Interfacial Stress Distribution Research Articles

The strength of an adhesive contact in the presence of interfacial defects

Adhesive contacts which possess a dominant stress concentration, such as at the contact edge in spherical junctions or at the detachment front in a peeling film, are well studied. More complex adhesive junction geometries, such as mushroom-shaped fibrils in bioinspired micropatterned dry adhesives, have exhibited a complex dependence of adhesive strength on the presence of interfacial defects within the contact. This has led to the emergence of statistical variation of the local behavior among micropatterned sub-contacts. In order to examine the interplay between geometry and interfacial defect character in control of the adhesive strength, the model system of a stiff cylindrical probe on an elastic layer is examined. Both experiments (glass on PDMS) and cohesive zone finite element simulations are performed, with analytical asymptotic limits also considered. The thickness of the elastic layer is varied to alter the interfacial stress distribution, with thinner layers having a reduced edge stress concentration at the expense of increased stress at the contact center. The size and position of manufactured interfacial defects is varied. It is observed that for the thickest substrates the edge stress concentration is dominant, with detachment propagating from this region regardless of the presence of an interfacial defect within the contact. Only very large center defects, with radius greater than half of that of the contact influence the adhesive strength. This transition is in agreement with analytical asymptotic limits. As the substrate is made thinner and the stress distribution changes, a strong decay in adhesive strength with increasing center defect radius emerges. For the thinnest substrate the flaw-insensitive upper bound is approached, suggesting that this decay is dominated by a reduction in the contact area. For penny-shaped defects at increasing radial positions, the adhesive strength for the thinnest substrates becomes non-monotonic. This confirms an intricate interplay between the geometry-controlled interfacial stress distribution and the size and position of interfacial defects in adhesive contacts, which will lead to statistical variation in strength when defects form due to surface roughness, fabrication imperfections, or contaminant particles.

Adhesion of a nematic elastomer cylinder.

Reversible dry adhesion is exploited by lizards and insects in nature, and is of interest to robotics and bio-medicine. In this paper, we use numerical simulation to study how the soft elasticity of liquid crystal elastomers can affect its adhesion and provide a technological opportunity. Liquid crystal elastomers are cross-linked elastomer networks with liquid crystal mesogens incorporated into the main or side chain. Polydomain liquid crystalline (nematic) elastomers exhibit unusual mechanical properties like soft elasticity, where the material deforms at nearly constant stress, due to the reorientation of mesogens. Our study reveals that the soft elasticity of nematic elastomers dramatically affects the interfacial stress distribution at the interface of a nematic elastomer cylinder adhered to a rigid substrate. The stress near the edge of the nematic cylinder under tensile load deviates from the singular behavior predicted for linear elastic materials, and the maximum normal stress reduces dramatically. This suggests that nematic elastomers should display extremely high, but controllable adhesion, consistent with the available experimental observations.

Multiscale study of interfacial properties of carbon fiber reinforced polyphthalazine ether sulfone ketone resin matrix composites

In view of the limitations of traditional research tools on interfacial failure mechanisms in fiber/PPESK composites, this work proposes a multiscale research tool to carry out an in-depth study of the interfacial behavior between fibers and matrix. Based on microdroplet debonding tests, at the mesoscopic scale, the influence of residual thermal stress on the interface damage mode is explored through finite element (FEM) simulations. The evolution mechanism of composite material interfaces in spatial and temporal dimensions is examined based on changes in interfacial stress distribution, energy dissipation, and damage morphology during the debonding process, which can be summarized as follows: accompanied by elastic-plastic deformation and friction effects, the progressive process from localized to complete failure presents a dominant Type II damage mode at the interface. To further explore the interface failure mechanism at the molecular level, an interface model of CF/PPESK composite materials was established using molecular dynamics (MD) method. By monitoring the atom movement trend, the "fiber-matrix displacement synergistic effect" in the interfacial shear damage process was revealed, thereby establishing a multiscale mapping relationship of composite material interface. Based on this, the combination of FEM and MD was utilized to investigate the interface damage process of composite materials under different service conditions and to reasonably predict the initiation and expansion of microcracks. This study provides a pioneering perspective on interface damage research in composite materials with a "top-down" multiscale approach.

