Long-wavelength Infrared HgCdTe Research Articles

Measurement and Characterization of Unstable Pixels of Long-wavelength HgCdTe Infrared Focal Plane Array

Unstable pixels directly affect the imaging quality of the long-wavelength infrared (LWIR) mercury cadmium telluride (HgCdTe, MCT) focal-plane-array (FPA) detector. This study investigates the unstable pixels of LWIR HgCdTe linear arrays with different passivation. According to the different fluctuation characteristics, the unstable pixels are classified into four types: trend-clear type (including the rising and declining pixels), fluctuating type, comb type, and telegraph type. The number of unstable pixels under different bias voltage is counted, which indicates that when the bias voltage is large enough, the number of unstable pixels can increase sharply. By comparing the characteristics of the unstable pixels of two linear arrays with different passivation, we find that the unstable pixels are sensitive to the surface passivation. In addition, the dark currents of unstable pixels and that of normal pixels are compared, inferring that there is no apparent connection between the cause of the instability of the pixels and that of the dark current.

Enhanced Performance of HgCdTe Long-Wavelength Infrared Photodetectors With nBn Design

The performance of the long-wavelength infrared (LWIR) HgCdTe photodetectors with nBn structure is susceptible to the thickness of barrier layer and the huge mismatch of the energy band between the barrier layer and the absorption layer. Herein, a numerical simulation analysis for LWIR HgCdTe nBn device is carried out to present an enhanced performance with optimized structural and physical parameters (including thickness, doping concentration, and composition). The results provide that the valence band-offset (VBO) could be reduced by structure optimization, and could greatly improve the transport properties of photogenerated carriers. In addition, the effect of composition diffusion caused by the annealing process has also been studied to demonstrate that larger composition diffusion leads to a much higher dark current. The model and calculation results established in this article can provide important theoretical support and guidance for further researches of LWIR HgCdTe nBn devices.

High-Operating Temperature HgCdTe: A Vision for the Near Future

We review recent advances in the HgCdTe material quality and detector performance achieved at Teledyne using molecular beam epitaxy growth and the double-layer planar hetero-junction (DLPH) detector architecture. By using an un-doped, fully depleted absorber, Teledyne’s DLPH architecture can be extended for use in high operating temperatures and other applications. We assess the potential achievable performance for long wavelength infrared (LWIR) hetero-junction p-lightly-doped n or p-intrinsic-n (p-i-n) detectors based on recently reported results for 10.7 μm cutoff 1 K × 1 K focal plane arrays (FPAs) tested at temperatures down to 30 K. Variable temperature dark current measurements show that any Shockley–Read–Hall currents in the depletion region of these devices have lifetimes that are reproducibly greater than 100 ms. Under the assumption of comparable lifetimes at higher temperatures, it is predicted that fully-depleted background radiation-limited performance can be expected for 10-μm cutoff detectors from room temperature to well below liquid nitrogen temperatures, with room-temperature dark current nearly 400 times lower than predicted by Rule 07. The hetero-junction p-i-n diode is shown to have numerous other significant potential advantages including minimal or no passivation requirements for pBn-like processing, low 1/f noise, compatibility with small pixel pitch while maintaining high modulation transfer function, low crosstalk and good quantum efficiency. By appropriate design of the FPA dewar shielding, analysis shows that dark current can theoretically be further reduced below the thermal equilibrium radiative limit. Modeling shows that background radiation-limited LWIR HgCdTe operating with f/1 optics has the potential to operate within √2 of background-limited performance at 215 K. By reducing the background radiation by 2/3 using novel shielding methods, operation with a single-stage thermo-electric-cooler may be possible. If the background radiation can be reduced by 90%, then room-temperature operation is possible.

