Harvesting green energy and sustainable, effective use of it is based on efficient, cost-effective power electronics. To build robust, multi-functional and highly integrated electronic modules, metallizations with low resistances and the capability to carry high current loads for inner and top layer thick-films are needed. Additionally, these layers have to be interconnectable by metallized vias, soldering and bonding. A major challenge in realization of bulky silver and copper thick-films is to allow sufficient evaporation of the gaseous products during the interface reaction. Various ways to attain evaporation possibilities via controlled shrinkage retardation of the thick metal film are examined. The influence of composition of the used solids, their grain size distributions and the use of miscellenaous organic vehicles were examined in several research projects by variation of glass amount, particle size, shrinkage measurements as well as microstructure and film properties. Through partial retardation, a thick printing copper paste for 300 μm and a pure silver paste for 100 μm metallizations could be realized. By use of suited additives, the film shrinkage could be almost completely constrained which allowed the development of non-shrinking via-fill pastes.
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