Electron Ionization Coefficients Research Articles

Impact ionization coefficients along 4H-SiC ⟨11-20⟩ in a wide temperature range

Abstract The impact ionization coefficients along 4H-SiC ⟨11-20⟩ were determined in a wide temperature range from 294 K to 473 K. 4H-SiC (11-20) p-n diodes were fabricated and photomultiplication measurements were conducted on two types of photodiodes to measure the multiplication factors of carriers. The extracted impact ionization coefficients of both electrons and holes along 4H-SiC ⟨11-20⟩ decreased at high temperatures, which can be ascribed to the enhanced phonon scattering. On the basis of the results above, the critical electric field along 4H-SiC ⟨11-20⟩ calculated from the obtained impact ionization coefficients increased with the temperature.

Impact ionization coefficients and excess noise in Al0.55Ga0.45As0.56Sb0.44 lattice matched to InP

The avalanche multiplication and noise characteristics of Al0.55Ga0.45As0.56Sb0.44p–i–n and n–i–p structures grown lattice matched on InP have been investigated. From measurements undertaken using 530 nm illumination on several devices, the electron (α) and hole (β) impact ionization coefficients have been determined. While α only shows a relatively small increase compared to the higher Al composition alloys of AlxGa1−xAsSb, β is found to increase significantly. Although the β/α ratio is increased to ∼0.125–0.2, higher than the ∼0.003–0.02 seen in the higher-Al alloys, a relatively low excess noise factor of 2.2 was measured in the p-i-n with electron-initiated multiplication of 20. This noise performance is significantly lower than that predicted using a local-field model and comparable to some commercial silicon APDs. This avalanching material with a bandgap of ∼1.24 eV will have the advantages of a smaller band discontinuity with the absorber region and should also operate at a lower voltage.

Very low excess noise Al0.75Ga0.25As0.56Sb0.44 avalanche photodiode.

AlxGa1-xAsySb1-y grown lattice-matched to InP has attracted significant research interest as a material for low noise, high sensitivity avalanche photodiodes (APDs) due to its very dissimilar electron and hole ionization coefficients, especially at low electric fields. All work reported to date has been on Al concentrations of x = 0.85 or higher. This work demonstrates that much lower excess noise (F = 2.4) at a very high multiplication of 90 can be obtained in thick Al0.75Ga0.25As0.56Sb0.44 grown on InP substrates. This is the lowest excess noise that has been reported in any III-V APD operating at room temperature. The impact ionization coefficients for both electrons and holes are determined over a wide electric field range (up to 650 kV/cm) from avalanche multiplication measurements undertaken on complementary p-i-n and n-i-p diode structures. While these ionization coefficients can fit the experimental multiplication over three orders of magnitude, the measured excess noise is significantly lower than that expected from the β/α ratio and the conventional local McIntyre noise theory. These results are of importance not just for the design of APDs but other high field devices, such as transistors using this material.

Anomalous excess noise behavior in thick Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes

Al0.85Ga0.15As0.56Sb0.44 has recently attracted significant research interest as a material for 1550 nm low-noise short-wave infrared (SWIR) avalanche photodiodes (APDs) due to the very wide ratio between its electron and hole ionization coefficients. This work reports new experimental excess noise data for thick Al0.85Ga0.15As0.56Sb0.44 PIN and NIP structures, measuring low noise at significantly higher multiplication values than previously reported (F = 2.2 at M = 38). These results disagree with the classical McIntyre excess noise theory, which overestimates the expected noise based on the ionization coefficients reported for this alloy. Even the addition of ‘dead space’ effects cannot account for these discrepancies. The only way to explain the low excess noise observed is to conclude that the spatial probability distributions for impact ionization of electrons and holes in this material follows a Weibull–Fréchet distribution function even at relatively low electric-fields. Knowledge of the ionization coefficients alone is no longer sufficient to predict the excess noise properties of this material system and consequently the electric-field dependent electron and hole ionization probability distributions are extracted for this alloy.