Analytical model for flexoelectric sensing of structural response considering bonding compliance

Flexoelectricity has generated huge interest as an alternative to piezoelectricity for developing electromechanical systems such as actuators, sensors, and energy harvesters. This article presents a generic theoretical framework for the sensing mechanism of a flexoelectric sensor bonded to a host beam through an adhesive layer. The model incorporates piezoelectric and flexoelectric effects and considers both shear-lag and peel stresses at the sensor-beam interface. The formulation also includes the electric field gradient terms that are often overlooked. Consistent one-dimensional constitutive relations and governing equations of equilibrium are derived from the electric Gibb’s energy density function and extended Hamilton’s principle. The sensor is assumed to follow the Euler–Bernoulli beam-type membrane and bending deformation behaviour. Closed-form solutions are obtained for the interfacial stresses by analytically solving a seventh-order non-homogeneous ordinary differential equation, satisfying the stress-free boundary conditions at the sensor edges. The induced electric potential at the sensor top is derived by solving a fourth-order differential equation obtained from the charge balance equation, satisfying the electric boundary conditions. For validation, the sensor output is compared with the results of the existing non-rigid bonding piezoelectric sensor model. Numerical results show a significant impact of non-rigid bonding and the electric field gradient terms on the induced electric potential. Further, the importance of bonding compliance on the interfacial stress distributions is illustrated. Finally, the effects of adhesive and transducer thicknesses on the peak amplitudes of interfacial stresses and sensory potential are presented.

Effect of plastic deformability and fracture behaviour on interfacial toughening mechanism at Fe/Ni interfaces

Fracture at interface causes plastic deformation in the vicinity region. Conventional plastic energy dissipation theory indicates that ductile vicinity toughens the interface by absorbing plastic deformation energy. However, the microstructure in the vicinity directly affects local plastic deformability and fracture behaviour, implying a more complicated toughening mechanism. In this study, the effect of microstructure and hardness on fracture behaviour of Fe/Ni interface was investigated. By experimental approach, interfaces with and without dynamic recrystallization (DRX) were fabricated by controlling the bonding conditions. It showed that compression-induced plastic deformation is the main source of the hardening behaviour in the vicinity. Moreover, the interfaces with hardened DRX vicinities exhibited improved fracture toughness, which is inconsistent with the plastic energy dissipation theory. To clarify this observation, the crystal plasticity finite element method (CPFEM) approach was employed to distinguish the effects of plastic deformation and interfacial microstructure. The result showed that although higher plastic deformability in the vicinity absorbs more dissipated plastic energy, severe stress concentration at the interface leads to early fracture and poor toughness. On the other hand, the interfacial hardened DRXed grains disperse interfacial stress distribution and provide potential sub-crack sites. A combined result of uniform plastic deformation and fracture energy dissipation is responsible for the improved toughness at interfaces with DRXed grains.

The interfacial behavior of a liquid crystal elastomer film bonded to an orthotropic substrate under light illumination

Bilayer soft actuators composed of a liquid crystal elastomer (LCE) film and a soft substrate have been widely used in soft robotics, bioengineering, and other fields. The existence of stress concentration at the interface edge easily leads to delamination damage of layered structures. Therefore, this article focuses on the distribution of interfacial stresses of the light-driven LCE film/orthotropic substrate system. The governing equations of the LCE film/substrate system are derived. The distributions of peeling and shear stresses on the interface are given and validated by using the finite element method (FEM). The effects of light illumination intensity, light attenuation distance and the director direction on the distribution of interfacial stresses are comprehensively analyzed. It is found that the signs of the shear stress and peeling stress depend on the director direction. This indicates that aligning the director in a certain direction may enhance the interface strength. The results may be useful for designing light-responsive LCE bilayer drivers.

