Low Melting Point Alloy Research Articles

Verification and Refinement of Local Difference in TC4 Hollow Blade Pressing with Low Melting Point Alloy Mandrel

Verification and Refinement of Local Difference in TC4 Hollow Blade Pressing with Low Melting Point Alloy Mandrel

Impact Deposition of a Single Droplet of Low-Melting-Point Alloy as the Top Electrode for Organic Photovoltaics.

Top electrodes of organic photovoltaics (OPVs) are usually thermally evaporated in the vacuum, which is non-continuous and time-consuming and has been the bottleneck for the OPV fabrication process. Printable top electrodes that are free of vacuum, high temperature, and solvents will make OPVs more attractive. Low-melting-point alloys (LMPAs) are promising candidates for printable OPV electrodes thanks to the merits of matching work functions, high electron conductivity, high environment stability, and no need for post-treatment. Here, LMPA electrodes are directly deposited on OPVs by simply falling a single LMPA droplet onto the substrate. The LMPA droplet spreads to form a thin film with a smooth interface intimately contacting the substrate. The electrode area can be tailored by adjusting the droplet diameter or the Weber number, which is the ratio of inertia to surface tension. The interface morphology is mainly affected by the contact temperature. The degree of oxidation and charges on the droplet can also influence the electrode area and interface morphology. OPVs with droplet-impacted LMPA electrodes exhibit power conversion efficiencies of up to 16.17%. This work demonstrates the potential of single-droplet impact deposition as a simple method for printing OPV electrodes for scalable manufacturing.

Unlocking the potential of low-melting-point alloys integrated extrusion additive manufacturing: insights into mechanical behavior, energy absorption, and electrical conductivity

AbstractAdditive manufacturing is a commonly used manufacturing method in complex part fabrication, instant assemblies, part consolidation, mass customization and personalization, on-demand manufacturing, lightweight, and topological optimization due to its advantage of lower costs, flexibility to learn and use, reduced raw material wastage, digital design integration, high efficiency, environmental-friendliness. However, the current metal 3D printing, which is mainly fabricated layer by layer using laser, is expensive to manufacture metal parts. Therefore, in this paper, a low-cost high-quality metal manufacturing process called low-melting-point alloys (LMPAs) integrated extrusion additive manufacturing will be examined. This manufacturing process can fabricate complex metal structures and integrated circuits with simple fused deposition modeling, which is a cost-effective method for producing these objects. LMPAs with different melting points are used for performance comparison to find out the optimized mechanical behavior, energy absorption properties, and electrical conductivity. Our investigation into LMPAs integrated extrusion additive manufacturing has revealed significant findings. Tensile tests conducted on LMPAs with varying melting points have illuminated distinct mechanical behaviors. Notably, lower melting points contribute to increased ductility but reduced stiffness, while higher melting points result in greater stiffness but diminished ductility. These results emphasize the importance of tailoring LMPA selection based on specific application requirements. Furthermore, our examination of lattice and triply periodic minimal surface structures has demonstrated consistent energy absorption properties across different manufacturing temperatures, highlighting the adaptability and versatility of LMPAs for energy absorption applications. Additionally, our electrical conductivity assessments have shown that LMPAs with melting points of $${{47}^{\circ }C}$$ 47 ∘ C and $${{120}^{\circ }}\hbox {C}$$ 120 ∘ C exhibit higher electrical conductivity, making them suitable for applications requiring good electrical conduction properties. These findings collectively underscore the significance of LMPAs in additive manufacturing, offering valuable insights for material selection and applications in various domains.

Investigating into casting LMPA (low-melting-point alloy) with 3D-printed mould and inspecting quality using 3D scanning