Dislocations as a Noise Source in LWIR HgCdTe Photodiodes

The effect of dislocation on the 1/f noise current in long-wavelength infrared (LWIR) reverse biased HgCdTe photodiodes working at liquid nitrogen (LN) temperature was analyzed theoretically by using a phenomenological model of dislocations as an additional Shockley–Read–Hall (SRH) generation–recombination (G–R) channel in heterostructure. Numerical analysis was involved to solve the set of transport equations in order to find a steady state values of physical parameters of the heterostructure. Next, the set of transport equations for fluctuations (TEFF) was formulated and solved to obtain the spectral densities (SD) of the fluctuations of electrical potential, quasi-Fermi levels, and temperature. The SD of mobility fluctuations, shot G–R noise, and thermal noise were also taken into account in TEFF. Additional expressions for SD of 1/f fluctuations of the G–R processes were derived. Numerical values of the SD of noise current were compared with the experimental results of Johnson et al. Theoretical analysis has shown that the dislocations increase the G–R processes and this way cause the growth of G–R dark current. Despite the fact that dislocations increase both shot G–R noise and 1/f G–R noise, the main cause of 1/f current noise in LN cooled LWIR photodiodes are fluctuations of the carriers mobility determined by 1/f fluctuations of relaxation times. As the noise current is proportional to the total diode current, growth of G–R dark current caused by dislocations leads to the growth of noise current.

Applications of the Infrared Measurement Analyzer: Hydrogenated LWIR HgCdTe Detectors

Low-cost silicon-based alternative substrates are an attractive choice for next-generation large-area high-resolution multicolor infrared (IR) detector arrays. However, the high density of dislocations formed during molecular-beam epitaxy growth of HgCdTe/CdTe/Si limits the performance of IR arrays, especially in the long-wavelength infrared (LWIR) region. Atomic hydrogen introduced by inductively coupled plasma (ICP) into HgCdTe is expected to passivate dislocations, bulk and surface defects, removing their contributions to dark current. Passivation using ICP hydrogenation can have different effects on HgCdTe photodiode performance, depending on which class of defects is being passivated. The infrared measurement analyzer (IRMA) was used to deconvolute the effects of hydrogenation on LWIR HgCdTe photodiodes through a reverse-modeling fit of the current–voltage (I–V) characteristic. This approach results in a fit with fewer false minima, low parameter error and bias, and high confidence in extracted device parameters. A description of this tool and its application to hydrogenated HgCdTe LWIR detectors is presented. Lower dark currents have been observed after hydrogenation of fully fabricated devices. Model-fits performed on a wide variety of LWIR HgCdTe photodiodes suggest that hydrogenation provides both surface and bulk quality improvements. These benefits of ICP hydrogenation have been retained over several months.

Temperature dependence characteristics of dark current for arsenic doped LWIR HgCdTe detectors

Resistance–voltage (R–V) curves of arsenic doped long-wavelength infrared (LWIR) Mercury Cadmium Telluride (HgCdTe) photodiodes were measured in the temperature range of 59–92K. The dark current characteristics of HgCdTe junction diode are presented by using a simultaneous-mode nonlinear fitting method. The observed R–V characteristics have been shown in agreement with the theoretical calculation by taking into account the contributions: (i) diffusion mechanism (Rdiff), (ii) generation–recombination mechanism (Rgr) in the depletion region, (iii) trap-assisted tunneling mechanism (Rtat), and (iv) band-to-band tunneling mechanism (Rbbt). Six characteristic parameters as function of temperature are extracted from the measured current–voltage (I–V) curves by considering the dominant current mechanisms under different bias levels. The fitted current components under different temperatures show that, as the temperature rises, the contribution to the dominant dark current component around maximum dynamic resistance range is changed from the trap-assisted tunneling and diffusion currents to the generation recombination effect. This change indicates that the dark current component may mainly be caused by the generation recombination current, which limits the performance of arsenic doped LWIR HgCdTe detectors.

Smart Reset Control for Wide-Dynamic-Range LWIR FPAs

A new readout circuit involving a pixel-level reset control was studied for 2-D long-wavelength infrared (LWIR) focal plane arrays. The integration time of each pixel can be optimized individually and automatically. Hence, the readout circuit has a wide dynamic range and good signal-to-noise ratio (SNR) characteristics. The readout circuit was fabricated with a 0.35-μm 2-poly 4-metal CMOS process for a 128 × 128 LWIR HgCdTe array with a pixel size of 50 μm × 50 μm. The smart reset control with two-step background suppression improves the SNR to 87 dB and the dynamic range to 95.8 dB.

