Board Manufacturing Research Articles

Wideband 2×2 antenna-in-package based on magneto-electric dipole array antenna for 5G mmWave applications

This paper presents an antenna-in-package (AiP) design realised with the conventional multi-layer printed circuit board manufacturing method. The design consists of a wideband 2×2 magneto-electric dipole array antenna operating from 24.25−29.5 GHz and a wideband transition from the analogue beamformer integrated into the proposed MED array antenna (IMED). The IMED array antenna has been fabricated with two distinct NXP analogue beamformer chips, i.e., MMW 9004 KC and MMW 9002 KC covering the N257 and the N258 band, respectively. The measured effective isotropic radiated power at P1dB was 35.3 dBm and 35.1 dBm for the IMED with the MMW 9004 KC and the MMW 9002 KC analogue beamformer chip, respectively. Our proposed antenna demonstrates the feasibility of designing a single wideband AiP that can be integrated with different analogue beamformers operating within the frequency band of the proposed antenna. This is true, provided the RFIC used for integration has the same footprint for RF ports, serial peripheral interface control ports, and DC power supply ports. The primary benefit of the proposed technique is the design antenna can adapt the operating frequency to different frequency standards by incorporating additional analogue chips without increasing the design complexity. This feature enables the antenna manufacturer to tailor the antenna products to different frequency standardisations depending on where the antenna will be employed. The AiP operates at 5G millimeter-wave (mmWave) frequencies, with the potential for Internet of Things applications. Furthermore, from our simulation results, the proposed IMED can potentially be extended as a phased array antenna with 2D scanning.

P-359 EVALUATION OF EXPOSURE TO LOW DOSES OF LEAD IN THE CIRCUIT BOARD MANUFACTURING INDUSTRY

P-359 EVALUATION OF EXPOSURE TO LOW DOSES OF LEAD IN THE CIRCUIT BOARD MANUFACTURING INDUSTRY

Analysis and Design of Engraving Machine Movement

CNC routers play a significant role in several markets such as furniture design, circuit board manufacturing, plastic and foam fabrication. It can allow to complete projects in few hours that used to take several days CNC routers can work on sheets of woods, plastic, rubber, acrylics, and non-ferrous metal and CNC router machine moves and cuts in three directions using computer aided design software.A computer program has been established to design the power screws of any engraving machine. The power required to cut material was calculated by the program. The resisting force was analyzed and all stresses act on the power screws. The power screws were designed by using the main common theory of failures. The buckling and maximum deflection was checked in this program.An example of the output results was designed and drawn in Advanced Centre of Technology using solid works software. The nut connected to the screws was also drawn. The parts of engraving machine have been manufactured and tested in Advanced Centre Technology A.C.T in Libya.

Recycling Possibilities of Wood-Cement Particle Board Manufacturing Waste

Wood-cement particle boards are gaining popularity within construction materials as they combine natural fiber architectural value with Portland cement durability. The production of the material is associated with processing the produced fiberboards, which includes cutting, grinding, and polishing. The remaining wood-cement dust residues are classified as production waste, which is now deposited in the dump and gives extra expenditure for the enterprise. The utilization of wood-cement dust would also benefit the circular economy and reduce the environmental impact of the production process. Two scenarios are analyzed in this research, and the life cycle assessment (LCA) tool with SimaPro software is compared. The first scenario is associated with the partial replacement of Portland cement with wood-cement dust powder. The second scenario offers re-activation of the wood-cement dust at 450 °C to obtain binder properties. Both materials' mechanical strength is comparable, reaching 10 MPa after 28d curing. To maintain target strength, 70 % of Portland cement can be replaced. To produce 1 t of binder by heating at 450 °C, 1.2 t of wood-cement dust is needed as natural moisture evaporates, and wood dust particles go through pyrolysis, giving extra heat and CO2 emissions as well. LCA results indicate the 70% replacement of Portland cement reduces CO2 emissions from 597 kg of CO2/ton of CEM II/A-LL 42,5 to 179 kg of CO2/ton, while the second scenario is associated with high energy consumption during burning of the binder and increased CO2 value due to fossil fuel consumption and CO2 release from burning organic compounds in the material.

