workforce distribution, and employing cross-training, the production line efficiency improved significantly. In addition, strategic workforce reallocation and station optimization were crucial in addressing resource underutilization and enhancing overall operational efficiency

The Influence of Organizational Commitment, Work Environment, Work Discipline, and Motivation on Employee Performance in Manufacturing and Assembly of Electronic Components

This research aims to determine and analyse the influence of Organizational Commitment, Work Environment, Work Discipline and Motivation. This type of research is quantitative with a population of 76 respondents. Questions are given using a questionnaire with the Google Form technique. The data analysis methods used are Descriptive Test, Validity Test, Reliability Test, Classical Assumption Test, Multiple Analysis and Determination (????2). The results of data analysis using multiple regression and hypotheses using the SPSS program and it can be seen that Organizational Commitment has a significant effect on employee performance, Work Environment does not have a significant effect on employee performance, Work Discipline has a significant effect on employee performance, Motivation has a significant effect on employee performance, and systematic testing Simultaneously shows that Organizational Commitment, Work Environment, Work Discipline and Motivation have a significant effect on Employee Performance.

Development of electroforming technology for flexible metal substrates for high-efficiency double-sided electronic devices

In this study, we investigate a novel material that surpasses conventional concepts used for substrate materials in flexible electronic devices. Unlike traditional materials, this novel material can replace polymers with a metallic substance. This substance is capable of supporting electronic devices on both sides. Our development focuses on a metallic substrate material based on Fe-Ni. This material allows for the implementation of secondary batteries on its extremely flat opposite side through the electroforming method. The Fe (Iron)-Ni (Nickel) material produced by electroforming shows superior characteristics in terms of coefficient of thermal expansion (CTE) and mechanical properties. This superiority is due to its finer grain size, compared to Fe-Ni produced by the rolling process. Furthermore, when we use the Fe-Ni material to manufacture secondary batteries, it demonstrates equivalent or superior battery characteristics compared to the conventional aluminum (Al) collector material. During thermal shock tests, the Fe-Ni material also shows superior adhesion compared to the traditional Al collector. This advantage is attributed to Fe-Ni's low CTE. Our approach enables the implementation of secondary batteries for power generation on one side and the manufacture of electronic components for power consumption on the other. This creates a new concept for flexible substrate materials.

An Efficient Real-Time Algorithm for Placing Electronic Components on Panel

In this paper, we present an industrial challenge faced by electronic component manufacturers. From each order, the components need to be placed on panels for shipping. Panels incur significant costs. To control expenses, companies are compelled to optimize the placement of components on panels. Every day, thousands of orders have to be shipped. For each order, they have to pack between a hundred and a thousand rectangular electronic components of different sizes on panels with specifications such as free component orientation and tight time constraints. This packaging must be optimized to minimize the number of panels used and associated costs. The industrial challenge lies not only in space optimization but also in the speed of the process, with solutions needing to be found in less than a minute to meet the dynamic and continuous demands of production and shipping.

Structural shifts in the Russian electronics industry

The object of the study is the electronics industry of Russia and its significant structural changes which took place in 2015–2023. The author has points out the general features of electronics industry in Russia, identifies the basic formed structural shifts in the electronics industry and the relationship between them, develops the map of structural mesoshifts for electronics industry and systematizes the data on the significant (from the author’s viewpoint) structural changes in this area of the national economy. The main structural shifts in the contemporary electronics industry of Russia include the transition to the strategies of intensive development of domestic manufacturers of electronic components, voluntary multiple increase in the volume of products positioned as goods of domestic production, forced growth of localization of electronic production, mass promotion of software and hardware complexes to the market as a product. Sustainable development of the companies of electronics industry is identified as the potential emerging structural shift.

Оценка потенциала импортозамещения электронной компонентной базы в Российской Федерации на основе анализа патентных документов

Since 2014, the Russian Federation has been actively supporting import substitution of pro-ducts and technologies in various areas of production. There is no doubt that the technological development and the state security base on electronic technologies primarily. This is due to the fact that they have penetrated into all spheres of our life. For example, computer equipment, control and navigation systems, mobile communications, intelligent energy, telemedicine, electric vehicles and unmanned vehicles, electronic banking transactions are just a short list of industries where electronic components are used. At the same time, the main part of the electronic component base production is currently located abroad, in China, India, Taiwan, etc. Also foreign companies located in China, the USA, India, the UK, Israel, its., own the most of the patents for devices and technologies related to the electronic component base. A significant dependence of the availability of the electronic component base on political factors were revealed by the sanctions restrictions in 2022. And this highlight the urgency of creating and developing national production of various elements of the electronic component base. The number of patents is the objective indicator of the import substitution results. In this paper, the analysis of published patent documents on the most popular passive elements of the electronic component base (resistors, capacitors, inductors) is carried out using the tools of modern patent databases. The dynamics of paten¬ting for passive electronic components in the Russian Federation over 30 years is shown. It was found that import substitution measures had practically no effect on patenting in the production of passive electronic components. The comparison of the number of Russian patent owned by domestic patent holders and by foreign companies is carried out. High potential technology domains for development have been identified. It is established that Russian manufacturers of passive electronic components have a significant potential for patenting their developments.