High frequency response of near-room temperature LWIR HgCdTe heterostructure photodiodes

The high frequency response of near-room temperature long wavelength infrared (LWIR) HgCdTe heterostructure photodiodes is investigated using a Fourier space method. The MOCVD HgCdTe multilayer heterostructures were grown on GaAs substrates. The response time of devices as a function of bias has been measured experimentally by using 10-μm quantum cascade laser and fast oscilloscope with suitable transimpedance amplifier. Results of theoretical predictions are compared with experimental data. It is shown that the response time at weak reverse bias condition is mainly limited by the drift time of carriers moving into π-n+ junction. Using the reverse bias higher than 50 mV, the transit time across the absorber region limits the response time. The response time of small-area devices decreases in the region of week reverse bias achieving value below 1 ns.

High frequency response of near-room temperature LWIR HgCdTe heterostructure photodiodes

AbstractThe high frequency response of near-room temperature long wavelength infrared (LWIR) HgCdTe heterostructure photodiodes is investigated using a Fourier space method. The MOCVD HgCdTe multilayer heterostructures were grown on GaAs substrates. The response time of devices as a function of bias has been measured experimentally by using 10-μm quantum cascade laser and fast oscilloscope with suitable transimpedance amplifier. Results of theoretical predictions are compared with experimental data. It is shown that the response time at weak reverse bias condition is mainly limited by the drift time of carriers moving into π-n+ junction. Using the reverse bias higher than 50 mV, the transit time across the absorber region limits the response time. The response time of small-area devices decreases in the region of week reverse bias achieving value below 1 ns.

Characterization of LWIR diodes on InAs/GaSb Type-II superlattice material

Long wavelength infrared (LWIR) focal plane arrays (FPAs) built on Type-II strained layer InAs/GaSb superlattice materials are emerging as an alternative to LWIR HgCdTe. We have made progress in the development of this technology in a collaborative effort between Raytheon Vision Systems and Jet Propulsion Laboratory, resulting in successful devices with LWIR cutoff wavelengths. We report here two investigations related to wafer processing and superlattice material characteristics. The critical interface between the superlattice and the silicon dioxide passivation was examined at the atomic scale by high resolution transmission electron microscopy (HRTEM), showing a conformal coating on an InAs/GaSb mesa sidewall, which undulates with the superlattice periodicity due to differential etching. Electron energy loss spectroscopy (EELS) showed that oxides of the superlattice elements were present but minimal, and some occasional arsenic precipitates were observed at the passivation interface. Our previous analysis of the current–voltage curves was extended further to reveal the minority carrier lifetimes responsible for producing the generation–recombination (GR) and the diffusion dark currents. Lifetimes at 78 K were found to be 6 and 20 ns in the GR and diffusion processes, respectively. Lifetimes from both mechanisms track together with temperature. A HgCdTe diode was analyzed in the same manner for comparison.

Status of LWIR HgCdTe-on-Silicon FPA Technology

The use of silicon as an alternative substrate to bulk CdZnTe for epitaxial growth of HgCdTe for infrared detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low-defect-density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for long-wavelength infrared (LWIR) HgCdTe detectors where the performance can be limited by the high (∼5 × 10 6 cm -2 ) dislocation density typically found in HgCdTe grown on silicon. The current status of LWIR (9 μm to 11 μm at 78 K) HgCdTe on silicon focal-plane arrays (FPAs) is reviewed. Recent progress is covered including improvements in noise equivalent differential temperature (NEDT) and array operability. NEDT of 99% are highlighted for 640 x 480 pixel, 20-μm-pitch FPAs.

