InGaN-based Light-emitting Diodes Research Articles

Red light-emitting diode with full InGaN structure on ScAlMgO4 substrate

Abstract Here, we report the first demonstration of full InGaN-based red light-emitting diode (LED) grown on a c-plane ScAlMgO4 substrate. This work represents a potential approach for achieving red emissions from an InGaN quantum well grown on InGaN underlying layers. The LED device exhibits a peak wavelength of 617 nm at a current injection of 40 mA (10.5 A/cm2). The light output power and external quantum efficiency were 12.6 µW and 0.016% at 40 mA (10.5 A/cm2), respectively. These results are expected to contribute to the development of longer-wavelength emission LEDs and laser diodes.

Internal quantum efficiency improvement of InGaN-based red LED by using double V-pits layers as strain relief layer

Micro/mini light emitting diodes (LEDs) based on AlInGaN material system have vast potential in display applications. Nevertheless, the low internal quantum efficiency (IQE) of InGaN-based red LED limits its development and application. In the epitaxial structure of our designed red LED, double V-pits layers were used as strain relief layers to reduce compressive strain and improve the IQE of the active layer. First, InGaN/GaN superlattices (SLs) were grown below the active layer to form low-density large V-pits layer. Subsequently, multi-period green and red composite quantum wells were adopted as the active layer. A high-density small V-pits layer was introduced into the active region to release the compressive strain by adjusting the growth parameters of green multiple quantum wells (MQWs). The V-shaped pits divide the continuous large-area of active layer into mutually isolated small pieces, which prevents the transmission of strain and converts the long-range strain into separated local strain. The peak IQEs of LED A2 with single V-pits layer and LED B4 with double V-pits layers were measured to be 10.5% at 613 nm and 21.5% at 612.1 nm, respectively. The IQE is greatly improved by 204.7%. The research results indicate that the double V-pits layers structure can alleviate the compressive strain of InGaN QWs more effectively, reduce the influence of piezoelectric polarization field, and improve the IQE.

Highly stable and bright CsPbI3 nanocrystal red emitters based on color-conversion from InGaN-based blue light-emitting diodes

Highly stable and bright CsPbI3 nanocrystal red emitters based on color-conversion from InGaN-based blue light-emitting diodes

Ultra-dense Green InGaN/GaN Nanoscale Pixels with High Luminescence Stability and Uniformity for Near-Eye Displays.

Ultra-dense (>4,000 pixels per inch) and highly stable full-color III-nitride nanoscale pixels are crucial for near-eye display technologies like virtual and augmented-reality glasses. In this context, InGaN-based long wavelength green microscale light-emitting diodes face major bottlenecks, such as low efficiency and inadequate wavelength stability. These challenges are associated with the presence of both nonradiative surface defects and the strain induced quantum-confined Stark effect. Herein, we report nanoscale pixelation of green InGaN/GaN LEDs incorporating strain-engineered ultra-dense nanowire (NW) arrays, corresponding to ∼36,000 pixels per inch. The NW pixel arrays exhibit a stable peak wavelength emission at ∼500 nm for over 3 orders of magnitude of injection current densities (from ∼4 A/cm2 to ∼1 kA/cm2). The observed wavelength stability enhancement (a reduced blue-shift of just ∼4 nm) directly results from the suppressed built-in electric field achieved by strain relaxation of the axial multi quantum wells in the NWs. Finite difference time domain simulations show that emission of the pixel array is significantly increased owing to the enhanced spontaneous emission rate (characterized by a high Purcell factor of ≈2) of the ultra-dense NWs. We have demonstrated top-down NWs, where each NW (diameter ranging down to 200 nm) shows excellent uniformity and light output characteristics in direct contrast to bottom-up grown NW heterostructures. The results of this study establish a viable route for realizing nanoscale pixels with high luminescence stability and wafer-scale uniformity with high (>20%) indium composition InGaN/GaN LED heterostructures, for next-generation near-eye displays.

