International Solid-State Circuits Conference Research Articles

Guest Editorial Selected Papers From the 2023 IEEE International Solid-State Circuits Conference

Guest Editorial Selected Papers From the 2023 IEEE International Solid-State Circuits Conference

Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC)

Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC)

Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC)

Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC)

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is “Building on 70 Years of Innovation in Solid-State Circuit Design.” The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this year’s ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

Welcome to the Winter 2023 Issue of IEEE Solid-State Circuits Magazine! [Editor’s Note]

This first issue of the 15th year of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Solid-State Circuits Magazine</i> is dedicated to the 2023 IEEE Donald O. Pederson Award in Solid-State Circuits and the 70th anniversary of the International Solid-State Circuits Conference (ISSCC). The 2023 theme for ISSCC is “Building on 70 Years of Innovation in Solid-State Circuit Design.” At this year’s ISSCC, the 2023 IEEE Donald O. Pederson Award in Solid-State Circuits will be officially announced. This year’s award goes to Dr. Ingrid Verbauwhede “for pioneering contributions to energy-efficient and high-performance secure integrated circuits and systems.”

Women in Circuits Corner: Women in Circuits Mentoring and Networking Bingo Event at ISSCC 2023 [Society News]

Women in Circuits (WiC) organized a mentoring and networking event that was held at the International Solid-State Circuits Conference (ISSCC) 2023 on Sunday evening, and participants played multiple rounds of getting-to-know-you bingo to prompt discussion prior to an open networking session. The bingo format was developed to encourage mingling and conversation between engineers attending the conference who might otherwise not get to talk to each other. Attendees were assigned to a table and provided with a 3 × 3 matrix to input professional and personal fun facts about themselves. The goal was to find commonalities with other people at the table, thus sparking conversation on shared interests; the first person to cross a row off got bingo! A Python script was used to automate the process of shuffling participants between rounds to new tables so that participants were matched with a unique set of people each time to maximize intermingling. The event was a resounding success, with more than 130 participants; the room was packed to capacity. Winners from each round won IEEE Solid-State Circuits Society (SSCS) swag such as T-shirts, umbrellas, and mugs.

SSCS Winter 2023 AdCom Meeting [Society News]

The IEEE Solid-State Circuits Society (SSCS) had its winter Administrative Committee (AdCom) meeting on 19 February 2023 colocated with the International Solid-State Circuits Conference (ISSCC) 2023. Along with reviewing the year 2022, the SSCS AdCom discussed plans and initiatives for 2023. Please check the SSCS website for updates and information as the year progresses.

IEEE SSCS University of Science and Technology of China Student Branch Chapter Wins Outstanding Chapter of the Year and Holds Numerous Events [Chapters]

The IEEE Solid-State Circuits Society (SSCS) University of Science and Technology of China (USTC) Student Branch Chapter (SBC) won the SSCS Student Branch Chapter of the Year award. The award was received by Chapter Advisor Prof. Fujiang Lin during the Chapter Chair Luncheon at the International Solid-State Circuits Conference, on 21 February 2023.

IEEE SSCS Beijing Chapter Organizes Five ISSCC Promotion Seminars [Chapters]

The IEEE Solid-State Circuits Society (SSCS) Beijing Chapter, together with the SSCS Tsinghua Student Chapter, organized five International Solid-State Circuits Conference (ISSCC) promotion seminars from late March to April, at Tsinghua University, Peking University, Beijing University of Technology, Institute of Semiconductors, Chinese Academy of Sciences, and Beijing University of Posts and Telecommunications, respectively. The participants were mainly undergraduates majoring in electronic engineering and junior graduate students majoring in IC design.

2022–2023 SSCS Student Shirt Design Contest [Society News]

The first-place winner of the 2022–2023 IEEE Solid-State Circuits Society (SSCS) Student Shirt Design Contest is Robin Roy, Amal Jyothi College of Engineering, India. Students were tasked with designing a shirt that illustrates building on 70 years of innovation in solid-state circuit design. Roy’s design features the theme logo on the back side of the shirt with the SSCS and IEEE logos on the back. The design concept is a silicon wafer as background text with a few fabricated chips removed as white spaces. The winning design was printed, designed onto long sleeve shirts, and handed out to all SSCS Student and Graduate Student Members at the 2023 International Solid-State Circuits Conference. Congratulations to the runners up: second-place winner, Mahdi Yektaei, Shahed University, Iran, and third-place winner, Saurabh Yadav, Indian Institute of Technology Indore, India. The Student Shirt Design Contest is held annually in the fall. Please check the SSCS website in early fall 2023 for details on the 2023–2024 Student Design Contest.

Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

The International Technical Program Committee (ITPC) of the IEEE International Solid-State Circuits Conference (ISSCC) selects outstanding articles from the papers presented at the conference and invites the authors to submit an extended manuscript to the special issue of IEEE Journal of Solid- State Circuits (JSSC). This January issue contains the selected papers from the Digital Architectures and Systems, Digital Circuits, Machine Learning, Memory, and Wireline subcommittees.