Investigating corrosion-induced deterioration in bolted steel plate joints using guided wave ultrasonic inspection

AbstractBolted steel plate joints encounter challenges posed by joint corrosion, which impact the quality of interfacial contact among the bolted components. Unfortunately, no correlation between corrosion-induced joint damage and preload, nor an existing numerical model capable of capturing such effects, has been identified. This study aims to utilize guided wave ultrasonic investigation to examine the deterioration of interfacial contact caused by corrosion in bolted joints. Additionally, a contact modification-based numerical approach is presented to capture the effects of changing interfacial stress during joint corrosion. Guided wave mode selection was conducted with some preliminary experiments supplemented with the theory of wave mode dispersion, hence leading to the selection of S0 and A0 mode existing at 300 kHz. The joint was then corroded in a controlled manner using an electrochemical process while simultaneous ultrasonic measurements were taken. The experimental observations highlighted the progressive dispersion in the transmitted A0 mode across the bolted joint, potentially due to changing interfacial stress boundaries between the plates. A damage parameter, termed the dispersion index, was developed based on the energy ratio of different signal sections. A linear change in the dispersion index was observed with the increase in corrosion-induced mass loss. The insight was further established through a numerical investigation by studying the effect of changing bolt preload and the corresponding interfacial stress distribution. The findings revealed that monitoring the changes in the stress distribution at the bolted interface can provide insight into interfacial corrosion. Eventually, destructive tension test results confirmed the effect of joint corrosion on the load-bearing capacity of the joint. The change in failure mode of the pristine and corroded specimen is observed. The reported approach establishes the potential of ultrasonic inspection to investigate the interfacial health of a bolted joint in corroding conditions.

Homogenizing Interfacial Stress by Nanoporous Metal Current Collector to Enable Stable All-Solid-State Li Metal Battery

All-solid-state lithium-metal batteries are prone to shorting due to lithium penetration through the electrolyte layer. Li experiences creep during compression which creates stress in the electrolyte layer. Uneven deposition and stripping of Li further exaggerate the heterogeneity of stress distribution. To overcome this challenge, we design a current collector for Li metal. Its specific properties can homogenize interfacial stress distribution and prevent the solid electrolyte layer from developing additional defects that encourage penetration by Li metal during processes of fabrication and electrochemical cycling. Compared with a conventional current collector, our current collector effectively enhances the critical current density (1.7 vs. 0.5 mA/cm2) and extends cycle life (> 360 vs. 12 hours) for Li/Li symmetric cells. This development provides a chemistry-agnostic approach to improving the cycle life of solid-state Li batteries.

High-resolution measurement of contact stresses and friction in indentation and machining by full-field photoelasticity

An experimental study has been made of the sliding plastic contact in wedge indentation and machining of ductile metals. The use of full-field photoelasticity has allowed direct determination of interface pressure and shear stress distribution along the tool (indenter) and workpiece sliding contact at micron-scale resolution. Sapphire, a transparent photoelastic material that possesses sufficiently high hardness to indent and machine metals, is used as the tool material. It is shown that the Coulomb friction model applies only at the edges of the contact where the interface pressure falls below a certain value associated with the material's flow stress. Within the plastic contact zone, the mode of friction as well as the relationship between interface pressure and shear stress are very complex. In both cases, it is shown that shear stress neither remains constant nor varies in proportion to the pressure. It is proposed that the complex nature of friction and stress field at the sliding contact can be understood through simultaneous observations of the metal plastic flow at and near the interface. Using in situ measurements of the velocity field near the interface and local stress distribution at the contact from photoelasticity, friction contribution to the overall work is calculated and shown to be substantial (greater than one-third) in the case of machining.

Structural integrity assessment and optimization of control surfaces in coaxial unmanned aerial vehicles: A case study of a micro coaxial UAV

Unmanned aerial vehicles (UAVs) play a pivotal role in modern society which requires lightweight yet robust structures to fulfill increasingly complex tasks. This study presents a cost-effective prototyping approach to assess the structural integrity of control surfaces within the innovative Coaxial Unmanned Aerial Vehicle version 3.0 (MCR UAV v3.0). Integrating a hybrid design with coaxial propulsion for vertical stabilization and yaw control, the MCR UAV v3.0 incorporates control surfaces (ailerons) to manage roll and pitch movements during flight. The design process relies on a comprehensive understanding of material mechanical properties, particularly polylactic acid (PLA) specimens fabricated via fused deposition modeling (FDM) with varying infill percentages and building angles. A novel fluid-structure interaction method is developed in order to analyze four control surface topologies: concave (A), optimized concave (B), convex (C), and optimized convex (D). Findings reveal that the optimized design significantly improves stress distribution in the fuselage-control surface interface while reducing aileron weight by approximately 70%. Subsequently, a functional UAV prototype incorporating optimized ailerons is manufactured. Flight tests affirm the efficacy of the ailerons in controlling roll and pitch motions. This work significantly contributes by introducing the novel MCR UAV v3.0 and conducting a comprehensive assessment of fuselage-control surface structural stability, offering insights into enhanced UAV design and performance for diverse applications.