LWIR HgCdTe Detectors Grown on Ge Substrates

Long-wavelength infrared (LWIR) HgCdTe p-on-n double-layer heterojunctions (DLHJs) for infrared detector applications have been grown on 100 mm Ge (112) substrates by molecular beam epitaxy (MBE). The objective of this current work was to grow our baseline p-on-n DLHJ detector structure (used earlier on Si substrates) on 100 mm Ge substrates in the 10 μm to 11 μm LWIR spectral region, evaluate the material properties, and obtain some preliminary detector performance data. Material characterization techniques included are X-ray rocking curves, etch pit density (EPD) measurements, compositional uniformity determined from Fourier-transform infrared (FTIR) transmission, and doping concentrations determined from secondary-ion mass spectroscopy (SIMS). Detector properties include resistance-area product (RoA), spectral response, and quantum efficiency. Results of LWIR HgCdTe detectors and test structure arrays (TSA) fabricated on both Ge and silicon (Si) substrates are presented and compared. Material properties demonstrated include X-ray full-width of half-maximum (FWHM) as low as 77 arcsec, typical etch pit densities in mid 106 cm−2 and wavelength cutoff maximum/minimum variation <2% across the full wafer. Detector characteristics were found to be nearly identical for HgCdTe grown on either Ge or Si substrates.

Lateral Diffusion Length Changes in HgCdTe Detectors in a Proton Environment

This paper presents a study of the performance degradation in a proton environment of long wavelength infrared (LWIR) HgCdTe detectors. The energy dependence of the Non-Ionizing Energy Loss (NIEL) in HgCdTe provides a framework for estimating the responsivity degradation in LWIR HgCdTe detectors due to on-orbit exposure from protons. Banded detector arrays of different detector designs were irradiated at proton energies of 7, 12, and 63 MeV. These banded detector arrays allowed insight into how the fundamental detector parameters degraded in a proton environment at the three different proton energies. Measured data demonstrated that the detector responsivity degradation at 7 MeV is 5 times larger than the degradation at 63 MeV. Comparison of the responsivity degradation at the different proton energies suggests that the atomic Columbic interaction of the protons with the HgCdTe detector is likely the primary mechanism responsible for the degradation in responsivity at proton energies below 30 MeV.

Role of Dislocation Scattering on the Electron Mobility of n-Type Long Wave Length Infrared HgCdTe on Silicon

It has been reported that the basic electrical properties of n-type long wave length infrared (LWIR) HgCdTe grown on silicon, including the majority carrier mobility (μ e) and minority carrier lifetime (τ), are qualitatively comparable to those reported for LWIR HgCdTe grown on bulk CdZnTe by molecular beam epitaxy (MBE). Detailed measurements of the majority carrier mobility have revealed important differences between the values measured for HgCdTe grown on bulk CdZnTe and those measured for HgCdTe grown on buffered silicon substrates. The mobility of LWIR HgCdTe grown on buffered silicon by MBE is reported over a large temperature range and is analyzed in terms of standard electron scattering mechanisms. The role of dislocation scattering is addressed for high dislocation density HgCdTe grown on lattice-mismatched silicon. Differences between the low temperature mobility data of HgCdTe grown on bulk CdZnTe and HgCdTe grown on silicon are partially explained in terms of the dislocation scattering contribution to the total mobility.

Material considerations for third generation infrared photon detectors

In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well photoconductors are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. The metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an alternative to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25μm. In this context the material properties of type II superlattices are considered more in detail.

Competitive technologies of third generation infrared photon detectors

AbstractHitherto, two families of multielement infrared (IR) detectors are used for principal military and civilian infrared applications; one is used for scanning systems (first generation) and the other is used for staring systems (second generation). Third generation systems are being developed nowadays. In the common understanding, third generation IR systems provide enhanced capabilities like larger number of pixels, higher frame rates, better thermal resolution as well as multicolour functionality and other on-chip functions.In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well IR photoconductors (QWIPs) are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. However, the metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an attractive to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm.

