Low Dielectric Properties Research Articles

Structures and Performance of a Polybenzoxazine with High Heat Resistance and High-Frequency Low-Dielectric Properties

Benzoxazine is a newly developed thermoset resin that has attracted significant academic and industrial interest due to its excellent properties. However, improving its dielectric performance while maintaining high heat resistant is crucial for expanding its application in 5G electronics. In this study, we designed and synthesized a novel benzoxazine monomer, DFDA-PTB, using p-tert-butylphenol (PTB) as the phenol source and furfuryl diamine (DFDA), derived from furfuryl amine, as the amine source. Two additional benzoxazines with similar structures were also synthesized for comparison. The cured product, poly(DFDA-PTB), was then analyzed to explore the relationship between its structure and properties. The results indicate that the introduction of a furan ring structure enhances thermal stability and reduces the dielectric constant. Additionally, the inclusion of tert-butyl groups further lowers the dielectric constant and dielectric loss. Simulation methods were employed to study the mechanisms behind these improvements. Poly(DFDA-PTB) demonstrated superior dielectric properties, with a dielectric constant of 2.51 and a dielectric loss of 0.0018 at 10 GHz. It also exhibited excellent heat resistance, with a char yield of 45.4% at 800 °C. These properties make poly(DFDA-PTB) a promising candidate for electronic packaging and communication applications.

Exfoliation of boron nitride nanosheets by liquid phase method based on deep eutectic solvents and their thermal management application

AbstractBoron nitride had emerged as an innovative thermally conductive filler, garnering increasing attention from researchers. However, there was a need to create new methods for efficiently producing functionalized boron nitride nanosheets with enhanced thermal conductivity and dispersion. In this study, a novel approach was introduced to utilize deep eutectic solvents as additives to facilitate the exfoliation of boron nitride nanosheets. This method offered significant advantages in terms of cost‐effectiveness (low additives level) and high yield (about 60%). Furthermore, the resulting epoxy resin composite material exhibited outstanding thermal conductivity and thermal management properties. The thermal conductivity of EP/d‐BNNS composites reached 1.02 W/mK at 20 wt% d‐BNNS loading. Additionally, the composite material demonstrated good thermal stability and low dielectric properties. This work demonstrated that this proposed approach represents an effective means for the scalable production of boron nitride nanosheets.Highlights The boron nitride nanosheets were obtained by deep eutectic solvents (DES) ball milling method. The exfoliated boron nitride exhibits superior dispersion stability. The thermal conductivity of EP composites is significantly improved.

Thermosetting boron-nitride-filled polybutadiene composites with enhanced thermal conductivity and good dielectric properties

Low dielectric materials with high heat dissipation, low dielectric constant (Dk), and dielectric loss (Df) are urgently needed to address the issues of signal cross-talk and heat accumulation arising from the rapid development of modern communication technology and the integration of microelectronics. Polyolefins, as hydrocarbon polymers, have shown significant potential due to their excellent low dielectric properties. However, their low polarity and flexible structures limit their thermal conductivity and thermomechanical properties. In this study, we developed a method to prepare thermosetting polybutadiene composites with enhanced thermal conductivity and good dielectric performance by modifying hexagonal boron nitride (h-BN) and hydroxyl-terminated polybutadiene (HTPB) with thermally cross-linkable benzocyclobutene (BCB) groups. The properties of the resulting composites were tailored by varying the filler content. With 30 wt% of the BCB-modified filler, the composite (HB-30) displayed excellent dielectric properties (Dk = 2.70; Df = 1.67 × 10−3 @10 GHz). Meanwhile, it exhibited a thermal conductivity of 0.615 W/mK at 35 °C, which was 7.1 times that of pristine HTPB. It also showed significantly enhanced mechanical properties and thermal stability with a storage modulus of 2.7 GPa and a glass transition temperature (Tg) of 208.5 °C. This method proved effective for preparing polymer composites with enhanced thermal conductivity, heat resistance, mechanical properties and good dielectric properties, making them suitable for high-frequency communication applications.