Experimental analysis of Algerian diatomaceous earth aimed at silicon extraction

Silicon, primarily derived from silica, plays a crucial role in creating glass, ceramics, and heat-resistant materials, making it indispensable across various industrial sectors. Moreover, it is fundamental in the manufacturing of semiconductors and electronic components. The main goal of our project is to study diatomite, particularly from Algerian deposits, such as western diatomite in order to extract silicon to achieve this, we will conduct experiments using electron microscopy and X-Ray Diffraction (XRD). These analyses highlight the significance of chemical methods in silicon extraction. Our focus is primarily on improving our study by examining the impact of various parameters, notably the use of acid cleansings, on the final product. These parameters are chosen based on the complex chemical reactions governing the aggregation of silica particles in the solution.

Surface and structural modification of HCl-doped poly(MT-co-3-BA) copolymer and the feasibility study of humidity sensor

ABSTRACT A new series of copolymers was synthesized through aqueous chemical oxidative polymerization, using m-toluidine and 3–3-bromoaniline as monomers. Various characterization techniques were employed to analyze the synthesized copolymer nanocomposite. The nanocomposite exhibited solubility in Dimethylformamide (DMF), Tetrahydrofuran (THF), Dimethyl sulfoxide (DMSO), and N-Methylpyrrolidone (NMP). The presence of π–π* and n–π* transitions, responsible for conjugation in the polymer backbone, was confirmed by absorption peaks observed at 357 and 602 nm. The FTIR spectra indicated the presence of benzenoid and quinoid rings, while the XRD pattern suggested an amorphous nature of the polymer. SEM imaging revealed agglomerated particles with smooth surfaces, along with one-dimensional fiber-like or tubular growth and a layered structure. The electroactive study of the composite confirmed its semiconducting nature, with a conductivity range of 6.46 × 10–3 to 2.40 × 10–5 S/cm. These findings suggest that the synthesized copolymer can serve as a promising material for the manufacturing of electric and electronic components in the sensor field.

Oxide-Halide Perovskite Composites for Simultaneous Recycling of Lead Zirconate Titanate Piezoceramics and Methylammonium Lead Iodide Solar Cells.

Global concerns over energy availability and the environment impose an urgent requirement for sustainable manufacturing, usage, and disposal of electronic components. Piezoelectric and photovoltaic components are being extensively used. They contain the hazardous element, Pb (e.g., in widely used and researched Pb(Zr,Ti)O3 and halide perovskites), but they are not being properly recycled or reused. This work demonstrates the fabrication of upside-down composite sensor materials using crushed ceramic particles recycled from broken piezoceramics, polycrystalline halide perovskite powder collected from waste dye-sensitized solar cells, and crystal particles of a Cd-based perovskite composition, C6H5N(CH3)3CdBr3 xCl3(1- x ). The piezoceramic and halide perovskite particles are used as filler and binder, respectively, to show a proof of concept for the chemical and microstructural compatibility between the oxide and halide perovskite compounds while being recycled simultaneously. Production of the recycled and reusable materials requires only a marginal energy budget while achieving a very high material densification of >92%, as well as a 40% higher piezoelectric voltage coefficient, i.e., better sensing capability, than the pristine piezoceramics. This work thus offers an energy- and environmentally friendly approach to the recycling of hazardous elements as well as giving a second life to waste piezoelectric and photovoltaic components.

Status of SOC Development at Chaozhou Three-Circle

Chaozhou Three-Circle (Group) Co., Ltd. (CCTC) is a leading company in developing and manufacturing of electronic and ceramic components. Since more than 19 years ago, CCTC has been focusing on SOFC R&D and manufacturing, covering the complete value chain from powder to power. Based on anode-supported cell technology (ASC in fuel cell mode), the latest C2-stack in planar design using metallic interconnect exhibits a high efficiency of more than 69% (DC, LHV) at 1.5 kW. Long-term stack tests using pipeline natural gas have been conducted for 20,000 hours, with low degradation rates of below 0.4%/kh. In 2022, several 35 kW SOFC CHP systems were demonstrated with C2 stacks, which showed stable performance over 3,000 hours of operation. According to the verification test by Societe Generale de Surveillance S.A., the net AC efficiency of the system reached 64.1%, and the total efficiency was up to 91.2% after 1,000 hours of continuous operation. In parallel to the continuous progressing in SOFC, optimization in cells and stack designs dedicated for SOEC applications were also conducted in recent years. The status of both SOFC and SOEC development at CCTC will be presented.