Achieving better strength-toughness synergy in heterogeneous Cu/Ni/graphene composites: A molecular dynamics simulation

The non-wetting nature of copper (Cu) and graphene, coupled with the brittle behavior of graphene, impedes the strength-toughness synergy in graphene-reinforced Cu matrix (Cu/graphene) composites, limiting their practical applications. Benefiting from interface modification engineering and heterogeneous structure strengthening effects, here a novel strengthening and toughening strategy for Cu/graphene composites by introducing a variable-thickness nickel (Ni) modification layer sandwiched between Cu and graphene (Cu/Ni/graphene) was proposed, and the influence of layer thickness-related structural heterogeneity on mechanical properties and underlying deformation mechanisms were investigated via molecular dynamics simulations. The results revealed that an optimal Ni thickness of 2.44 nm within increased Ni layer thickness enhanced the strength-toughness synergy in the Cu/Ni/graphene composites. This was attributed to altered interface structure, stress distribution, and graphene fracture behaviors due to layer thickness-related deformation behavior. In addition to common strengthening mechanisms like graphene load-bearing effect, interface dislocation nucleation, and interface dislocation blockage strengthening, the layer thickness-dependent semi-coherent Cu/Ni and Ni/graphene heterogeneous interface stress strengthening contributed to extra strength enhancement. Furthermore, cooperative deformation behavior among heterogeneous components improved toughness. The interfacial engineering strategy, achieved by tailoring the modification layer thickness, may pave the way for producing nanostructured metallic composites with extraordinary mechanical properties.

Interfacial debonding in a thin plate bonded to a rigid substrate with a circular hole

Mode I fracture is a prevalent failure mode in adhesively bonded joints. This paper presents analytical and numerical solutions for the mechanical interaction of a thin plate bonded to a rigid substrate with a circular hole. Utilizing the bilinear cohesive law, the proposed solution is designed for the bonded joints subjected to uniformly distributed load and point load, respectively. The interfacial normal stress distribution and load-displacement response undergo three distinct stages: the initial elastic stage, followed by the elastic-softening stage, and culminating in the elastic-softening-debonding stage. The load-displacement response of the joints subjected to uniformly distributed load and point load diverges after debonding occurs. The load-carrying capacity of the former decreases rapidly, while the latter exhibits an opposite trend. Finite element (FE) simulation is conducted for numerical validation, demonstrating excellent agreement between the proposed model and FE results. The paper concludes by discussing the influences of hole radius, bond length, and the properties of the adhesive layer and thin plate on load-displacement response and the ultimate load. The findings suggest that higher bond strength and larger fracture energy of the adhesive, along with thicker and stiffer thin plates, contribute to achieving higher load-carrying capacity in bonded joints. Additionally, a longer bond length improves the load-carrying capacity for the joint subjected to the point load, with minimal impact for uniformly distributed loads once the bond length exceeds the effective bond length.