Preparation of a Vanillin-Based Active Ester Curing Agent and the Low Dielectric, Antibacterial, and Anticorrosion Properties of Its Coatings

Preparation of a Vanillin-Based Active Ester Curing Agent and the Low Dielectric, Antibacterial, and Anticorrosion Properties of Its Coatings

Electrostatic self‐assembly of barnacle‐like modified BN@ND hetero‐structured fillers to synergistic enhanced thermal conductivity of PI composite films

AbstractHigh‐integration microelectronic equipment cannot dissipate heat for long periods of time, which enormously damages the efficiency and service life of electronic devices. Developing polymer‐based composite film exhibiting admirable thermal conductivity (TC), mechanical, dielectric and insulation performances has been pursued by researchers. Polyimide (PI) materials are generally used in progressive electronic systems. In this research, we constructed unique thermally conductive fillers to improve the TC of PI composites. Specifically, boron nitride nanosheets (BNNS) and nanodiamond (ND) were modified to impart them different charging properties. The barnacle‐like hetero‐structured fillers (MBN@FND) were assembled by electrostatic self‐assembly, and then introduced into PI to prepare PI composites. MBN@FND‐2 (MBN/FND, 1/1, wt/wt) fillers exhibited optimal morphology. The results showed that MBN@FND formed tightly stacked structure in composites, availing the densification of the thermal network and improving the heat transfer efficiency. Under 25 wt% MBN@FND loading, the in‐plane TC of MBN@FND/PI composite was 9.73 W/mK, and the through‐plane TC was 0.72 W/mK. The MBN@FND/PI composite remained at a low level in terms of dielectric properties. Moreover, MBN@FND/PI composites had flexibility, good tensile strength (47.9 MPa), and volume resistivity of 1.05 × 1013 Ω cm. This work provides a versatile approach for the preparation of hybrid materials.Highlights Hetero‐structured fillers were prepared by electrostatic self‐assembly. The in‐plane TC and through‐plane TC of PI composite was improved. The composites had insulation, flexibility, and low dielectric properties.

Wave-transparent and eco-friendly flame-retardant phosphorus-based phthalonitrile/quartz composites by a synchronized self-curing strategy with cyano and alkynyl groups

The robust human–machine interaction systems of the aerospace industry necessitate the development of thermal resistant wave-transparent composites, with a pivotal focus on organic resin matrix. However, enhancing the heat resistance of such materials while preserving other critical attributes has been a formidable challenge. In this study, a novel designed strategy of a dual-curing functional phosphorus-based phthalonitrile monomer (P-ALK-PN) has been proposed. The optimized curing temperatures for intra- or intermolecular Diels-Alder reactions of alkynyl groups and polyaddition reaction of cyano groups resulted in a homogeneous and highly crosslinked N-enriched phthalonitrile system. After curing at 450 °C, the resin, namely P-ALK-PN-450 °C, demonstrated exceptional thermal stability (T5% = 644 °C), thermo-oxidative stability (T5% = 554 °C), and char yield at 800 °C (90.7 % in N2 and 67.5 % in air). Their quartz fiber reinforced composites (P-ALK-PN/QFs) were subsequently fabricated by the hot-pressing process. Upon post-curing at 420 °C, P-ALK-PN-420 °C/QF displayed elevated glass transition temperature (550 °C), flexural strength (319 MPa), and relatively low dielectric properties with a dielectric constant (Dk) of approximately 4.2 and a dissipation factor (Df) less than 0.02 across a wide temperature ranging from 25 °C to 600 °C. Especially, it exhibited excellent flame retardancy (only a 6.7 % weight loss at ambient temperatures exceeding 1300 °C for 200 s) as well, stemming from release of eco-friendly inert gases (NH3) and formation of a graphitized protective layer during pyrolysis. These promising results highlight the potential applications of P-ALK-PN resins in aerospace and high-performance engineering fields.