Molecular beam epitaxy grown long wavelength infrared HgCdTe on Si detector performance

The use of silicon as a substrate alternative to bulk CdZnTe for epitaxial growth of HgCdTe for infrared (IR) detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low defect density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for LWIR HgCdTe detectors where the performance can be limited by the high (∼5×106 cm−2) dislocation density typically found in HgCdTe grown on silicon. We have fabricated a series of long wavelength infrared (LWIR) HgCdTe diodes and several LWIR focal plane arrays (FPAs) with HgCdTe grown on silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s planar diode architecture. The diode and FPA and results at 78 K will be discussed in terms of the high dislocation density (∼5×106 cm2) typically measured when HgCdTe is grown on silicon substrates.

Long wavelength infrared, molecular beam epitaxy, HgCdTe-on-Si diode performance

In the past several years, we have made significant progress in the growth of CdTe buffer layers on Si wafers using molecular beam epitaxy (MBE) as well as the growth of HgCdTe onto this substrate as an alternative to the growth of HgCdTe on bulk CdZnTe wafers. These developments have focused primarily on mid-wavelength infrared (MWIR) HgCdTe and have led to successful demonstrations of high-performance 1024×1024 focal plane arrays (FPAs) using Rockwell Scientific’s double-layer planar heterostructure (DLPH) architecture. We are currently attempting to extend the HgCdTe-on-Si technology to the long wavelength infrared (LWIR) and very long wavelength infrared (VLWIR) regimes. This is made difficult because the large lattice-parameter mismatch between Si and CdTe/HgCdTe results in a high density of threading dislocations (typically, >5E6 cm−2), and these dislocations act as conductive pathways for tunneling currents that reduce the RoA and increase the dark current of the diodes. To assess the current state of the LWIR art, we fabricated a set of test diodes from LWIR HgCdTe grown on Si. Silicon wafers with either CdTe or CdSeTe buffer layers were used. Test results at both 78 K and 40 K are presented and discussed in terms of threading dislocation density. Diode characteristics are compared with LWIR HgCdTe grown on bulk CdZnTe.

HgCdTe/Si materials for long wavelength infrared detectors

The heteroepitaxial growth of HgCdTe on large-area Si substrates is an enabling technology leading to the production of low-cost, large-format infrared focal plane arrays (FPAs). This approach will allow HgCdTe FPA technology to be scaled beyond the limitations of bulk CdZnTe substrates. We have already achieved excellent mid-wavelength infrared (MWIR) and short wavelength infrared (SWIR) detector and FPA results using HgCdTe grown on 4-in. Si substrates using molecular beam epitaxy (MBE), and this work was focused on extending these results into the long wavelength infrared (LWIR) spectral regime. A series of nine p-on-n LWIR HgCdTe double-layer heterojunction (DLHJ) detector structures were grown on 4-in. Si substrates. The HgCdTe composition uniformity was very good over the entire 4-in. wafer with a typical maximum nonuniformity of 2.2% at the very edge of the wafer; run-to-run composition reproducibility, realized with real-time feedback control using spectroscopic ellipsometry, was also very good. Both secondary ion mass spectrometry (SIMS) and Hall-effect measurements showed well-behaved doping and majority carrier properties, respectively. Preliminary detector results were promising for this initial work and good broad-band spectral response was demonstrated; 61% quantum efficiency was measured, which is very good compared to a maximum allowed value of 70% for a non-antireflection-coated Si surface. The R0A products for HgCdTe/Si detectors in the 9.6-µm and 12-µm cutoff range were at least one order of magnitude below typical results for detectors fabricated on bulk CdZnTe substrates. This lower performance was attributed to an elevated dislocation density, which is in the mid-106 cm−2 range. The dislocation density in HgCdTe/Si needs to be reduced to <106 cm−2 to make high-performance LWIR detectors, and multiple approaches are being tried across the infrared community to achieve this result because the technological payoff is significant.

Proton-induced transients and charge collection measurements in a LWIR HgCdTe focal plane array

We compare measurements and modeling of 27 and 63 MeV proton-induced transients in a large-format HgCdTe long wavelength infrared (LWIR) focal plane assembly operating at 40 K. Charge collection measurements describe very limited diffusion of carriers to multiple pixels showing significantly reduced particle induced cross-talk for the lateral diffusion structure.