Revealing the grain boundary effect on interfacial adhesion in polycrystal Fe/Ni interfaces by using a multi-scale CZM-CPFEM approach

In layered structure, interface plays a significant role in property improvement, whereas its multiple factors at various length scales restricted further understanding. Previous research found a novel grain boundary (GB)-interface interaction: crack initiation locally occurred at the junctions between pre-existing GBs and interface. This leads to decreased interfacial strength. To clarify the mechanisms of such GB-interface interaction, the present study proposed a multi-scale cohesive zone model-crystal plasticity finite element method (CZM-CPFEM) model to investigate the effect of pre-existing GB on intrinsic bonding strength at atomic scale and interfacial stress distribution at micro scale, respectively. At atomic scale, interfacial fracture criteria were modelled according to Molecular Dynamics (MD)-based traction-separation relationships. The accuracy of CZMs was improved by considering both isothermal holding and tilting configuration effects. At micro scale, a practical interfacial microstructure was used to construct CPFEM models. Tensile simulations showed that the local stress concentration occurred at junctions, attributed to the anisotropic plastic deformation behaviours across the GB. On the other hand, weak bonding adhesion at the junction only affects the local crack initiation strength, showing insignificant impacts on the overall interfacial fracture behaviour.

Design of a gradient elastic modulus transition layer based on film-substrate adhesion

The codeformation process of Ti6Al4V (TC4) substrate and chromium nitride (CrN) films with dense/loose CrN and gradient elastic modulus CrN/CrNx/Cr(N) (G-CrN) structures under normal impact load were simulated by changing the thicknesses of the films or the loose CrN and G layers. The dispersed distribution of interfacial tensile stresses and strains of G-CrN films improved the layers’ codeformation, compared with the firm large layer of the dense/loose CrN films. The stress reduced as the loose/G layer thicknesses increased. The 4.7 μm CrN films with various thicknesses of the G-layers, 0.2 µm, 0.6 µm, 0.75 µm and 0.9 µm, were prepared on TC4 to evaluate the film-substrate adhesions and verify the simulated deformation procedure. A G-layer between a ceramic film and its alloy substrate is needed, and the 0.83–1.08 µm thicknesses of the G-layers were suggested for the CrN/TC4 system varied with the films’ thicknesses. The dispersed distribution of the tensile stress and strain within the G-CrN film was the mechanism of the film-substrate adhesion improvement.

Experimental and theoretical study on mechanical performance of Fe-SMA/steel single lap joints

The activated iron-based shape memory alloy (Fe-SMA) can introduce considerable prestress in the damaged zone of deteriorated steel structures through bonding technologies. In China, it has been successfully applied to several kilometer-span steel bridges, such as Sutong Bridge and Hangzhou Bay Bridge. The shear and interfacial performance of steel-to-Fe-SMA plates are crucial issues in bonding Fe-SMA to reinforce deteriorated steel structures, which remain unclear. This paper investigates the shear characteristics of Fe-SMA/steel single lap joints (SLJs), considering the effects of adhesive types, adhesive layer thicknesses and overlap lengths. The stress distribution and the interfacial shear stress at the overlap zone are obtained through experiments, and the damage evolution and load-transfer mechanisms of adhesive layers are analyzed. The experimental outcomes indicate that the maximum tensile stresses of Fe-SMA plates can reach 61 % of their ultimate strength. The failure modes and ultimate load of Fe-SMA/steel SLJs are affected by adhesive types. Interface failure occurs in CH 120 and PCMdur™-15 specimens, whereas interface, cohesive and mixing failure are formed in Sika 31 specimens. Due to the adverse effects of adhesive layer defects, out-of-plane bending moment, and damage accumulation of the adhesive layers, the distribution of surface strain and interfacial shear stress of all specimens are mainly at the effective overlap zone. For an efficient engineering design, the linear and polynomial fitting models of cohesive zone models with different adhesive types and adhesive layer thicknesses are proposed based on experiments. The experimental and theoretical achievements can provide design recommendations for deteriorated steel structures rehabilitated by bonding Fe-SMA.

Comparison of the stress distribution in base materials and thicknesses in composite resin restorations