High toughness, flexible and thermally conductive fluorine rubber composite films reinforced by hexagonal boron nitride flakes for thermal management

The rapid advancement of electronic information technology has generated a substantial demand for polymer-based thermal management materials. In order to address the challenges of heat dissipation and avoid signal interference, it is essential to develop polymer-based thermal management materials with both high thermal conductivity and low dielectric properties. Herein, hexagonal boron nitride flakes (h-BNFs) with a high aspect ratio and some hydroxyl groups were prepared using the high pressure homogenization technique. Subsequently, h-BNF/fluorine rubber (h-BNF/FKM) composite films were fabricated through a simple and scalable blade coating method. During the blade coating process, most of the h-BNFs can align with their (002) crystal planes paralleling to the horizontal direction. In addition, the rest of the h-BNFs will randomly distribute and overlap with each other, combining with the horizontally aligned h-BNFs to form a distinctive three-dimensional packing network. This unique network structure enables the h-BNF/FKM composite films to have thermal conductivities of up to 0.44 W/(m·K). Moreover, the introduction of h-BNFs can effectively reduce the dielectric constants and dielectric losses of FKM films. More importantly, the h-BNF/FKM composite films also exhibit outstanding mechanical toughness, excellent flexibility, good adhesion and improved flame-retardancy, providing promising applications in the electronic device thermal management.

Green Approaches in Manufacturing Polyimides: From Eugenol-Based Monomers to Cross-Linked Polyimides with Low Dielectric Properties Utilizing γ-Valerolactone as the Solvent

Green Approaches in Manufacturing Polyimides: From Eugenol-Based Monomers to Cross-Linked Polyimides with Low Dielectric Properties Utilizing γ-Valerolactone as the Solvent

Siloxane-containing epoxy resins derived from magnolol with low dielectric properties, excellent toughness, and flame retardancy

The entanglement disorder, highly polar groups and carbon-rich structure of conventional epoxy resins result in high dielectric constants and flammability, posing challenges to the development of high-frequency communications. Therefore, a silicone-containing active ester curing agent (FMAE) derived from magnolol was synthesized via a straightforward two-step process. And a thermosetting resin (FMAE/TGDDM) was then obtained by moisture self-cross-linking as well as curing epoxy N, N, N, N-tetraethoxypropyl-4, 4-diaminodiphenylmethane (TGDDM). The epoxy resin (MAE/TGDDM) cured by MAE that was not undergoing click chemistry was used for comparison. The results showed that the large volume of curing agents (31.86 Å × 14.98 Å × 9.03 Å for FMAE, 16.01 Å × 11.46 Å × 8.09 Å for MAE) and the absence of –OH enabled both resins to have excellent dielectric properties, especially FMAE/TGDDM, with a Dk of 2.78 and a Df of 0.0066 at 10 MHz. Additionally, FMAE/TGDDM demonstrated favorable impact resistance (43.9 kJ/m2) and lower hygroscopicity (0.56%) than MAE/TGDDM, which due to the introduction of siloxane chain (Si% = 7.08%) and the increase of the crosslinking density (2302 mol/cm3 vs 6751 mol/cm3). Furthermore, the charring rate of FMAE/TGDDM was 39.1%, almost twice that of MAE/TGDDM, and the PHHR and THR were 201.2 W/g and 22.6 kJ/g, 103.9% and 67.7% lower than MAE/TGDDM, respectively, proving that the intrinsic flame retardancy of FMAE/TGDDM. Hence, this paper provides a strategy to synergistically address the limitations of TGDDM and conventional epoxy resins for impact resistance, dielectric properties and flame retardancy through a simple structural design.

Comparative study of dielectric characteristics and radio transparency of composite materials

Polymer composites with low dielectric properties and excellent radio transparency are essential for high signal transmission rates and high device integration. However, creating dielectric polymer composites with high radio transparency is a challenging task. This work presents comparative results of studying the dielectric loss, permittivity and radio transparency of composite materials, such as aramid-epoxy composite (AEC), glass fiber (GF), carbon fiber reinforced plastic (CFRP), and ultra-high molecular weight high-density polyethylene (UHMWPE). Based on the experimental results, the following transmission percentages were established for various materials: CFRP – 2.45%, AEC – 79.43%, UHMWPE – 80.16%, and GF – 78.88%. The dielectric loss tangent angle of carbon fiber is significantly higher compared to other polymer composites, UHMWPE exhibits the lowest tangent angle values, and AEC and GF have stable and low dielectric loss. The obtained polymer composites demonstrated low dielectric permittivity values: AEС 2.9, UHMWPE 2.56, and GF 3.64.