Study of Impact Ionization Coefficients in Silicon With Low Gain Avalanche Diodes

Impact ionization in silicon devices has been extensively studied and several models for a quantitative description of the impact ionization coefficients have been proposed. We evaluate those models against gain measurements on Low Gain Avalanche diodes (LGADs) and derive new parameterizations for the impact ionization coefficients optimized to describe a large set of experimental data. We present pulsed IR-laser based gain measurements on 5 different types of $50\mu m$-thick LGADs from two different producers (CNM and HPK) performed in a temperature range from $-15^oC$ to $40^oC$. Detailed TCAD device models are conceived based on SIMS doping profiles measurements and tuning of the device models to measured C-V characteristics. Electric field profiles are extracted from the TCAD simulations and used as input to an optimization procedure (least squares fit) of the impact ionization model parameters to the experimental data. It is demonstrated that the new parameterizations give a good agreement between all measured data and TCAD simulations which is not achieved with the existing models. Finally, we provide an error analysis and compare the obtained values for the electron and hole impact ionization coefficients against existing models.

Modeling of Strong Wind-Sand Dielectric Streamer Discharge

Due to the complex and harsh climate environment in Northwest China, the external insulation of power lines and high-speed train are exposed to strong wind-sand environment all year round, which brings severe challenges to the external insulation design and protection of the electric systems. Based on the theories of streamer discharge, the plate-plate electrode was taken as the analysis object, and a theoretical physical model of the strong wind-sand dielectric discharge is established. In this model, the analytical expressions of electron ionization coefficient and positive ion generation coefficient in a wind-sand environment are deduced considering the combined effects of the airflow velocity, the distortion of the electric field caused by sand particles, and the electrons captured by sand particles in the discharge process; furthermore, the streamer breakdown criterion in wind-sand environment is proposed. Research results can provide an important theoretical basis for the quantitative calculation of the breakdown voltage and the external insulation protection in a strong wind-sand environment.

Temperature Dependence of the Impact Ionization Coefficients in AlAsSb Lattice Matched to InP

The temperature dependence of the ionization coefficients of AlAsSb has been determined from 210 K to 335 K by measuring the avalanche multiplication in a series of three <i>p^&#x002B;-i-n^&#x002B;</i> and two <i>n^&#x002B;-i-p^&#x002B;</i> diodes. Both electron and hole ionization coefficients reduce at approximately the same rate as the temperature increases but much less so than in InAlAs or InP. This results in a significantly smaller breakdown voltage variation with temperature of 13 mV&#x002F;K in a 1.55 &#x03BC;m thick <i>p^&#x002B;-i-n^&#x002B;</i> structure and a calculated 15.58 mV&#x002F;K for a 10 Gb&#x002F;s InGaAs&#x002F;AlAsSb separate absorption and multiplication avalanche photodiode (SAM-APD). Monte-Carlo modelling suggests that the primary reason for this reduced temperature dependence is the increased alloy scattering in the Sb containing alloy, reducing the impact of variation in phonon scattering rate with temperature.

Monopolarity of hot charge carrier multiplication in A-=SUP=-III-=/SUP=-B-=SUP=-V-=/SUP=- semiconductors at high electric field and noiseless avalanche photodiodes (a R e v i e w)

The results of theoretical and experimental studies of impact ionization processes and charge carrier heating in multi-valley AIIIBV semiconductors at high electric field are presented and their relationship with the features of the band structure is discussed. A role of subsidiary L- and X-valleys, complex structure of the valence band and orientation dependence of the ionization coefficients are taken into account. A new approach to the choice of semiconductor materials with a large ratio of the ionization coefficients of holes and electrons to create the noiseless avalanche photodiodes due to monopolarity of hot charge carrier multiplication is proposed. Keywords: impact ionization, multi-valley semiconductors, band structure, monopolarity of multiplication, avalanche photodiodes.