PurposeThree-dimensional (3D) casting means using additive manufacturing (AM) techniques to print the mould for casting the cast tool. The printed mould, however, should be checked for its dimensional accuracy. 3D scanning can be used for the same. The purpose of this study is to combine the different AM techniques for 3D casting with 3D scanning to produce parts with close tolerance for preparing electrical discharge machining (EDM) electrodes.Design/methodology/approachThe four processes, namely, stereolithography, selective laser sintering, fused deposition modelling and vacuum casting, are used to print the casting mould. The mould is designed in two halves, assembled to form a complete mould. The mould is 3D scanned in two stages: before and after using it as a casting mould. The mould's average and maximum dimensional deviations are calculated using 3D-scanned results. The eutectic Sn-Bi alloy is cast in the mould. The surface roughness of the mould and the cast tool are measured.FindingsThe cast tool is selected from the four processes in terms of dimensional accuracy and surface finish. The same is electroplated with copper. The microstructure of the cast tool (low-melting-point alloy) and deposited copper is analysed using a scanning electron microscope. Energy dispersive spectroscopy and X-ray diffraction techniques are used to verify the composition of the cast and coated alloy. The electroplated tool is finally tested on the EDM setup. The material removal rate and tool wear are measured. The performance is compared with a solid copper tool. The free-form customised EDM mould is also prepared, and the profile is cast out. The same is tested on the EDM. Thus, the developed path can be successfully used for rapid tooling applications.Originality/valueThe eutectic composition of Sn-Bi is cast in the 3D-printed mould using different AM techniques combined with 3D scanning quality to check its feasibility as an EDM electrode, which is a novel work and has not been done previously.

Effect of Nd-M (M = Al/Co) alloys addition on microstructures and magnetic properties of hot deformed CeFeB magnets

In this study, the magnetic properties, thermal stabilities, elemental distributions and phase transition temperatures of hot deformed CeFeB magnets were investigated by adding 20 wt% of Nd85Al15 and Nd64Co36 alloys, respectively. The results revealed that the addition of low melting point alloys efficiently enhanced the comprehensive magnetic performance and thermal stability of the CeFeB magnets. The optimal magnetic properties were obtained with the addition of 20 wt% Nd85Al15. Compared to the original sample, the coercivity increased from 104 kA/m to 604 kA/m, and the maximum magnetic energy product increased from 8 kJ/m3 to 34 kJ/m3. The incorporation of Nd-Al/Co alloys effectively reduced the area fraction of the coarse grain region and facilitated a more uniform distribution of the RE-rich phase. TEM observations demonstrated that Nd partially replaced Ce, leading to the formation of (Nd, Ce)2Fe14B hard magnetic phase. Additionally, the analysis of the M–T curves indicated the presence of two Curie temperature points for Nd85Al15 and Nd64Co36 added CeFeB hot deformed magnets. The addition of Nd85Al15 improved the fluidity of the RE-rich phase, thereby enhancing the coercivity. Conversely, the incorporation of Nd64Co36 resulted in the entry of Co elements into the main phase, contributing to improved thermal stability.

All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints

There is a growing interest in low temperature soldering, yet the use of low-melting point alloys for interconnection is often hindered by reliability concerns. Eutectic tin-bismuth (SnBi) alloy is being considered for soldering to Sn3Ag0.5Cu (SAC305) bumps at lower temperatures (150 °C), but the resulting hybrid structures are not very reliable. We have recently shown that superior reliability can be achieved by a post-soldering anneal to distribute up to 6 % Bi throughout the joint. However, the new approach is impractical for solder joints taller than 70 µm and the manufacturing feasibility in such cases warrants both SnBi and SAC305 to be electroplated. The present study utilizes electrochemistry to broaden the applicability of the aforementioned approach by the development of optimized routines for the separate electroplating of both structural alloys. The synthesis of the SAC305 alloy employs elemental co-deposition under strict thickness control, and the SnBi eutectic mixture may be produced likewise and deposited atop to enable low-temperature soldering. If the SnBi is deposited on separate pads, better composition control may be achieved alternatively by the successive plating of both metals, followed by reflow to facilitate their mixing. The established plating routines are further fine-tuned for the processing of an array of pillars.

In51Bi32.5Sn16.5@SiO2 microcapsules-based composite phase change materials with high thermal conductivity and heat storage density for electronics thermal management

Combining phase change microcapsules and various matrix materials can construct novel composite phase change materials (CPCMs). These composite materials hold immense potential for electronics thermal management, owing to their adjustable heat storage capacity and stable shape. Most previous studies focus on enhancing the thermal conductivity of CPCMs by adding thermally conductive fillers or modifying the microcapsule shells. Nevertheless, achieving both high thermal conductivity and heat storage density simultaneously remains a challenge. In this paper, low melting point alloy (In51Bi32.5Sn16.5) was introduced as core material of the microcapsule to enhance the thermal conductivity, due to its significantly higher thermal conductivity compared to commonly used organic or inorganic phase change materials (PCMs). In51Bi32.5Sn16.5@SiO2 microcapsule was synthesized through the sol-gel polymerization method. Furtherly, a form-stable CPCMs consisting of the microcapsules and silicone rubber (SR) matrix were prepared for electronics thermal management. The In51Bi32.5Sn16.5@SiO2 microcapsules exhibit an impressive thermal conductivity of 13.49 Wm−1 K−1, acting as a dual-functional filler for thermal storage and thermal conduction enhancement. Hence, the CPCMs possess a significantly enhanced thermal conductivity of 0.45 Wm−1 K−1, representing a remarkable improvement of 350 % compared to that of pure SR. In addition, the phase change heat storage density of the CPCMs was as high as 71.73 J/cm3. Notable, the prepared CPCMs demonstrate exceptional heat dissipation performance, resulting in a remarkable 23 °C reduction in chip temperature when applied for thermal management. This study offers a novel perspective on the preparation of microcapsule-based CPCMs for electronics thermal management.