Big data analytics for quality variation over work shifts in manufacturing systems

ABSTRACT In the manufacturing industry, mass production enables manufacturers to produce parts with high precision and lower costs. Multiple shifts operate production processes to maximize efficiency. Several researches have been conducted on the impact of shift work on labor’s health and habits. However, there have been few studies on the influence of shift work on the consistency of product quality. This paper provides a methodology to analyze the impact of different work shifts in a real electronic board manufacturing industry. The study uses big data and analytics to assess product quality from data. Non-parametric kernel density estimation is used to approximate the distribution of good products in each work slot. Then several metrics are used to measure the dissimilarity between the estimated densities. The approach can be leveraged in various problems related to process performance and quality. The obtained results show that there is no significant difference in terms of product quality between work shifts. These prove the consistency of the manufacturing processes and the homogeneity of performance across work shifts in the studied factory. Compared to the literature, the paper presents the first quantitative analysis to compare production process performance and product quality over shift works.

Physical and Mechanical Properties of Particleboard from Petung Bamboo-waste using Eco-friendly Chitosan-starch Adhesive

The effect of starch addition in chitosan adhesive on the physical and mechanical properties of petung bamboo particleboard from bamboo-sawing waste was investigated in this work. The utilization of bamboo-sawing waste particles as a raw material for particle board manufacturing has been gaining attention due to its waste reduction potential and economic advantages. The results of this study indicated that starch has been proven to enhance the physical and mechanical properties of petung bamboo particleboard. Adding only 4% wt. of chitosan/starch adhesive with a chitosan/starch ratio of 7/3 (w/w) has resulted in an improvement in the physical properties of the particleboard, such as moisture content, thickness swelling, and water absorption. It has also enhanced the mechanical properties of the particle board, including modulus of elasticity (MOE), modulus of rupture (MOR), and internal bonding (IB), in comparison to chitosan adhesive without starch addition. Overall, these findings provide insights for further developing chitosan/starch adhesive, especially to produce natural-based adhesives with good bonding quality.

Dual-band flexible metamaterial absorber working in 5G band

This article presents a thin and flexible artificial electromagnetic absorber with two absorption peaks at frequencies of 28 and 39 GHz for 5G communication. Copper and a flexible FR4 substrate are used in a pyramid-shaped layered configuration, achieving absorption rates exceeding 99% at 28 and 39 GHz. The thickness of the proposed structure is only 0.34 mm, which is ∼1/32 and 1/23 of the corresponding free-space wavelengths at the absorption frequencies. Due to its symmetric structure, the absorber is polarization-insensitive. Furthermore, the proposed structure exhibits over 90% absorption within the incident angle range of −45° to 45°. To investigate its absorption mechanism, the electric field and magnetic field distributions at the absorption frequencies were analyzed. Then a 150 × 150 mm2 sample was fabricated using printed circuit board manufacturing techniques. This sample was placed on flat or curved surfaces and tested under normal or oblique incidences. The experimental results were consistent with the simulated results, confirming the feasibility of the design. This absorber can be applied in 5G communication and millimeter-wave imaging.

Pemanfaatan Serabut Kelapa dan Abu Ampas Tebu Sebagai Substitusi Fiberglass dan Semen Pada Pembuatan GRC Board

In a construction project, the use of partition walls can cost quite a lot due to the high cost of raw materials used in partition walls. But unfortunately in the manufacture of GRC boards still use materials that are not environmentally friendly such as fiberglass (fiber fiber). Coconut fibers were used as additives because they have high tensile strength, while bagasse ash is used as a cement substitution to reduce production costs as well as help in reducing the amount of sugar industry waste. This study aims to find out the best mixture variations, density, water absorption,bending strength, hitting firmness, and price comparison. In this study, comparing conventional GRC Board with 3 variations of coconut fiber substitution mixture of 10%, 20%, 30% and bagasse ash 2.5%, 5%, 10% with a total of 48 samples and sizes for constancy tests at 20 cm x 20 cm x 0.6 cm and for flexural strength tests with a size of 10 cm x 10 cm x 0.6 cm. Mechanical testing based on SNI-01-4449-2006. The results of the test proved that the optimal mixture is in GRC Board D (30% coconut fiber and 2.5% bagasse ash) because it can produce better flexural strength and firmness than conventional GRC Board and GRC Board with bagasse ash and coconut fiber is 18% cheaper than conventional GRC Board.