Inkjet-based bioprinting for tissue engineering

Inkjet bioprinting, a derivative of traditional inkjet technology, is gaining recognition in the fields of life sciences and tissue engineering due to its ability to produce picoliter volume droplets at high speeds in a non-contact fashion. This method has impressively evolved from enabling the production of 2-dimensional (2D) prints to complex 3-dimensional (3D) structures, and is increasingly being used in the manufacturing of electronic components. More recently, this technology has been effectively adapted for a variety of medical applications, such as cell patterning, scaffold construction, and 3D tissue fabrication. In this review, we delve into the principles and biological uses of inkjet technology. We provide an in-depth discussion on the latest developments in inkjet bioprinting, with a focus on cell patterning and 3D fabrication of tissue models, including multilayered lung, bladder, and skin. We also explore the potential of high-throughput 3D-bioprinted tissue models in toxicology and drug efficacy testing.

Exact methods for the Oven Scheduling Problem

The Oven Scheduling Problem (OSP) is a new parallel batch scheduling problem that arises in the area of electronic component manufacturing. Jobs need to be scheduled to one of several ovens and may be processed simultaneously in one batch if they have compatible requirements. The scheduling of jobs must respect several constraints concerning eligibility and availability of ovens, release dates of jobs, setup times between batches as well as oven capacities. Running the ovens is highly energy-intensive and thus the main objective, besides finishing jobs on time, is to minimize the cumulative batch processing time across all ovens. This objective distinguishes the OSP from other batch processing problems which typically minimize objectives related to makespan, tardiness or lateness. We propose to solve this NP-hard scheduling problem using exact techniques and present two different modelling approaches, one based on batch positions and another on representative jobs for batches. These models are formulated as constraint programming (CP) and integer linear programming (ILP) models and implemented both in the solver-independent modeling language MiniZinc and using interval variables in CP Optimizer. An extensive experimental evaluation of our solution methods is performed on a diverse set of problem instances. We evaluate the performance of several state-of-the-art solvers on the different models and on three variants of the objective function that reflect different real-life scenarios. We show that our models can find feasible solutions for instances of realistic size, many of those being provably optimal or nearly optimal solutions.

Status of SOC Development at Chaozhou Three-Circle

Chaozhou Three-Circle (Group) Co., Ltd. (CCTC) is a leading company in development and manufacturing of electronic and ceramic components. CCTC has been focusing on SOFC R&D and manufacturing since 2004, covering the complete value chain from powder to power. Based on anode-supported cell technology (ASC in fuel cell mode), the C2-stack in planar design using metallic interconnect exhibits a high efficiency of more than 69% (DC, LHV) at 1.5 kW. Long-term stack tests using pipeline natural gas have been conducted for 20,000 hours, with low degradation rates of below 0.4%/kh.

Memsift helps recover nickel from semiconductor industry wastewater

Membrane distillation technology developed by Memsift Innovations Pte Ltd is set to be used in Singapore to recover nickel from industrial effluent produced during the manufacture of electronic components.

Laser powder bed fusion of Alumina/Fe–Ni ceramic matrix particulate composites impregnated with a polymeric resin

Additive Manufacturing (AM) plays a key role in meeting the vital demands of Industry. The AM industry needs the range of applicable materials to be expanded by conducting research on novel ones. In the present investigation, alumina/Fe–Ni (steel) ceramic matrix particulate composite was fabricated employing laser powder bed fusion (LPBF) additive manufacturing (AM) technology. The quality of the printed samples was associated with the LPBF process parameters, which were optimized for this process. In general, the fabricated samples showed a microstructure of alumina matrix with uniform distribution of steel (Fe–Ni) particles. The as-printed samples exhibited pores. Thus, they were subjected to a sintering heat treatment cycle under an inert atmosphere. Although the sintering cycle considerably increased the average Vickers hardness, pores were not eliminated entirely. Therefore, polymer impregnation of the as-sintered samples was carried out to reduce porosities and microcracks. The mercury porosimeter showed that the porosity decreased sequentially after sintering and polymer impregnation. In addition, mechanical investigations revealed that the polymer impregnation improved the compressive strength of the sintered samples (from 56 to 120 MPa). Alumina-based materials find wide applications in various fields, including the manufacturing of electronic components, cutting tools, biomedical implants, and catalyst converters, owing to their low density, high hardness, wear and corrosion resistance, and biocompatibility. This study presents a viable approach for the fabrication of these materials, with developed samples exhibiting promising properties. The study emphasizes the potential of additive manufacturing as an approach for the fabrication of ceramic matrix composites reinforced with metallic particulates in future research.