High-performance shape memory epoxy resin with high strength and toughness: Prepared by introducing hydrogen bonds through polycaprolactone and low melting point alloy

Epoxy resin (EP) as common polymers have attracted much attention in the field of shape memory materials due to their excellent properties. However, epoxy-based shape memory polymers suffer from a trade-off between strength, toughness, variable stiffness capability and shape memory properties, and thus are subject to significant limitations in their applications. In this paper, we propose a method to prepare epoxy composites with high strength and toughness and high shape memory properties by introducing a lot of hydrogen bonds. Hydrogen bonding is generated through polycaprolactone (PCL) induced EP phase separation. A low melting point alloy (L) was also added to enhance the shape memory properties of the composites. The synthesis mechanism of EP and the formation mechanism of hydrogen bonding were revealed. The effects of the introduction of hydrogen bonding on the mechanical properties, stiffness and shape memory properties of the composites were investigated. New ideas and design directions are provided for the optimisation of modification of high-performance shape memory epoxy resins.

Development and optimisation of grid inserts for a preclinical radiotherapy system and corresponding Monte Carlo beam simulations.

Objective. To develop a physical grid collimator compatible with the X-RAD preclinical radiotherapy system and create a corresponding Monte Carlo (MC) model.Approach. This work presents a methodology for the fabrication of a grid collimator designed for utilisation on the X-RAD preclinical radiotherapy system. Additionally, a MC simulation of the grid is developed, which is compatible with the X-RAD treatment planning system. The grid was manufactured by casting a low melting point alloy, cerrobend, into a silicone mould. The silicone was moulded around a 3D-printed replica of the grid, enabling the production of diverging holes with precise radii and spacing. A MC simulation was conducted on an equivalent 3D grid model and validated using 11 layers of GAFChromic EBT-3 film interspersed in a 3D-printed water-equivalent phantom. A 3D dose distribution was constructed from the film layers, enabling a direct comparison with the MC Simulation.Main results. The film and the MC dose distribution demonstrated a gamma passing rate of 99% for a 1%, 0.5 mm criteria with a 10% threshold applied. The peak-to-valley dose ratio and output factor at the surface were determined to be 20.4 and 0.79, respectively.Significance. The pairing of the grid collimator with a MC simulation can significantly enhance the practicality of grid therapy on the X-RAD. This combination enables further exploration of the biological implications of grid therapy, supported by a knowledge of the complex dose distributions. Moreover, this methodology can be adapted for use in other systems and scenarios.

Oscillatory flow driven microdroplet breakup dynamics and microparticle formation in LMPA-water two phase flow system

This study presents a mathematical modeling and numerical investigation of oscillatory flow induced microdroplet breakup in low melting point alloy (LMPA)-in-water two-phase flow system in a microchannel. The effects of perturbation flow Weber number, and oscillating frequencies on the droplet breakup dynamics have been elucidated. Lowering the wall temperature will accelerate the solidification process of LMPA droplets, giving rise to the rapid formation of ultra-small particles with size down to 1 micron in less than 3 ms. The versatile approach combines oscillatory flow dominated droplet breakup process and phase change process, leading to the formation of LMPA microparticles with monodispersed size distribution and well-tailored properties by using a straight microchannel, which obviates the need for sophisticated design and complex fabrication process of microdevices. This work will provide a strategy to manipulating LMPA droplet size and structure for the massive production of ultra-small LMPA microparticles via a facile control over the flow conditions in the two-phase flow in a microfluidic system. It will open up for a diversity of applications of LMPA microparticles in various fields such as energy storage and thermal management.

