We have studied surface passivation layers for the application on n -type p <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> nn <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> bifacial silicon solar cells. Thereby, we have examined their optimal composition and thickness with regards to passivation quality, optical properties, and especially the contact formation during a co-firing step. These parameters were addressed in separate investigations: 1) simulation of the optical properties of a bifacial silicon solar cell, 2) measurement of the passivation quality on lifetime samples, 3) measurement of contact resistance (of aerosol printed fingers) to analyze the contact formation during the co-firing process, and 4) differential scanning calorimetry measurement were conducted to fundamentally understand reactions during contact formation in a fast firing furnace. The passivation layers tested were silicon nitride (SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> ), titanium oxide (TiO 2), and silicon oxide (SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) on lowly phosphorus-doped silicon n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -layers, whereas aluminum oxide (Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) stacks, capped with SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> and TiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , were studied on lowly boron-doped silicon p <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -layers. The results show that a dielectric stack, consisting of 10-nm-thick Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> and 60-nm-thick SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> layers on the boron-diffused silicon front side and a single 50-nm SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> layer on the phosphorus-diffused silicon rear side, provides low emitter saturation current density (J <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0e</sub> ), high optical absorption current density, and low contact resistance for printed and co-fired contacts.