Junction Temperature Of LED Chip Research Articles

LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug

The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.

结温对GaN基白光LED光学特性的影响

A white LED sample was fabricated which can be used to characterize the resistance of nGaN at the range of 20 to 170 ℃.The results reveal an exponential relation between resistance and temperature.This relation is utilized to detect junction temperature of LED chip by measuring the resistance of n-GaN in a working LED.The white LED working in different junction temperature was achieved by changing the temperature of its heat sink.Their colorimetric parameters are measured simultaneously.These results show that the peak wavelength,rendering index,color temperature and luminous flux of white LED have a linear relationship with junction temperature.