IEEE SSCS Student and Young Professionals Mentoring Event at ISSCC 2023 [Society News]

The Solid-State Circuits Society (SSCS) Young Professionals (YP) and Students Micro-Mentoring and Networking event was held on the evening of 21 February 2023 in San Francisco in accordance with the IEEE International Solid-State Circuits Conference (ISSCC). The event was held in person for the first time after three years. More than 70 attendees who chose to be mentors or mentees enjoyed food, drink, and friendly conversation at this flagship event organized by IEEE Solid-State Circuits Society (SSCS) YP Committee members Alireza Yousefi and SSCS YP chair Korkut Kaan Tokgoz.

Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

This Special Issue of the IEEE JOURNAL OF SOLID-STATE CIRCUITS presents a collection of the best papers selected from the 2022 IEEE International Solid-State Circuits Conference (ISSCC) that took place in a virtual format from 20 February until 24 February 2022. This issue covers articles from the RF, Wireless, Analog, Data Converters, and Power Management subcommittees.

Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

The International Technical Program Committee (ITPC) of the IEEE International Solid-State Circuits Conference (ISSCC) selects outstanding articles from the papers presented at the conference and invites the authors to submit an extended manuscript to the Special Issue of IEEE Journal of Solid-State Circuits (JSSC). This November issue contains the selected papers from the Imagers, microelectromechanical systems (MEMS), and Displays (IMMD) and the Technology Directions (TD) sub-committees. Papers from Analog, Data Converters, Power Management, RF, and Wireless subcommittees are included in the December issue. Finally, the January issue will contain papers from Digital Architectures and Systems, Digital Circuits, Machine Learning, Memory, and Wireline subcommittees.

Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is “Intelligent Silicon for a Sustainable World.” This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability.

Welcome to the Summer 2022 Issue of IEEE Solid-State Circuits Magazine! [Editor’s Note]

This third issue of the 14th year of the magazine recognizes five of many excellent tutorials presented this year at the International Solid-State Circuits Conference. A tutorial by Gabriele Manganaro discusses techniques for extending the bandwidth of current-steering digital-to-analog converters. This is followed by a tutorial on wireless power transfer for medical devices by Mehdi Kiani. Jeffrey Walling&#x2019;s tutorial motivates mixed-signal RF transceivers as a means of providing additional functionality to future RF systems. In their tutorial, Jae-sun Seo, Jyotishman Saikia, Jian Meng, Wangxin He, Han-sok Suh, Anupreetham, Yuan Liao, Ahmed Hasssan, and Injune Yeo provide an overview and comparison of recent digital and analog artificial intelligence accelerators. Lastly, Shidhartha Das examines self-sensing processing as a crucial component for mitigating the impact of process variations on integrated systems.

Women in Circuits [Guest Editorial]

The fall 2022 issue of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Solid-State Circuits Magazine</i> , on “Women in Circuits (WiC),” follows the tradition of previous issues since 2017, enabling more exposure to female leaders through exposition of their work in circuits and systems on a variety of important topics or their personal life/career experiences. WiC is also committed to promoting female leaders and diversity in the IEEE Solid-State Circuits Society (SSCS) and (co)organizing a variety of events to serve our communities, such as mentorship events at different conferences, including the International Solid-State Circuits Conference (ISSCC), the IEEE Symposium on VLSI Technology and Circuits (the VLSI Symposium), the IEEE Custom Integrated Circuits Conference (CICC), and the IEEE Asian Solid-State Circuits Conference (A-SSCC), among others. The WiC Committee would like to encourage more people to participate in future events. The following SSCS members were asked to contribute to this issue.

Welcome to the Winter 2022 Issue of IEEE Solid-State Circuits Magazine! [Editor’s Note]

In this first issue of the 14th year of IEEE Solid-State Circuits Magazine, we are pleased to share semiconductor-technology trends as identified by the members of the 12 subcommittees of the International Solid-State Circuits Conference (ISSCC) 2022, which include Analog Systems, Data Converters, Digital Architectures and Systems, Digital Circuits, Imagers, MEMS, Medical, and Display, Machine Learning, Memory, Power Management, Radio-Frequency Circuits, Technology Directions, Wirelss, and Wireline.

Introduction to the Special Section on the 2021 IEEE International Solid-State Circuits Conference (ISSCC)

This Special Section of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2021 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 13–22, 2021, in San Francisco, CA, USA. This Special Section covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), Machine Learning and AI, and Memory Committees.

Guest Editorial Introduction to the Special Issue on the 2021 IEEE International Solid-State Circuits Conference (ISSCC)

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best papers selected from the 2021 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 13-22, 2021, virtually. This issue covers papers from the Analog, Power Management, Data Converters, RF, and Wireless committees.