Valence band engineering of GaAsBi for low noise avalanche photodiodes

Avalanche Photodiodes (APDs) are key semiconductor components that amplify weak optical signals via the impact ionization process, but this process’ stochastic nature introduces ‘excess’ noise, limiting the useful signal to noise ratio (or sensitivity) that is practically achievable. The APD material’s electron and hole ionization coefficients (α and β respectively) are critical parameters in this regard, with very disparate values of α and β necessary to minimize this excess noise. Here, the analysis of thirteen complementary p-i-n/n-i-p diodes shows that alloying GaAs with ≤ 5.1 % Bi dramatically reduces β while leaving α virtually unchanged—enabling a 2 to 100-fold enhancement of the GaAs α/β ratio while extending the wavelength beyond 1.1 µm. Such a dramatic change in only β is unseen in any other dilute alloy and is attributed to the Bi-induced increase of the spin-orbit splitting energy (∆so). Valence band engineering in this way offers an attractive route to enable low noise semiconductor APDs to be developed.

Impact ionization coefficients and critical electric field in GaN

Avalanche multiplication characteristics in a reverse-biased homoepitaxial GaN p–n junction diode are experimentally investigated at 223–373 K by novel photomultiplication measurements utilizing above- and below-bandgap illumination. The device has a non-punch-through one-side abrupt p–-n+ junction structure, in which the depletion layer mainly extends to the p-type region. For above-bandgap illumination, the light is absorbed at the surface p+-layer, and the generated electrons diffuse and reach the depletion layer, resulting in an electron-injected photocurrent. On the other hand, for below-bandgap illumination, the light penetrates a GaN layer and is absorbed owing to the Franz–Keldysh effect in the high electric field region (near the p–n junction interface), resulting in a hole-induced photocurrent. The theoretical (non-multiplicated) photocurrents are calculated elaborately, and the electron- and hole-initiated multiplication factors are extracted as ratios of the experimental data to the calculated values. Through the mathematical analyses of the multiplication factors, the temperature dependences of the impact ionization coefficients of electrons and holes in GaN are extracted and formulated by the Okuto–Crowell model. The ideal breakdown voltage and the critical electric field for GaN p–n junctions of varying doping concentration are simulated using the obtained impact ionization coefficients, and their temperature dependence and conduction-type dependence were discussed. The simulated breakdown characteristics show good agreement with data reported previously, suggesting the high accuracy of the impact ionization coefficients obtained in this study.

Low Noise Short Wavelength Infrared Avalanche Photodetector Using SB-Based Strained Layer Superlattice

We demonstrate low noise short wavelength infrared (SWIR) Sb-based type II superlattice (T2SL) avalanche photodiodes (APDs). The SWIR GaSb/(AlAsSb/GaSb) APD structure was designed based on impact ionization engineering and grown by molecular beam epitaxy on a GaSb substrate. At room temperature, the device exhibits a 50% cut-off wavelength of 1.74 µm. The device was revealed to have an electron-dominated avalanching mechanism with a gain value of 48 at room temperature. The electron and hole impact ionization coefficients were calculated and compared to give a better prospect of the performance of the device. Low excess noise, as characterized by a carrier ionization ratio of ~0.07, has been achieved.

Comprehensive Studies on Steady-State and Transient Electronic Transport in In0.52Al0.48As

High electron mobility transistors (HEMT) built using In\textsubscript{0.52}Al\textsubscript{0.48}As/In\textsubscript{0.53}Ga\textsubscript{0.47}As on InP substrates are a focus of considerable experimental studies due to their favourable performance for microwave, optical and digital applications. We present a detailed and comprehensive study of steady state and transient electronic transport in In\textsubscript{0.52}Al\textsubscript{0.48}As with the three valley model using the semi-classical ensemble Monte Carlo method and including all important scattering mechanisms. All electronic transport parameters such drift velocity, valley occupation, average electron energy, ionization coefficient and generation rate, electron effective mass, diffusion coefficient, energy and momentum relaxation time are extracted rigorously from the simulations. Using these, we present a complete characterization of the transient electronic transport showing the variation of drift velocity with distance and time. We have then estimated the optimal cut-off frequencies for various device lengths via the velocity overshoot effect. Our analysis shows that for device lengths shorter than $700$ nm, transient effects are significant and should be taken into account for optimal device designs. As a critical example, at length scales of around $100$ nm, we obtain a significant improvement in the cut-off frequency from $261$ GHz to $663$ GHz with the inclusion of transient effects. The field dependence of all extracted parameters here can prove to be helpful for further device analysis and design.