Synthesis of phosphine sulfide group-containing aromatic poly(ether)s with aliphatic substituents on the phosphorus atoms and low dielectric properties

Synthesis of phosphine sulfide group-containing aromatic poly(ether)s with aliphatic substituents on the phosphorus atoms and low dielectric properties

A strategy for the preparation of low dielectric FGQD/PSPI composite films in wafer-level packaging

Advancement of wafer-level packaging (WLP) has heightened the requirements for photosensitive polyimide (PSPI) materials, where the low dielectric property is a key element to realize high frequency communication. Herein, a poly(amidate) (PAE) was prepared using Pyromellitic Dianhydride, 4,4’-diaminodiphenyl ether, and hydroxyethyl methacrylate as the photosensitive group. Specifically, the fluorinated graphene quantum dots (FGQD) was introduced into the PAE resin by in situ polymerization, and the prepared composite films of photosensitive polyimide-fluorinated graphene quantum dots (PSPI-FGQD) showed excellent dielectric constants and other comprehensive properties. Compared with pure PSPI, the dielectric constant of PSPI-FGQD decreases from 3.8 to 3.0 at 1 MHz; the tensile strength increases from 84.5 to 110.1 MPa, the elongation at break raises from 5.24 % to 17.3 %, and the Young's modulus increases from 2.68 GPa to 2.88 GPa. The glass transition temperature (Tg) is also increased to 420 °C with the introduction of FGQD. Apart of these, the fine patterning ability was observed for the FGQD/PSPI composite film, achieving a high photolithography resolution of 10 μm (L/S). To conclude, the preparation method of low dielectric FGQD/PSPI materials has promising potential applications in advanced packaging.

Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes

Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes

High-performance epoxy resin with flame-retardant, transparent, and ultraviolet shielding properties based on a vanillin-based multifunctional macromolecule

Flame-retardant epoxy resins with tough, transparent, ultraviolet shielding, and low dielectric properties have fascinating prospects in electronic and electrical applications, but it is still challenging at present. In this work, a bio-based macromolecule was synthesized from vanillin (a lignin derivative), phenyl dichlorophosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO), and poly(propylene glycol) bis(2-aminopropyl ether). The bio-based macromolecule, namely, MFR, was designed and added to the epoxy resin (EP). The cured EP containing 15 wt% MFR (i.e., EP/MFR15) exhibits excellent flame retardancy with an Underwriter Laboratory 94 (UL-94) V-0 rating and a limiting oxygen index (LOI) of 29.2 %. Furthermore, the peak heat release rate (PHRR) and total heat release rate (THR) are drastically reduced by 59.5 % and 40.7 %, respectively. Meanwhile, EP/MFR15 shows 20.3 % and 43.8 % improvements in tensile strength and toughness, respectively. Moreover, MFR simultaneously endows EP with accessional ultraviolet shielding performance and low dielectric constant without sacrificing transparency. This work provides a promising strategy for fabricating a bio-based macromolecular flame retardant and preparing a high-performance EP composite with versatile properties.

Correlative Investigation on Dielectric-Mechanical-Morphological Characteristic for Kenaf-Glass-Hybrid Fibers Reinforced Epoxy Composite

In recent years, there are many applications where synthetic fibers and natural fibers are used as reinforcing materials in composites, such as the automotive and aerospace industries, the medical industry, and the construction industry. While these hybrid fibers effectively enhance mechanical and electrical properties, research into electrical characteristics remains inadequate and is an ongoing endeavor. In this work, synthetic woven glass fibers and natural woven kenaf fibers were used to fabricate composite materials by vacuum infusion technique. The dielectric properties of three different substrates, glass fibers, kenaf fibers and glass/kenaf fibers reinforced epoxy composites were investigated at 0° orientation. The ENA Network Analyzer was used to measure dielectric properties in a wide microwave frequency range. The substrates were single-joint overlapped with an adhesive and then mechanically tested. The shear strength of the joint as a function of strain, was tested using a Shimadzu universal testing machine. Visual inspections were performed to determine the failure modes of the composites. The dielectric constant and loss factor of the glass fiber composite were the highest, while the kenaf fiber composite had the lowest value. When a small amount of glass fibers is incorporated into kenaf fibers, which is called a hybrid composite, the polarization increases and the mechanical strength also increases compared to the kenaf fiber composite. Scanning electron microscopy (SEM) of the fractured tensile tests was performed to understand the nature of the interfaces between glass, kenaf and matrix. The kenaf/matrix interface was heterogeneous but exhibited voids, resulting in low dielectric properties and mechanical strength. By inserting a small amount of glass fibers, the hybrid with kenaf fibers improve the dielectric constant by 20.7% and the dielectric loss factor by 27% compared with the kenaf fiber composite. The results also show that the composites exhibit a correlation between the dielectric properties, tensile strength, and the morphological nature of the interfaces.