Root cause prediction for failures in semiconductor industry, a genetic algorithm–machine learning approach

Failure analysis has become an important part of guaranteeing good quality in the electronic component manufacturing process. The conclusions of a failure analysis can be used to identify a component’s flaws and to better understand the mechanisms and causes of failure, allowing for the implementation of remedial steps to improve the product’s quality and reliability. A failure reporting, analysis, and corrective action system is a method for organizations to report, classify, and evaluate failures, as well as plan corrective actions. These text feature datasets must first be preprocessed by Natural Language Processing techniques and converted to numeric by vectorization methods before starting the process of information extraction and building predictive models to predict failure conclusions of a given failure description. However, not all-textual information is useful for building predictive models suitable for failure analysis. Feature selection has been approached by several variable selection methods. Some of them have not been adapted for use in large data sets or are difficult to tune and others are not applicable to textual data. This article aims to develop a predictive model able to predict the failure conclusions using the discriminating features of the failure descriptions. For this, we propose to combine a Genetic Algorithm with supervised learning methods for an optimal prediction of the conclusions of failure in terms of the discriminant features of failure descriptions. Since we have an unbalanced dataset, we propose to apply an F1 score as a fitness function of supervised classification methods such as Decision Tree Classifier and Support Vector Machine. The suggested algorithms are called GA-DT and GA-SVM. Experiments on failure analysis textual datasets demonstrate the effectiveness of the proposed GA-DT method in creating a better predictive model of failure conclusion compared to using the information of the entire textual features or limited features selected by a genetic algorithm based on a SVM. Quantitative performances such as BLEU score and cosine similarity are used to compare the prediction performance of the different approaches.

Japanese business communication practices in Thailand: tales from an electronic components manufacturer

PurposeThis article reviews the practice of horenso (a mnemonic for hokoku/reporting, renraku/informing and sodan/consulting) – an under-documented Japanese communication methodology – at a Japanese-owned subsidiary in Thailand. It draws on a number of cultural theories to explore how horenso was influenced by the non-biculturality of individuals at a multinational corporation.Design/methodology/approachThis article draws on first-hand interviews with staff of varying responsibilities at a multinational electronic components manufacturer, Spin-eTech (a pseudonym) to understand how horenso has been utilized and perceived at this Japanese-owned subsidiary in Thailand differently from its original form and traditional use at its headquarters in Japan. This was a targeted case that captured the real time communication difficulties at the workplace.FindingsThe themes of horenso's rationale, motivation, style of communication, use for problem solving, information reporting, relation to superiority and culture of communication emerged as prominent differences for how horenso was practiced at the Thai subsidiary.Originality/valueUsing the emic perspective of cultural understanding, insights are offered into the impact of non-biculturality within the Asia Pacific region on the practice of horenso to extant knowledge on the under-explored “eastern vs eastern” cultural differences.

Comparative analysis of CLPHP working with binary mixtures in different concentrations

The advanced technologies in design and manufacturing of electronic components have resulted considerable heat flux through component miniaturization. For highly performing microelectronic devices production, thermal management has the priority. Other applications also like material science, fabrication technology, solar applications etc. which directly impact cost, reliability and performance. When it comes to overcome these problems efficient cooling approaches development and use will come into play. The best solution for this is Pulsating heat Pipe (PHP). A simple PHP is a two-phase heat transfer device consists of a tube with a suitable working fluid, along with an evaporator (heating)section, adiabatic section and a condenser (cooling)section. In the present work multi turn Closed Loop Pulsating Heat Pipe (CLPHP) is chosen with capillary dimensions. The experimentation is carried out with different working fluids viz. water, water-based mixtures (75%-25%) at different volumetric fill ratios 50%,60% and 75%. The heat inputs of20W, 40 W, 60 W, 80 W, 100 W applied. At various heat inputs for all the working fluids the variation of thermal resistance is plotted and observed that upon increasing heat input, thermal resistance of fluid decreases. Comparative study is also presented for same experimental setup when the binary mixtures are considered in 50%-50% as mixture concentration. This gives the better understanding of Closed Loop Pulsating Heat Pipe performance when operated at different fill ratios and concentrations for different working fluids considered.

EXPERIMENTAL DETERMINATION OF THE TRANSFER FUNCTION FOR PRESSURE SENSORS

Although the manufacturers of various electronic components, including pressure sensors, provide us with their operating characteristic, it is necessary to establish it accurately. In this context, the paper presents the results obtained following the design and construction of an experimental laboratory stand intended for the experimental determination of the operating characteristics of differential pressure sensors.