Cork consolidated by hot compression as a viable bio-based alternative to polyolefines in decking boards: A preliminary study

Currently, three classes of materials are used in deck boards production, i.e., wood, plastics and wood polymer composites. Wood is the best choice being bio-based, biodegradable and displaying better mechanical performance, but the environmental concerns deriving from forest depletion make the identification of a new bio-based solution necessary. In this sense, agglomerated cork is promising, being derived from the bark of the oak, but in its native form is not suitable for decking boards production due to low bending properties. The present work proposes a solution to use agglomerated cork in decking board manufacturing by converting its cellular structure in a consolidated one by hot compression. Design of Experiment was used to optimize consolidated cork mechanical properties as a function of the main manufacturing parameters, i.e., time and temperature. The exposure to high temperatures allows cork cell walls welding by developing adhesive properties, but it also induces a strong degradation of polysaccharides. It was discovered that the manufacturing parameters which maximize both flexural and tensile properties are a 180 °C operating temperature and a 31.5 min holding time. These conditions ensure a bending stiffness 40.9% and a bending strength 107.1% higher than the ASTM D6662 minimum requirements.

Pengujian Impak Komposit Berpenguat Pelepah Salak untuk Aplikasi Pembuatan Papan Partikel

Wood is the main substance commonly used in the particle board manufacturing industry. However, the rate of forest destruction that continues to occur makes the availability of wood decrease. Alternative materials to replace wood are needed. The salak frond, the object of this study, is a non-wood material that can manufacture particle board. This study used the full factorial method to see the effect of impact testing by comparing the use of polyester matrix and salak frond powder in particle board specimens. The parameters in this study used variations in oven temperatures of 800, 1000, and 1200 degrees Celsius for 15 minutes and volume ratios between salak frond powder and polyester matrix 80:20, 70:30, and 60:40. From the test results, the highest mechanical properties of impact strength were obtained at a ratio of 70:30 with a temperature variation of 1000 and an average of 15.80 kJ/m2. The lowest value is found in a ratio of 60:40 with a temperature variation of 800 and an average of 6.65 kJ/m2. The test results of this study have exceeded the standard impact strength of particle board on the market, which is 3.201 kJ/m2

Industrial sources of per- and polyfluoroalkyl substances (PFAS) to a sewershed in Ontario, Canada.

Per- and polyfluoroalkyl substances (PFAS) are ubiquitous in the environment despite global regulatory action to restrict their use in industrial processes and products. The objective of this reconnaissance sampling was to understand current industrial use and ongoing sources of PFAS in Ontario. Fourteen PFAS were analyzed in effluents from four sectors: electroplaters, laundry and carpet cleaners, landfills, and circuit board manufacturers that discharge to sewersheds connected to wastewater treatment plants. Maximum concentrations were detected in carpet cleaning wastewater: 79,000ng/L for perfluorohexane sulfonate (PFHxS), 26,000ng/L perfluorooctane sulfate (PFOS), and 9400ng/L perfluorooctanoic acid (PFOA). Total summed PFAS (∑PFAS14) concentrations were highest in laundry and carpet cleaners > electroplaters > landfill leachate > circuit boarders. These results indicate that PFAS continue to be used in select manufacturing and processing facilities and that the elevated levels are associated with past and current uses in commercial products.

