It is widely inferred that Light and Elevated Temperature Induced Degradation (LeTID) is attributed to the diffusion of hydrogen into bulk silicon from the rear PECVD SiNx:H layer of PERC during the high-temperature firing process. We propose not only a simplified heat treatment flow for the typical PERC structure but also a new degradation-reduced structure with sputtered SiNx. The common N2 annealing after Al2O3 formation can be skipped to reduce process complexity and cost because we found that the lifetime can be even improved by omitting the moderate-temperature annealing while retaining the unavoidable high-temperature firing process for metallization. In the light soaking measurement of lifetime, the sputtered-SiNx passivated wafer displayed a higher lifetime than the PECVD-SiNx:H passivated wafer. The absence of excess hydrogen in the sputtered-SiNx film contributes to the suppression of LeTID. We further demonstrate that the sputtered-SiNx cells own higher VOC compared to PECVD-SiNx:H cells under light soaking.
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