Synergistic phase change and heat conduction of low melting-point alloy microparticle additives in expanded graphite shape-stabilized organic phase change materials

Organic phase change materials (PCMs) have great potential for efficient thermal energy storage and passive thermal management applications due to their non-corrosiveness, high heat storage capacity and stable operating temperature. However, low thermal conductivity and easy leakage seriously restrict the actual application. Meanwhile, heat transfer enhancers typically have a serious negative effect on the heat storage capacity of the PCMs. In this paper, a novel strategy for preparing high performance shape-stable composite phase change materials (CPCMs) is reported, utilizing paraffin wax (PW) as the energy storage material and expanded graphite (EG) as heat transfer enhancers and supporting material, especially in which low melting-point alloy (LMA) micro particles having same phase change temperature as PW are employed with two purposes: one is to provide extra latent heat, and another is to construct a hybrid three-dimensional thermal conduction network in microscale to achieve synergistic thermal conduction with EG. The resulting CPCMs exhibit excellent characteristics in energy storage capacity, thermal conductivity, and thermal cycling stability. The thermal conductivity of ternary CPCM can reach 5.842 W m−1 K−1 when the LMA and EG loading are 4.55 wt% and 9 wt%, which is about 16.4 times higher than that of pure PW, with no obvious volumetric latent heat reduction. This work provides a novel and promising approach for the preparation of CPCMs with high and fast storage properties.

Minimal-surface-based multiphase metamaterials with highly variable stiffness

Variable-stiffness materials have a unique ability to change their stiffness reversibly in response to external stimuli or conditions. However, achieving ultrahigh stiffness change is often constrained by the geometric organization of the microstructures in most materials that exhibit variable stiffness. Therefore, to overcome this limitation, we introduce a metamaterial design inspired by triply periodic minimal surfaces for fabricating multiphase metamaterials. The specific geometric features of minimal surface designs facilitate interlocking bi- or tri-continuous interpenetrating phases such as air, resin, and alloy within a single multiphase metamaterial. These multiphase metamaterials are constructed by injecting a low-melting-point alloy (LMPA) into a 3D-printed elastic resin mold. The thermally-induced solid-liquid phase transition of the LMPA governs the stiffness change in multiphase metamaterials, ranging from Kilopascals to Gigapascals. Further contributing to this phenomenon, the superior resilience of the elastic resin enhances the shape-memory effect of the multiphase metamaterials. Applications of these materials in origami and deployable structures have been successfully demonstrated, highlighting their reconfigurability and volume compressibility. This innovative design strategy provides the foundation for crafting other metamaterials with intricately arranged internal phases. In conclusion, the proposed multiphase metamaterials have promising potential for various engineering applications where adaptability and morphing capabilities are essential.

Effects of temperature and pressure on interfacial thermal resistance of thermal interface materials in coupled heat transfer process with vapor chamber

The vapor chamber (VC) is commonly acknowledged as an effective solution for the dissipation of high heat flux hotspots, as it dissipates the localized heat over the entire surface. There is a prevailing emphasis on enhancing the thermal performance of the VC and decreasing its thermal resistance. However, little attention has been paid to the interface thermal resistance (ITR) between the heat source and the VC. In actuality, the ITR of the thermal interface material (TIM) is much greater than the thermal resistant of the VC. Further research on coupling test of heat transfer performance between TIM and VC needs to be carried out. As a consequence, a coupling test method of TIM and VC is put forward in this paper. The thermal performance of dissimilar TIMs was experimentally explored, including thermal grease, thermal phase change materials (PCMs), low-melting-point alloy (LMPA) and thermal pad, and their performance was compared to the situation without using TIM. The results indicate that utilizing PCM leads to an 87.5% decrease in ITR, while thermal grease results in a 51% decrease and LMPA leads to a decrease of 81%. The proper TIM is PCM, LMPA, thermal grease and thermal pad in descending order of effectiveness. The heat transfer performance of TIM is influenced by both temperature and pressure. In the practical applications of TIM, ensuring consistency is also essential, meaning the ITR of TIM should not be easily affected by various manual operations, in addition to considering the heat transfer performance.