Theoretical Analysis of AlAs₀.₅₆Sb₀.₄₄ Single Photon Avalanche Diodes With High Breakdown Probability

Single photon avalanche diodes (SPADs) are key enabling technologies for a wide range of applications in the near-infrared wavelength range. Recently, AlAs <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.56</sub> Sb <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.44</sub> (hereafter AlAsSb) lattice-matched to InP has been demonstrated for extremely low excess noise avalanche photodiodes (APDs) due to its large disparity between electron and hole ionization coefficients ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\alpha $ </tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> respectively). The <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\alpha /\beta $ </tex-math></inline-formula> ratio also plays a role in Geiger mode operation as it affects the avalanche breakdown probability and hence detection efficiency. In this work, we theoretically investigate the performance of AlAsSb based SPADs. The probability of breakdown for electron-initiated Geiger mode operation increases more sharply with multiplication region width due to progressively more dissimilar ionization coefficients. In comparison with other common avalanche materials, such as InAlAs, InP and Si, our result also suggests that SPADs based on AlAsSb have a sharper breakdown probability than the other three materials under similar low overbias ratio. The calculated breakdown probability of 0.81 in AlAsSb is 0.18 and 0.28 higher than that of InAlAs/Si and InP respectively at 5% overbias ratio and with avalanche region width of 1500 nm.

Mid-wavelength infrared avalanche photodetector with AlAsSb/GaSb superlattice

In this work, a mid-wavelength infrared separate absorption and multiplication avalanche photodiode (SAM-APD) with 100% cut-off wavelength of ~ 5.0 µm at 200 K grown by molecular beam epitaxy was demonstrated. The InAsSb-based SAM-APD device was designed to have electron dominated avalanche mechanism via the band structure engineered multi-quantum well structure based on AlAsSb/GaSb H-structure superlattice and InAsSb material in the multiplication region. The device exhibits a maximum multiplication gain of 29 at 200 K under -14.7 bias voltage. The maximum multiplication gain value for the MWIR SAM-APD increases from 29 at 200 K to 121 at 150 K. The electron and hole impact ionization coefficients were derived and the large difference between their value was observed. The carrier ionization ratio for the MWIR SAM-APD device was calculated to be ~ 0.097 at 200 K.

Low noise Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes on InP substrates

We report on the demonstration of Al0.85Ga0.15As0.56Sb0.44 (hereafter, AlGaAsSb) avalanche photodiodes (APDs) with a 1000 nm-thick multiplication layer. Such a thick AlGaAsSb device was grown by a digital alloy technique to avoid phase separation. The current-voltage measurements under dark and illumination conditions were performed to determine gain for the AlGaAsSb APDs. The highest gain was ∼ 42, and the avalanche initiation occurred at 21.6 V. The breakdown voltage was found to be around −53 V. The measured dark current densities of bulk and surface components were 6.0 μA/cm2 and 0.23 μA/cm, respectively. These values are about two orders of magnitude lower than those for previously reported 1550 nm-thick AlAs0.56Sb0.44 APDs [Yi et al., Nat. Photonics 13, 683 (2019)]. Excess noise measurements showed that the AlGaAsSb APD has a low k of 0.01 (the ratio of electron and hole impact ionization coefficients) compared to Si APDs. The k of the 1000-nm AlGaAsSb APD is similar to that of the thick AlAsSb APDs (k ∼ 0.005) and 5–8 times lower than that of 170 nm-thick AlGaAsSb APDs (k ∼ 0.5–0.8). Increasing the thickness of the multiplication layer over 1000 nm can also reduce k further since the difference between electron and hole impact ionization coefficients becomes significant in this material system as the thickness of the multiplication layer increases. Therefore, this thick AlGaAsSb-based APD on an InP substrate shows the potential to be a high-performance multiplier that can be used with available short-wavelength infrared (SWIR) absorption layers for a SWIR APD.