Studies on suppressed surface recombination of InGaN-based red light-emitting diodes with V-pits

InGaN-based red light-emitting diodes (LEDs) are a promising candidate to achieve high efficiency, which is highly desired by the display market. Understanding their size-dependent properties is crucial for further performance improvement. In this work, different sized InGaN red LEDs (from 500 × 500 to 15 × 15 µm2) based on V-pits were characterized systematically. The current–voltage characteristics show that the leakage current density, revealed either in forward or reverse bias, is independent of the chip size. Further light output power measurements and current dependent electroluminescence also reveal very weak dependence of the power density on chip size showing insensitivity the chip perimeter. The suppressed surface recombination effect may be due to effective carrier trapping effect by the V-pits, which prevents the carriers from flowing to the sidewalls. By detailed analysis of the spatially resolved electroluminescence, an anti-correlation between the emission wavelengths and the intensities was observed, with the longer wavelength emitting regions exhibit weaker intensity, which can be explained by the reduced carrier density in the V-pit-rich regions as carriers are partially captured by quantum wells associated with the V-pits and the associated dislocations. This study will pave the way for further understanding and improving the efficiency of InGaN red LEDs including micro-LEDs.

Enhancing the performance of InGaN-based near-infrared light-emitting diodes under a weakly polarized electric field

This work presents a simulation analysis of nitride multi-quantum-well near-infrared light-emitting diodes (LEDs) with an emission wavelength of 1300 nm using Crosslight-APSYS software. The polarization electric field at the quantum wells was effectively tuned by adopting an Al0.02Ga0.19In0.79N quaternaries compound as the barrier for the In0.78GaN quantum wells, resulting in a near-zero polarization electric field. This approach significantly reduced band bending and increased the overlap of electron-hole wave functions within the quantum wells. Consequently, the internal quantum efficiency (IQE) in the nitride near-infrared LED improved, and the droop effect was significantly reduced. The Auger recombination mechanism that influences the droop effect was further analyzed. This provides an efficient approach for the development of high-performance InGaN-based near-infrared light-emitting diodes with high indium content.

Enhanced hole transport of nonpolar InGaN-based light-emitting diodes with lateral p-type superlattice doping structure

In this work, we propose a novel structure for nonpolar (10–10)-plane InGaN-based light-emitting diode (LED) using a lateral p-type Al0.2Ga0.8N/GaN superlattice structure as the hole injection layer. The main objective is to increase the hole concentration and facilitate vertical hole injection. The nonpolar InGaN-based LED lacks polarization along the growth plane (10–10), but the lateral direction along [0001] exhibits strong polarization. Therefore, the Al0.2Ga0.8N/GaN superlattice structure, which is periodic along the [0001] direction, induces net polarization charges at the GaN/Al0.2Ga0.8N interface, resulting in increased ionization rates of the acceptors. Additionally, the high-density two-dimensional hole gases formed at the Al0.2Ga0.8N/GaN interfaces along the [0001] direction can efficiently inject vertically into the quantum wells. Based on the numerical simulation results, the proposed LED structure offers improved electrical characteristics, effective hole injection, and enhanced optical performance compared to the nonpolar LED with conventional p-type doping structure.

Impact of Localization on the Optical Properties of InGaN-Based Red Light-Emitting Diodes Grown on a Silicon Substrate

Impact of Localization on the Optical Properties of InGaN-Based Red Light-Emitting Diodes Grown on a Silicon Substrate

Demonstration of 651 nm InGaN-based red light-emitting diode with an external quantum efficiency over 6% by InGaN/AlN strain release interlayer.

This work reports a high-performance InGaN-based red-emitting LED with a strain-release interlayer (SRI) consisting of an InGaN stress-release layer (SRL) and an AlN dislocation confinement layer (DCL) in unintentionally doped GaN (u-GaN). The SRL introduces a tensile strain which could decrease the in-plane compressive stress of the u-GaN layer, while the DCL could reduce the dislocation density and thus improve the crystal quality of the u-GaN layer. Consequently, a high-efficiency InGaN-based red-emitting LED with a peak wavelength of 651 nm and an external quantum efficiency of 6.04% is realized. In addition, the room-temperature photoluminescence (PL) mapping emission wavelength is uniform across a 4-inch wafer with a standard deviation of 3.3 nm. Therefore, the proposed SRI offers good potential for mass-producing high-performance and long-wavelength InGaN-based red-emitting LEDs.