Experimental and numerical study on temperature control performance of phase change material heat sink

With the increasing power consumption of electronic products, the rising temperature leads to the deterioration of working environment and the reduction of service life. In order to control the temperature rise of electronic products, in this paper, the heat sinks with phase change material (PCM) and honeycomb metal were designed. And their performance was compared with that of the original heat sink (without PCM and honeycomb metal) then studied under various working conditions. Paraffin (n-eicosane) and prepared low melting point alloy were filled into the heat sink with honeycomb metal. The temperature control performance of heat sink was tested experimentally under different heating power. A two-dimensional heat transfer mathematical model of honeycomb metal PCM heat sink was established and solved numerically. The numerical results were compared with experimental data to verify the mathematical model. The results demonstrate that PCM heat sinks effectively controls the temperature of electronic devices and the low melting point alloy makes heat sink better performance than paraffin. Honeycomb metal further decreases the temperature of the paraffin heat sink by up to 3.6 °C, and extends the effective working time of the alloy heat sink by 14 %. The performance of the low melting point honeycomb metal heat sink is superior to that of the paraffin honeycomb metal heat sink at high heating power, and is close to the latter at low heating power. The effective working time of PCM honeycomb metal heat sink is significantly extended when the PCM melting point is close to the limit temperature, especially at high heating power and for the PCM with low thermal conductivity. This study provides valuable reference for temperature control design of electronic products.

Target-directed discovery for low melting point alloys via inverse design strategy

Low-melting-point alloys (LMAs) have been applied to many fields, such as thermal sensitive electronic components, fire safety devices, etc. Thence, there is a large requirement for LMAs to fulfil the demands from various applications, based on the different low melting points. This paper presents a study of target-directed discovery via an inverse design strategy for LMAs, which covers machine learning technique and self-developed proactive searching progress method. Two kinds of potential LMAs systems with the targeted melting points of 11 ℃ and 70 ℃ are designed and synthesized, resulting in 3 samples for each. The mean absolute error (MAE) between experimental and predicted melting points of 6 new samples is 4.06 ℃, while the MAE of SnInGa system is less than 0.8 ℃. The samples owning the smallest errors are Sn0.107In0.196Ga0.696 and Sn0.127Bi0.413Cd0.123In0.337 for each system, with the melting points of 10.77 ℃ and 66.28 ℃, respectively. The result indicated such inverse design strategy could directly identify the LMAs with desired properties. We believe that this progress in materials design and the proactive searching method (PSP) could significantly contribute to the development of LMAs. Therefore, it is expected to identify LMAs with specific melting points or other desired properties without unnecessary experimentation.

Use of Low Melting Point Alloy Mcp-96 Filter on Gammagraphic Optimization of Patient Position Verification with Telecobalt 60 Machine

Verification of the patient's position is a stage in external radiotherapy that aims to ensure the accuracy of radiation therapy administration according to plan. Equipment for the patient position verification process that is often used is Electronic Portal Image Devices (EPID) and film portals. However, not all Telecobalt 60 machines are equipped with EPID, so it requires alternative equipment to verify patient positions. One modality that can be utilized is Computed Radiography (CR). The study was conducted to analyze the use of MCP-96 low melting point alloy filters in imaging, verifying patient positions with CR devices on telecobalt 60 machine can calibrate radiation doses and provide good image quality and anatomical information. The study used a posttest-only control group design by comparing radiation dose, image quality, and anatomical information of the patient's position verification image. Imaging was performed using a phantom pelvis as an object and using CR equipment and low melting point alloy MCP-96 as a filter. The results showed that low melting points alloy MCP-96 with a thickness of 1 cm, 2 cm and 4 cm can calibrate the radiation dose output of the telecobalt 60 machine in accordance with recommendations for kilovoltage imaging. There was no significant difference in SNR and CNR images from imaging verification of patient positions with filter thicknesses of 1 cm, 2 cm, and 4 cm. Filter thickness of 1 cm produces images with optimal image quality and anatomical information in gammagraphic imaging verification of patient position using CR on telecobalt 60 machine. Thus, the use of low melting point alloy MCP-96 thickness of 1 cm and CR devices can be used in gammagraphic imaging of patient position verification on a telecobalt 60 machine as an alternative if you do not have EPID.