The synthesis and characterization of alkaline niobate-based ceramic composites containing L-lysine Hydrochloride

Some lead-free piezoelectric ceramics are known to have high dielectric and piezoelectric properties but are limited by their brittle nature. A few amino acids have recently been reported to exhibit rather low dielectric and piezoelectric properties but have the advantage of being biocompatible and flexible. It would therefore be interesting to form a composite that will combine the inherent advantage of high dielectric properties from the ceramics and flexibility from the biomolecule. In this research, the properties of lead-free (K0.45Na0.51Li0.04)(Nb0.85Ta0.1Sb0.05)O3 (KNNLST) ceramics and L-lysine hydrochloride (L-LHCl) have been combined to produce dielectric composites. The samples were produced by mixing the constituents from 0 wt.% to 100 wt.%, pelletising and heat-treating them. Bulk density, X-ray diffraction, scanning electron microscopy, and dielectric characterisation were techniques used to determine the density, phases, morphology, and dielectric properties of the produced composites. The results show an increasing bulk density value from 1.2 g/cm3 for L-LHCl to 4.67 g/cm3 for the KNNLST ceramics. The morphology of the composite shows very tiny grains when small amounts of the ceramics were introduced. The L-LHCl transforms from an amorphous phase to a crystalline phase having the orthorhombic-tetragonal structure with the introduction of the KNNLST ceramics. The dielectric constant values increased with increasing KNNLST ceramics content from 10 @1 kHz to 200 for the composite with 80 wt%. KNNLST content. The dielectric loss values decreased for L-LHCl from 0.9 @1 kHz to 0.2 @1kHz. The electrical conductivity values increased with increasing KNNLST ceramics content. The results show that the composites produced from these constituents may be suitable for dielectric applications.

High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized effectively as a substrate for flexible electronic materials. At present research, the CTE of PI films can be reduced to around 5 ppm/K, with Tg > 420 °C. However, it is difficult to balance low CTE and high Tg at the same time, and reducing dielectric performance is even more difficult. This study focused on synthesizing four types of PI films (using BPDA as the dianhydride) by employing biphenyl structure diamines (PDA, BZD, DPT, DMP) with an increasing number of benzene rings. The improvement in CTE, dielectric properties, and thermal stability was observed with an increase in the number of benzene rings and a decrease in the number of imine rings in the PI horizontal structure. The Tetraphenylene PI-DMP exhibited values of ε and tanθ as 3.31 and 4.73 ‰ respectively under 10 GHz. Additionally, the biphenyl PI films demonstrated commendable thermal stability (Tg = 442°C), outstanding mechanical properties (elastic modulus >10 GPa), and a low CTE (2 ppm/K within the temperature range of 50–300 °C, and close to the 3.6 ppm/K CTE of monocrystalline silicon). The low CTE, high thermal stability, and low dielectric properties that 5G flexible substrate materials need to be qualified are simultaneously reflected in this study. MS theoretical calculations were used to analyze the results. The excellent consistency with experimental results can promote the feasibility of MS theory in PI dielectric properties at high-frequency (10 Ghz). This innovative approach is anticipated to provide foldable chip fields with intrinsic biphenyl PI materials possessing low dielectric, low CTE, and high thermal stability.