The study of High-Density Polyethylene (HDPE) waste utilization into particle board

This research discusses related to one of the processing of waste, especially HDPE waste. HDPE waste is another alternative besides wood to make particle board. HDPE particle board takes advantage of these properties to provide a strong and durable alternative. The use of HDPE particle board provides significant benefits in the context of sustainability and the environment. In the manufacture of particle board in this study there were differences in temperature variations, so the variable in this study was temperature. Sample A has a temperature of 130° and sample B has a temperature of 160°. The particle board is pressed for 20 minutes using a hot press machine using 1 x 1 m molding. Testing of this HDPE particle board includes testing of physical properties, namely in the form of Density and chemical testing in the form of Acidity resistance and Alkalinity resistance. The standards in this study refer to SNI 03-2105-2006 regarding Particle Boards, SNI 01-7201-2006 regarding Plywood and block boards with beautiful paper faces, and ASTM D543. The density test showed a value of 0.90 gr/cm3 in the average sample A and 0.75 gr/cm3 in the average sample A. The results of the ANOVA analysis on the Density test showed that there was a significant difference between each sample and each treatment. the results of the t-Test showed that the treatment of sample A did not meet the standard, while the treatment of sample B met the SNI 03-2105-2006 standard. The acidity and alkalinity resistance were tested visually with the results that the temperature at 130° was more susceptible to reaction than the temperature at 160° Objectives: To find out the result of Density test, Acidity, and Alkalinity resistance of HDPE Particle Board is it already fulfill the standard ; To determine the temperature that has the most significant impact on the performance of HDPE Particle Board. Method and results: 1) Process of making the Particle Board, the process are include material preparation, material weighing, shredding, cleaning, drying, and pressing. 2) Sample Testing, the treatment that used is about variation of temperature. Variable that be used in this study consist of Density, Acidity, & Alkalinity. 3) Data Analysis, by using ANOVA Single Factor and t-Test. Conclusion: The results of Density test by t-Test analysis showed that the treatment of sample A did not meet the standard, while the treatment of sample B already fulfill the SNI 03-2105-2006. In Acidity and Alkalinity resistance there are indicators according to SNI 01-7201-2006 in the form of softening and open cracks in several samples. Density test results show the variable B (160°) is at 0.75 gr/cm3 and already fulfil the standard. Visual test results of Acidity and Alkalinity resistance show the variable B (160°) is more resistant to the effects of acids and bases. So that the optimal variable is at a temperature of 160°.

Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Abstract The dimple of ball grid array (BGA) area with 70 mm × 70 mm size on load board for high performance integrated circuit final test is investigated by shadow moire at first, the dimple of BGA area decreases from 184.3 to 97.1 μm when six additional prepregs with 60 mm × 60 mm size are added at BGA area before hot lamination process. The micromorphology and stress/strain simulation are conducted to improve the coverage and reliability of copper metallization layer in through hole at that BGA area. The microcracks of electroless copper layer at the position of glass fiber and inner layer copper pad, which leads to serious crack after solder float, are well covered by subsequent electroplating copper layer. When the through holes at BGA area with 0.2 mm diameter and 7.0 mm depth are fabricated based on insulating dielectric material used for high-speed signal transmission, the simulation results point out that IT968 is better than M6G for the thermal shock reliability of through hole metallization layer. A load board vehicle with 126 layers and 8.3 mm thickness based on IT968 shows good interconnection structure reliability after 12 times 288°C solder float.

Development of New Bio-Based Building Materials by Utilising Manufacturing Waste

Abstract Over the last decade, research has increasingly focused on reducing the use of natural resources and improving waste management in the construction industry. Various possibilities exist for reducing waste in this sector, ranging from using waste as filler materials to developing new binders and building materials. This study focuses on the development of bio-based building materials using waste from the manufacturing of wood-wool cement boards. The binder and filler materials were obtained from the manufacturing waste and used in this research. The developed materials were tested for their visual appearance, macrostructure, material density, thermal conductivity coefficient and compressive strength. The results showed promising data for the self-bearing bio-based building materials, which had similar thermal properties to other bio-based materials and could be used as thermal insulation materials with a thermal conductivity coefficient of 0.0827–0.1172 W/(mK). The material density of the developed bio-based composites was found to be 430–617 kg/m3. By incorporating manufacturing waste into the production process of bio-based building materials, it becomes evident that overall waste from manufacturing plants can be significantly reduced, and the sustainability aspect of wood-cement board manufacturers can be enhanced.