Resin-based composite materials are commonly used for restorations, but their dimensional changes during the polymerization could cause various clinical problems. This study evaluated the influence of a base of different materials and thicknesses on the stress magnitude and distribution in a second maxillary premolar with an MOD resin composite restoration using three-dimensional finite element analysis. A sound tooth without cavity was considered as the control group (ST), and another group was restored with composite resin without applying a base material in a MOD cavity (CR). The other three groups were restored with composite resin along with the following base materials: glass ionomer cement, low-viscosity resin, and tricalcium silicate, respectively (CR-GIC, CR-LR, and CR-TS). These three groups were further divided into two subgroups according to the thickness of the base layer: thin (0.5 mm) and thick (1.0 mm). The stress distribution was compared using the maximum principal stress after polymerization shrinkage and vertical loading with 600 N on the occlusal surface. Group ST showed the lowest stress value, and its stress propagation was confined to outer enamel surfaces only. Group CR demonstrated the highest stress distribution in the tooth-restoration interface with increased failure risk on marginal areas. The thin and thick subgroups of the three groups with a base layer had lower stress levels than Group CR. The base materials reduced the marginal stress caused by polymerization shrinkage of composite resin in MOD cavities. Different base materials and thicknesses did not affect the stress distribution.

Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach.

Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate (GIc). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon-epoxy molding compound (EMC) interface, the results for maximum strength and GIc are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for GIc. This study's findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors.

An analytical model to predict bond behavior of fiber reinforced polymer bonded to concrete with an end anchorage system

The end mechanical anchorage system has been widely applied in the conventional externally bonded reinforcement (EBR) technology, to hinder the premature debonding failure of fiber reinforced polymer (FRP) laminate, especially for the reinforcement structures with prestressed FRP due to higher interfacial shear stress at the ends. Through the introduction of the hinge as the substitution of end anchorage, this paper presents a numerical model based on the bilinear bond-slip model and ordinary differential equations in elastic, elastic-softening, and elastic-softening-debonding stages. The bond behavior of the FRP-concrete interface under the end anchorage in different stages is predicted, obtaining the analytical expressions of interfacial load-slip relation, interfacial shear stress distribution, and the stress distributions of FRP. Additionally, two experimental programs from this group and previous literature were involved in this study to validate the accuracy of the numerical model. The comparison shows they are in good agreement. Moreover, it indicated that the strength increase is linear with the torque applied in the end anchorage, but bonding strength is not the case.

Effects of TGO growth on the interface stress distribution based on 3D pores in TBC ceramics layer

Yttria partially stabilized zirconia sprayed by the air-plasma-spraying method is widely used to protect superalloy substrates due to its unique thermomechanical properties, still, the formation and development of thermally grown oxide (TGO) often causes crack propagation in thermal barrier coatings and leads to accidents. In this paper, effects of the thickness of the TGO layer, porosity on the heat insulation properties, surface residual stress between the ceramic layer and the TGO layer of TBCs fabricated by atmospheric plasma spraying were studied. Finite element calculations were used to study the thickness of TGO layers with different porosities after thermal shock, the thermal insulation performance of coatings at high temperatures and the three-dimensional distribution of thermal strain, especially at the interface between the lower ceramic layer and upper TGO layer. The results show that when the porosity of the ceramic coating is approximately 24.35%, the thermal insulation performance and the maximum von Mises stress of the coating layers are optimized, and the coating has the most extended service life. Theoretically, this paper is of great significance in revealing the influence of porosity on the service life of thermal barrier coatings.

Raman mapping microspectroscopy of the effects of cryogenic cycling on the interfacial micromechanics of carbon fiber-reinforced polyimide composites

Raman mapping microspectroscopy was then used to investigate the interfacial stress distributions of the films during different cryogenic-room temperature cycles (-198-25 °C, 0-300 cycles). It was found that the micro stress of CNT-PI films (around 175 MPa) had no significant changes even after 300 cycles. The cryogenic cycling had very little effect on the internal stress, indicating that PI had a good low temperature resistance. For the CF/CNT-PI films, the micro stress distributions of CFs, interface, and matrix regions were successfully obtained. It was found that the CFs bear a greater stress than the matrix, showing that CFs had always been the major stress bearer, confirming the strengthening effect of CFs. When the CF/CNT-PI films were cycled fewer than 250 times, the effect of cryogenic cycling on the micro stress was insignificant. But once the number of cycles reached 300, the compressive stresses on the fiber and interface increased by 21% and 12.9%, respectively, implying a deterioration of the mechanical properties. By Raman mapping, the micro-mechanical distributions of the reinforced material, matrix and interface of the composites under cyclic temperature changes were effectively quantified. This is therefore an effective method for evaluating the safety of composite materials.