Laser beam welding of aluminum (Al) to copper (Cu) is challenging due to the formation of intermetallic compounds that are brittle and have high resistivities. However, the Cu/Al phase diagram shows a region were solubility of Cu in Al is present and, on the other hand, a region with the formation of a eutectic phase between α-Al and Al2Cu is present as well. Targeting this area turned to be advantageous for solid state welding, as shown for probeless Friction-Stir-Spot-Welding realizing ductile joints between Al and Cu.In this paper an approach based on indirect laser welding of Cu with Al will be presented and discussed. A green laser was used in order to join Cu to Al in lap joint configuration. The laser beam irradiates the Cu surface, whereby the formation of a common melt pool between Cu and Al is avoided. The heat input and the temperature gradient are assumed to support diffusion at the interface between Cu and Al forming a near eutectic layer. Indeed, a melting layer is formed at the interface between Cu and Al supporting joint formation based on a firmly bonding between both materials. The solidified layer presents a copper rich area towards the copper sheet with plate-like structures of Al2Cu, a region with α-Al crystals on the aluminum side and a eutectic layer of lamellar Al2Cu and α-Al in between. The described morphology is very similar to investigations on probeless Friction-Stir-Spot-Welding, whereas a very low pressure is adopted in indirect laser welding and Al-oxide layer seems not to act as a barrier for joint formation.
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