Predicting Defect Rates of Printed Circuit Board Assemblies: Towards Zero Defect Manufacturing and Zero-Maintenance Strategies

Printed Circuit Boards (PCB) manufacturing is a critical part of volatile supply chains for a wide variety of products and high value assets. PCBs are expected to exhibit zero defects and be subject to zero-maintenance. However low the defect rates, defects are highly disruptive and costly. Such defects can be introduced by a multitude of reasons, including faulty parts or sub-standard manufacturing processes. While sophisticated and dedicated quality inspection systems are typically in place in production environments, they still leave room for erroneous quality control outcomes. Besides in-line or post-production quality inspection, manufacturers can exploit experience gained from historical records of past inspections to predict future defect rates. This paper presents the development of a predictive quality modelling approach, which capitalises on such historical data and domain knowledge, to predict defect rates in new production orders. Employing appropriate encoding of knowledge through data pre-processing and applying regression type of machine learning, the proposed approach is validated on a real case study from an electronics manufacturing company. The developed approach can positively contribute towards optimising consequent maintenance and warranty services and become part of a zero-defect production strategy.

PERFORMANCE CHARACTERISATION OF GUM ARABIC BONDED PARTICLE BOARD MADE FROM RICE HUSK AND CANDLE WAX

Particle boards from wood sources have negative impacts on the environment through deforestation. Binders from synthetic sources are also not economical due to high costs in some parts of the world. Agricultural waste materials like rice husk (RH) and readily available natural binders like gum Arabic (GA) are proposed as alternative component materials in particle board manufacture. This study therefore investigates the engineering performance of gum Arabic bonded particle board made from rice husk and candle wax. RH was kept at a constant 70% in the mixture, CW and GA were alternated at 0/30%, 5/25%, 10/20%, 15/15%, 20/10%, and 25/5 % respectively. The mixture was passed through cold and hot presses with compressions to produce particle board samples. The samples were micro-characterised using scanning electron microscopy (SEM) and Energy-dispersive spectroscopy (EDS). The Gum arabic bonded particle board were subjected to various engineering tests. The SEM results showed poor compaction of the material especially as CW content increased. The EDS results showed that caron and silica constituted about 75% of the matrix indicating free of toxic substances. The maximum compressive, flexural and split tensile strengths were 3.88, 0.33 and 1.90 N/mm2 respectively at 10/20% mix even with the lowest density of 565.29 kg/m3. The water absorption and swelling in thickness decreased significantly with increase of CW with values of 2.72 and 0.00% at 25/5 %. The boards may be classified as medium-density since the densities were above 560Kg/m3.

Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits

AbstractHigh‐density interconnect (HDI) technology for liquid metal (LM)‐based stretchable printed circuit boards is crucial for expanding their applicability. HDI technology provides high‐resolution multilayer circuits with a high density of components, as required for next generation of neuroprobes and ultrasonic and sensor arrays. This study presents a HDI technique utilizing laser engraved micro grooves in silicone with a protective lift‐off mask of polyvinyl alcohol (PVA) and subsequent microscale LM particle spray deposition. This approach achieves high‐resolution LM patterns and enables multilayer connectivity and high‐density integration of components simultaneously, that is, realizing HDI technology. It is demonstrated using a stretchable 0201 LED display with a density of six leads per mm2 and a cochlear implant (CI) electrode array. The demonstrated manufacturing of the CI has the potential to enable fully automated printed circuit board manufacturing of such implants with increased precision and throughput. Implants in guinea pigs show that the CI is capable of activating the auditory neuron with electrical auditory brainstem response (eABR) and electrical compound action potential (eCAP) of high quality. Moreover, the U‐shaped cross section of the LM interconnects provides a higher mechanical shock resistance of the circuit than that of normal rectangular cross sections.