Spontaneous Emission Studies for Blue and Green InGaN-Based Light-Emitting Diodes and Laser Diodes

We investigated the efficiency droop phenomenon in blue and green GaN-based light-emitting diodes (LEDs) and laser diodes (LDs), which poses a significant challenge in high-power LEDs and is characterized by a reduction in external quantum efficiency at higher injection currents. Utilizing identical epi-structures for blue and green LEDs and LDs, with variations only in indium composition, our experiments revealed a gradual blue shift in the emission wavelengths as the injection current increased. Notably, the blue LED demonstrated a smaller shift compared to the green LED. In addition, the full width at half maximum of emission spectra increased with increasing injection current density, indicative of efficiency droop. Significantly, LDs consistently exhibited lower junction temperatures despite operating at higher current densities. This is attributed to the enhanced heat dissipation capability of the ridge waveguide LD structure, which results in a narrower emission spectrum and reduced efficiency droop compared to mesa LED structures. These outcomes highlight the efficiency of the ridge waveguide LD structure in heat dissipation from the active layer, offering crucial insights for the advancement of high-power light-emitting devices.

Phosphor-free micro-pyramid InGaN-based white light-emitting diode with a high color rendering index on a β-Ga2O3 substrate.

We demonstrate the InGaN/GaN-based monolithic micro-pyramid white (MPW) vertical LED (VLED) grown on (-201)-oriented β-Ga2O3 substrate by selective area growth. The transmission electron microscopy (TEM) reveals an almost defect-free GaN pyramid structure on (10-11) sidewalls, including stacked dual-wavelength multi-quantum wells (MQWs). From the electroluminescence (EL) spectra of the fabricated MPW VLED, a white light emission with a high color rendering index (CRI) of 97.4 is achieved. Furthermore, the simulation shows that the light extraction efficiency (LEE) of the MPW VLED is at least 4 times higher compared with the conventional planar LED. These results show that the MPW VLED grown on β-Ga2O3 has great potential for highly efficient phosphor-free white light emission.

Achieving InGaN-Based Red Light-Emitting Diodes by Increasing the Growth Pressure of Quantum Wells

Achieving InGaN-Based Red Light-Emitting Diodes by Increasing the Growth Pressure of Quantum Wells

Wafer-Scale Transferrable GaN Enabled by Hexagonal Boron Nitride for Flexible Light-Emitting Diode.

Epitaxy growth and mechanical transfer of high-quality III-nitrides using 2D materials, weakly bonded by van der Waals force, becomes an important technology for semiconductor industry. In this work, wafer-scale transferrable GaN epilayer with low dislocation density is successfully achieved through AlN/h-BN composite buffer layer and its application in flexible InGaN-based light-emitting diodes (LEDs) is demonstrated. Guided by first-principles calculations, the nucleation and bonding mechanism of GaN and AlN on h-BN is presented, and it is confirmed that the adsorption energy of Al atoms on O2 -plasma-treated h-BN is over 1eV larger than that of Ga atoms. It is found that the introduced high-temperature AlN buffer layer induces sufficient tensile strain during rapid coalescence to compensate the compressive strain generated by the heteromismatch, and a strain-relaxation model for III-nitrides on h-BN is proposed. Eventually, the mechanical exfoliation of single-crystalline GaN film and LED through weak interaction between multilayer h-BN is realized. The flexible free-standing thin-film LED exhibits ≈66% luminescence enhancement with good reliability compared to that before transfer. This work proposes a new approach for the development of flexible semiconductor devices.