Temperature Dependence of Electron and Hole Impact Ionization Coefficients in GaN

The temperature dependence of the electron and hole impact ionization coefficients in GaN has been investigated experimentally. Two types of p-i-n diodes grown on bulk GaN substrates have been fabricated and characterized, and the impact ionization coefficients for both electrons and holes have been extracted using the photomultiplication method. Both the electron and hole impact ionization coefficients decrease as the temperature increases. The Okuto–Crowell model was used to describe the temperature dependence of the electron and hole impact ionization coefficients. Based on the measured impact ionization coefficients, the temperature dependence of the breakdown voltage of GaN non-punch through p-n diodes can be predicted; good agreement with experimentally reported results is obtained.

Монополярное умножение горячих носителей заряда в полупроводниках A-=SUP=-III-=/SUP=-B-=SUP=-V-=/SUP=- в сильном электрическом поле и бесшумные лавинные фотодиоды (О б з о р)

The results of theoretical and experimental studies of impact ionization processes and charge carrier heating in multi-valley A3B5 semiconductors at high electric field are presented and their relationship with the features of the band structure is discussed. A role of subsidiary L- and X-valleys, complex structure of the valence band and orientation dependence of the ionization coefficients are taken into account. A new approach to the choice of semiconductor materials with a large ratio of the ionization coefficients of holes and electrons to create the noiseless avalanche photodiodes due to monopolarity of hot charge carrier multiplication is proposed.

Avalanche Photodetector Based on InAs/InSb Superlattice

This work demonstrates a mid-wavelength infrared InAs/InSb superlattice avalanche photodiode (APD). The superlattice APD structure was grown by molecular beam epitaxy on GaSb substrate. The device exhibits a 100 % cut-off wavelength of 4.6 µm at 150 K and 4.30 µm at 77 K. At 150 and 77 K, the device responsivity reaches peak values of 2.49 and 2.32 A/W at 3.75 µm under −1.0 V applied bias, respectively. The device reveals an electron dominated avalanching mechanism with a gain value of 6 at 150 K and 7.4 at 77 K which was observed under −6.5 V bias voltage. The gain value was measured at different temperatures and different diode sizes. The electron and hole impact ionization coefficients were calculated and compared to give a better prospect of the performance of the device.

Characterization of Impact Ionization Coefficient of ZnO Based on a p-Si/i-ZnO/n-AZO Avalanche Photodiode.

The avalanche photodiode is a highly sensitive photon detector with wide applications in optical communication and single photon detection. ZnO is a promising wide band gap material to realize a UV avalanche photodiode (APD). However, the lack of p-type doping, the strong self-compensation effect, and the scarcity of data on the ionization coefficients restrain the development and application of ZnO APD. Furthermore, ZnO APD has been seldom reported before. In this work, we employed a p-Si/i-ZnO/n-AZO structure to successfully realize electron avalanche multiplication. Based on this structure, we investigated the band structure, field profile, Current–Voltage (I-V) characteristics, and avalanche gain. To examine the influence of the width of the i-ZnO layer on the performance, we changed the i-ZnO layer thickness to 250, 500, and 750 nm. The measured breakdown voltages agree well with the corresponding threshold electric field strengths that we calculated. The agreement between the experimental data and calculated results supports our analysis. Finally, we provide data on the impact ionization coefficients of electrons for ZnO along the (001) direction, which is of great significance in designing high-performance low excess noise ZnO APD. Our work lays a foundation to realize a high-performance ZnO-based avalanche device.

Experimental determination of impact ionization coefficients of electrons and holes in gallium nitride using homojunction structures

In this study, we experimentally determined the impact ionization coefficients of GaN using homoepitaxially grown p-n diodes with avalanche capability. The extracted hole impact ionization coefficient is obtained as β(E) = 4.39 × 106 exp (−1.8 × 107/E) cm−1, and the electron impact ionization coefficient is obtained as α(E) = 2.11 × 109 exp (−3.689 × 107/E) cm−1. This study also presents the temperature dependence of impact ionization coefficients in GaN. The results presented in this experimental study are an important contribution to the database on the material properties of GaN, which will enable more accurate prediction of the avalanche in GaN devices.