Bubble detection in liquid metal by perturbation of eddy currents: Model and experiments

A model has been developed to predict the response of an eddy current flow meter (ECFM) to the passage of a non-conductive inclusion moving in a cylindrical tube filled with a liquid metal. The model can be solved analytically for small inclusion diameters and moderate AC frequencies of the excitation signal. This condition is expressed as vbSω≪1, where vb is the dimensionless inclusion volume and Sω is a function of the ratio between the characteristic length of the system and the penetration depth of the magnetic field. The magnetic induction equation for this problem has also been solved numerically. A very good agreement between the analytical model and numerical solutions has been found for vbSω≪1. Two experimental setups have been designed. First, the ECFM model has been validated by comparing the response due to the passage of traveling beads of known diameters in a low melting point alloy. In a second experiment, the diameters of ascending argon bubbles have been estimated with the ECFM model. The numerical model predicts the gas volume with very good accuracy in the range of bubble diameters studied, between 1.5 and 6 mm, while the analytical model only deviates significantly from the experimental data when vbSω≳0.1. Moreover, we establish that the ECFM can also measure the radial deviation of the bubble trajectory, and the results are consistent with the theoretical limit for isolated bubbles between the regimes of oscillating/zigzag motion of ellipsoidal bubbles and non-oscillating motion of spherical bubbles. Another observation is that the dependence of the ECFM response on the shape of the bubble is negligible; indeed, the ECFM response is well approximated by a linear relation with the bubble volume as is assumed in the analytical model. Finally, an estimation of the terminal rising velocity of bubbles was also carried out.

Temperature Resistance Properties of Unidirectional Laminated Cf/SiC-Al Prepared by PIP and Vacuum Pressure Infiltration.

Material used for aero-engine fan blade requires excellent mechanical properties at high temperature (300 °C). Continuous carbon-fiber-reinforced silicon carbide ceramic matrix composites (Cf/SiC) are necessary candidates in this field, possessing low density, high strength, high modulus, and excellent high-temperature resistance. However, during the preparation process of Cf/SiC, there were inevitably residual pores and defects inside, resulting in insufficient compressive strength and reliability. The vacuum pressure melting infiltration process was used to infiltrate low melting point and high wettability aluminum alloys into the porous Cf/SiC composite material prepared by the precursor impregnation cracking process, repairing the residual pore defects inside the body. The porosity of porous Cf/SiC decreased from 49.65% to 5.1% after aluminum alloy repair and strengthening. The mechanical properties of Cf/SiC-Al composite materials strengthened by aluminum alloy repair after heat treatment were studied. The tensile strength of the as-prepared Cf/SiC-Al was 166 ± 10 MPa, which were degraded by 13~22% after heat treatment. The nonlinear sections of stress-displacement curve of as-treated samples were shorter than that of as-prepared sample. The hardness of aluminum alloy matrix after 300 °C 1 h heat treatment was 58 Hv, which was not obviously reduced compared with the sample without heat treatment. The vacuum infiltration of aluminum alloy is expected to have guiding significance for repairing and strengthening internal defects in ceramic matrix composites.

Efficient co-diffusion of Tb and Co in a sintered Nd-Fe-B magnet by low-melting point alloys

Co-diffusion of heavy rare-earth elements and Co has been reported to improve the remanence and coercivity of Nd-Fe-B magnet at high temperatures without trade-off. Two low-melting point alloys Pr50Tb20Cu15Co15 and Y15Pr40Tb15Cu15Co15 were designed in this work to simultaneously enhance the remanence and coercivity at 150°C in sintered magnet by grain boundary diffusion. The remanence increased from 1.24 T to 1.28 and 1.31 T at 150°C together with the increase of coercivity from 0.3 T to 0.89 and 0.77 T after diffusion. The temperature coefficients of remanence (20–150°C) were reduced from −0.11 %/°C to −0.07 and −0.06 %/°C by Pr50Tb20Cu15Co15 and Y15Pr40Tb15Cu15Co15 respectively. The improvement of temperature coefficients is attributed to the microstructure effect without changing the Curie temperature. The low melting point of the diffusion alloys and Y are attributed to breaking the remanence–coercivity dilemma with reduced Tb and Co usage.

Low-melting-point alloys integrated extrusion additive manufacturing

Additive manufacturing has developed significantly. In contrast to established fabricated materials, low-melting-point alloys (LMPAs) are increasingly attractive because they have favorable electrical/thermal conductivities and mechanical strengths. However, LMPA additive manufacturing is still in its infancy. We report a novel strategy for fabricating the complex and/or multifunctional components of LMPAs by extrusion additive manufacturing with two nozzles (for extruding the polymer and for extruding the LMPA). The proposed strategy was used to successfully fabricate complex LMPA components for the first time. We fabricated LMPA/polymer composite parts with improved mechanical properties, and implemented the integrated manufacturing of circuits and 3D products. The strategy will enable the use of LMPAs in applications such as smart structures, electromagnetic shielding, biomedicine, thermal management, energy harvesting, and advanced electronics.