Piezo-phototronic enhanced dual-wavelength InGaN/GaN multiple quantum wells Micro-LED arrays

As a promising technology for next-generation displays due to their high brightness and low power consumption, InGaN-based micro light-emitting diodes (Micro-LEDs) have attracted great attention in recent years. In this work, we detailedly investigate the carrier recombination and transportation process in dual-wavelength InGaN/GaN multiple quantum wells (MQWs) Micro-LED arrays under piezo-phototronic effects using electroluminescence (EL) and time-resolution photoluminescence measurements. With the increase of external strain, the violet EL intensity of dual-wavelength Micro-LED arrays first increases obtaining a maximum enhancement of ∼12% and then decreases, whereas blue EL emission almost maintains constant. Additionally, as the size of Micro-LED decreases, the enhancement obtained via piezo-phototronic effect will reduce, which is attributed to their inherently weaker piezoelectric polarization effect. Combining with dynamic analysis of carriers in the blue quantum well (QW), it is concluded that strain-induced interface polarized charges promote the wave function overlap of electron–hole pair, but reduce the injection of hole carriers in blue QW. Superposition of the above two factors enables the blue EL intensity stable under piezoelectric coupling. These results present a promising potential of piezo-phototronic effects to improve the Micro-LEDs devices.

Flexible topographical design of light-emitting diodes realizing electrically controllable multi-wavelength spectra

Multi-wavelength visible light emitters play a crucial role in current solid-state lighting. Although they can be realized by combining semiconductor light-emitting diodes (LEDs) and phosphors or by assembling multiple LED chips with different wavelengths, these design approaches suffer from phosphor-related issues or complex assembly processes. These challenges are significant drawbacks for emerging applications such as visible light communication and micro-LED displays. Herein we present a platform for tailored emission wavelength integration on a single chip utilizing epitaxial growth on flexibly-designed three-dimensional topographies. This approach spontaneously arranges the local emission wavelengths of InGaN-based LED structures through the local In composition variations. As a result, we demonstrate monolithic integration of three different emission colors (violet, blue, and green) on a single chip. Furthermore, we achieve flexible spectral control via independent electrical control of each component. Our integration scheme opens the possibility for tailored spectral control in an arbitrary spectral range through monolithic multi-wavelength LEDs.

Performance Improvement of InGaN-Based Red Light-Emitting Diodes via Ultrathin InN Insertion Layer

The serious separation of electron–hole wavefunctions, which is caused by the built-in electric field, prevents electron–hole radiative recombination in quantum wells (QWs) in high-In-content InGaN-based red light-emitting diodes (LEDs). Here, we propose a staggered structure that inserts an ultrathin InN layer in the single quantum well (SQW) to reduce the piezoelectric polarization and suppress the quantum confined Stark effect (QCSE). We have numerically simulated the effects of SQW with the InN insertion layer (IL) on the energy band structure and electron–hole wavefunctions of the red LED. Owing to alleviated piezoelectric polarization and improved overlaps of electron–hole wavefunctions, the simulation results have revealed that the internal quantum well (IQE) of the red LED with InN IL exhibits 42% higher than that of the red LED with a square-shaped QW (SSQW) at 60 A/cm2, and the efficiency droop ratio of red LED with InN IL is 48% lower than that of red LEDs with SSQW. Furthermore, we have found that the position of InN IL can affect the energy states of carriers, which has a great influence on the IQE and peak emission wavelength of red LEDs.

Effect of hydrostatic pressure on the Auger coefficient of InGaN/GaN multiple-quantum-well laser diode

A numerical model was used to analyze the Auger coefficient in a c-plane InGaN/GaN multiple-quantum-well laser diode (MQWLD) under hydrostatic pressure. Finite difference techniques were employed to acquire energy Eigenvalues and their corresponding Eigenfunctions of InGaN/GaN MQWLD, and the hole Eigenstates were calculated via a 6 × 6 k.p method under applied hydrostatic pressure. It was found that a change in pressure up to 10 GPa increases the carrier density in the quantum well and barriers and the effective band gap. Based on the result, the exaction binding energy decreased, the electric field rate increased up to 0.77 MV / cm, and the Auger coefficient decreased down to 2.1 × 10 − 31 and 0.6 × 10 − 31 cm6 s − 1 in the MQW and barrier regions, respectively. Also, the calculations demonstrated that the hole-hole-electron (CHHS) and electron-electron-hole (CCCH) Auger coefficients had the largest contribution to the Auger coefficient. Our study provides more detailed insight into the origin of the Auger recombination rate drop under hydrostatic pressure in InGaN-based light-emitting diodes.