A dual cross-linking strategy enables fully bio-based epoxy thermosets with superior low dielectric properties and mechanical properties

Bio-based epoxy resins with superior low dielectric properties and mechanical properties is of great significance for sustainable development and environmental protection. Herein, a bio-based active ester curing agent with large free volume was synthesized through a substitution reaction between magnolol and cinnamoyl chloride following by curing epoxidized linseed oil for fully bio-based epoxy thermosets. The curing kinetics of the curing behavior and the curing condition was systematic studied and optimized. The relationship between chemical structure and properties (thermo-mechanical, mechanical, dielectric, and etc.) of the resulting fully bio-based epoxy thermosets was discussed in-depth. The results showed that free radical polymerization and epoxy ring-opening reactions simultaneously occurred in the curing reaction led to a dual cross-linked structure of the resulting fully bio-based epoxy thermosets. The unique structures and the introduction of the rigid benzene groups rendered the tensile strength and the thermal stability of the resulting fully bio-based epoxy thermosets high up to 33.63 MPa and 332.40 °C, respectively. The absence of the secondary hydroxyl groups and the presence of the low polar fatty acid chains in the backbone of the epoxy resins resulted in the dielectric constant and dielectric loss low to 3.19 and 0.012, which was much lower than those of the polymer previously reported. This study provides a simple and facile strategy for the design of environmentally friendly fully bio-based epoxy resins for microelectronics and electronic packaging application.

Mechanical, Dielectric and Flame-Retardant Properties of GF/PP Modified with Different Flame Retardants.

With the rapid development of electronic information technology, higher requirements have been put forward for the dielectric properties and load-bearing capacity of materials. In continuous glass fiber-reinforced thermoplastic composites, polypropylene matrix is a non-polar polymer with a very low dielectric constant and dielectric loss, but polypropylene is extremely flammable which greatly limits its application. Aiming at the better application of flame retardant-modified continuous glass fiber-reinforced polypropylene composites (FR/GF/PP) in the field of electronic communication, the effects of four different kinds of flame retardants (Decabromodiphenyl ethane (DBDPE), halogen-free one-component flame retardant (MONO), halogen-free compound flame retardant (MULTI), and intumescent flame retardant (IFR)) on the properties of FR/GF/PP were compared, including the mechanical properties, dielectric properties and flame-retardant properties. The results showed that among the FR/GF/PP, IFR has the highest performance in mechanical properties, MULTI has better performance in LOI, DBDPE and IFR have better performance in flame retardant rating, and DBDPE and IFR have lower dielectric properties. Finally, gray relational analysis is applied to propose an approach for selecting the optimal combination (flame retardant type and flame-retardant content) of comprehensive performance. In the application exemplified in this paper, the performance of IFR-3-modified GF/PP is optimized.

Flame retardant, toughened, reinforced, transparent and long shelf-life one-component epoxy resins via a P/N/Si-containing hyperbranched polymer

One-component epoxy resins (OCEPs) cured from latent imidazole-based curing agents that exhibit high toughness, high strength, high fire safety, long shelf life, low dielectric properties and transparency are eagerly awaited in advanced manufacturing. However, existing research on latent imidazole-based curing agents/OCEPs mainly focuses on simultaneously improving their flame retardancy and shelf life, but neglects their poor toughness, strength and dielectric properties, and often compromises their transparency. Herein, a hyperbranched polymer (Si-DP) containing P/N/Si was fabricated to further improve the flame retardancy, toughness, strength and dielectric properties of EP10 (the transparent OCEPs comprising the latent imidazole-based curing agent PHI-HPP). EP10 containing Si-DP (EP10/Si-DP) boasted a shelf life longer than 81 days. The synergistic flame-retardant effect of P, N and Si elements enabled EP10/Si-DP3 to achieve a UL-94 V-0 rating with a limiting oxygen index of 33.9 %, the peak heat release rate and total smoke production of EP10/Si-DP5 were reduced by 44.4 % and 25.5 %, respectively, compared with EP10. The increased free volume and Si-O flexible bonds resulted in a 261.1 % higher impact strength of EP10/Si-DP5 than EP10. The excellent interfacial bonding of Si-DP with epoxy resins and the increased rigidity groups led to 74.0 % and 60.7 % higher tensile and flexural strengths of EP10/Si-DP5 than EP10, respectively. The intramolecular cavities and the low-polar Si-C bonds of Si-DP reduced the dielectric constant and dielectric loss of EP10/Si-DP. Meanwhile, EP10/Si-DP maintained inherent excellent transparency and high glass transition temperature (Tg). Carbon fiber epoxy composites prepared from EP10/Si-DP5 exhibited remarkable improvement in flame retardancy, smoke suppression as well as mechanical and interfacial performances. Overall, this research proposes an effective approach for preparing long shelf-life OCEPs with excellent overall performance.