Integration Of Qubits Research Articles

Impact of magnetic field variation on thermally annealed tantalum-filled vertical superconducting interconnects for scalable quantum computing systems

Efforts to scale down advanced quantum processors with more numbers of qubits offer challenges since the integration of qubits is a significant obstacle in the path. Superconducting vertical interconnects in 3D IC integration can provide a crucial solution for wiring complexities, as shorter interconnections reduce energy loss when working in cryogenic conditions with better signal fidelity. Using the time-dependent Ginzburg–Landau equation, this simulation study analyzes vertical superconducting interconnects filled with materials like tantalum, niobium, and thermally annealed tantalum. It also investigates how London penetration depth (temperature-dependent) and magnetic fields affect Cooper pair density and, consequently, current density.

Readout using resonant tunneling in silicon spin qubits

Spin qubit systems are one of the promising candidates for quantum computing. The quantum dot (QD) arrays are intensively investigated by many researchers. Because the energy-difference between the up-spin and down-spin states is very small, the detection of the qubit state is of prime importance in this field. Moreover, many wires are required to control qubit systems. Therefore, the integration of qubits and wires is also an important issue. In this study, the measurement process of QD arrays is theoretically investigated using resonant tunneling, controlled by a conventional transistor. It is shown that the number of possible measurements during coherence time can exceed a hundred under the backaction of the measurements owing to the nonlinear characteristics of resonant tunneling. It is also discussed to read out the measurement results by the conventional transistor.