Improved wavelength stability and heat dissipation of InGaN-based light-emitting diodes using a graphene interlayer on patterned sapphire substrate

This study presents a straightforward strategy that embeds a graphene interlayer between InGaN-based light-emitting diodes (InGaN LEDs) and patterned sapphire substrate (PSS substrate) for substantial improving device performances of wavelength stability and heat dissipation. The InGaN LEDs on the graphene interlayer/PSS substrate (Gr-LED) have lower piezoelectric fields of 1.16 MV/cm than 1.60 MV/cm for InGaN LEDs on the PSS substrate (Ref-LED). The low piezoelectric field diminishes the screen of the polarization field resulting in a stable electroluminescence peak wavelength. At 100 mA driving current, the chip temperature of Gr-LED shows a decrease in around 24.4 °C relative to Ref-LED. The thermal resistances measured in a vacuum environment are 351 and 128 °C/W for Ref-LED and Gr-LED, respectively. The low thermal resistance of Gr-LED is believed to be due to a low misfit dislocation density of the aluminum nitride nucleation layer that increases the vertical direction of heat transport to PSS. This work demonstrates that the graphene/PSS substrate is a promising substrate for high-power InGaN LEDs.

Low-efficiency-droop c-plane InGaN/GaN light-emitting diodes through the use of thick single quantum wells and doped barriers

Efficiency droop at high current densities is a problem for InGaN-based light-emitting diodes (LEDs), especially for conventional c-plane devices. The large internal electric fields in c-plane quantum wells (QWs) lead to an increase in the active region carrier density (n), causing the electrical efficiency droop onset to occur at low current densities. Here, we present an approach to reduce the internal electric fields (Eint) in c-plane QWs by placing doped p-type and n-type GaN barriers close to the QW. The reduced Eint also allows a thick QW active region design, which helps to lower n to further reduce the droop. The concept of using doped barriers to control Eint is explained using theory and device simulations. Following that, multiple series of thick single QW (SQW) LEDs were grown and characterized. Key parameters in the epitaxial design such as the doping levels and the relative position of the doped barriers were systematically studied and optimized. By using optimized doped barriers and a thick SQW, c-plane LEDs with a low-efficiency droop of 14% at 300 A/cm2 [with respect to the peak external quantum efficiency (EQE)] and a high peak EQE of 49% were demonstrated.

Recombination Rate Analysis of InGaN-Based Red-Emitting Light-Emitting Diodes

The recombination rates are measured and analyzed for red-emitting InGaN light-emitting diodes (LEDs) to better understand the factors that limit their efficiency. InGaN/AlGaN/GaN multiple quantum well (MQWs) are grown with x≥0.28 in the In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1-x</sub> N quantum well. The Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1-y</sub> N interlayers (ILs) with high Al-content (y>0.8) are employed because they result in smoother surfaces with smaller V-pits and higher photoluminescence efficiency. The IL-MQWs are formed on GaN and In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">z</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1-z</sub> N/GaN superlattice (SL) underlayers (ULs) with <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">z</i> = 0.015, 0.025, and 0.065. Differences in <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">B</i> coefficients (radiative recombination) within this set result from changes in wavefunction overlap caused by differences in layer thickness and composition in the IL-MQW. IL-MQWs grown on SL-ULs have <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">A</i> coefficients (Shockley-Reed-Hall recombination) that are lower than expected, indicating that the SL-ULs help reduce defect formation. Compared to shorter wavelength InGaN-based LEDs, the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">B</i> coefficients are ~100 times lower due to lower wavefunction overlap. A and <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</i> coefficients are higher because of a higher number of defects.