On the Issue of Determining the Modulus of Elasticity of Bamboo Moso Under Tension

Introduction. A large number of works devoted to the research of physical and mechanical properties of bamboos, methods of nodal connections of bamboo rods are indicated. The main "bamboo" countries in which bamboo is gaining popularity as a structural material in the modern construction industry are listed. With the development of modern processing technologies, bamboo is widely used in the construction industry, including in the manufacture of slabs and boards, as well as in the decoration and interior decoration of rooms in Oriental style. The results of studies of the physical and mechanical properties of various types of bamboos conducted by scientists from different countries are currently combined into three ISO editions concerning building codes and rules for the use of bamboos in construction.Materials and Methods. Consideration of the macrostructure of bamboo allows us to characterize the high mechanical properties inherent in natural and artificial polymers. Such an approach to the consideration of bamboo and wood as natural polymers makes it possible to use methods applied to the testing of wood and structural plastics in determining the mechanical characteristics of bamboo. Two series of samples of five pieces each were made. Tables of geometric characteristics of the cross-section of the samples are compiled. A constructive solution is proposed related to the reinforcement of the sample blades with an epoxy composition in order to increase the reliability of securing the samples in the grips of the test rig.Results. To determine the elastic modulus of bamboo under tension, an experimental setup consisting of two grips in which the test sample is placed has been developed and manufactured. Through the lower gripper, the test load is applied by means of a steel rod with a loading platform on which the calibrated piece loads are stacked. To determine the magnitude of the absolute elongation of the sample base during stretching, contact deflection meters are used, as which watchtype indicators of the Mitutoyo company (Japan) are used.Discussion and Conclusion. The formula for determining the elastic modulus under tension is given. The arithmetic mean of the modulus of elasticity of the tested samples and the mean square deviation of the results of the modulus of elasticity are taken as the test result. The analysis of the obtained results allows us to conclude that the experimental values of the modulus of elasticity of Moso bamboo under tension reliably coincide with the values known in the technical literature.

Reliability evaluation for time-based stochastic manufacturing networks with time-dependent reliability

ABSTRACT This study aims to evaluate the system reliability for a time-based stochastic manufacturing network (TSMN). The architecture of a TSMN includes arcs and nodes where each node is an inspection station and each arc is a workstation of identical machines. Due to the possibility of partial or complete maintenance and machine failures, the reliability should be time-dependent and the arcs could be considered as stochastic capacities. To consider time factor, the Weibull reliability function is utilized to characterize the time-dependent reliability of each machine. Then, based on the reliability of each machine, the workstation reliability can be derived, where the workstation reliability is the probability that a workstation can provide sufficient number of machines to complete a demand until a given time. Focusing on a given TSMN with the specified demand and constrained operating time, the performance for a TSMN, which is referred to as TSMN reliability, can be calculated in terms of workstation reliability. In addition, the situation for machines having different times under operation is analyzed for TSMN reliability. A step-by-step procedure for evaluating the TSMN reliability is developed, and a printed circuit board manufacturing system is discussed for the proposed TSMN reliability procedure.

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies.

This study investigated the use of distributed optical fiber sensing to measure temperature and strain during thermomechanical processes in printed circuit board (PCB) manufacturing. An optical fiber (OF) was bonded to a PCB for simultaneous measurement of temperature and strain. Optical frequency-domain reflectometry was used to interrogate the fiber optic sensor. As the optical fiber is sensitive to both temperature and strain, a demodulation technique is required to separate both effects. Several demodulation techniques were compared to find the best one, highlighting their main limitations. The importance of good estimations of the temperature sensitivity coefficient of the OF and the coefficient of thermal expansion of the PCB was highlighted for accurate results. Furthermore, the temperature sensitivity of the bonded OF should not be neglected for accurate estimations of strains. The two-sensor combination model provided the best results, with a 2.3% error of temperature values and expected strain values. Based on this decoupling model, a methodology for measuring strain and temperature variations in PCB thermomechanical processes using a single and simple OF was developed and tested, and then applied to a trial in an industrial environment using a dynamic oven with similar characteristics to those of a reflow oven. This approach allows the measurement of the temperature profile on the PCB during oven travel and its strain state (warpage).