Hole Impact Research Articles

Low-energy and tunable LIF neuron using SiGe bandgap-engineered resistive switching transistor

We have proposed leaky integrate-and-fire (LIF) neuron having low-energy consumption and tunable functionality without external circuit components. Our LIF neuron has a simple configuration consisting of only three components: one bandgap-engineered resistive switching transistor (BE-RST), one capacitor, and one resistor. Here, the crucial point is that BE-RST with a silicon–germanium heterojunction possesses an amplified hysteric current switching with a low latch-up voltage due to improved hole storage capability and impact ionization coefficient. Therefore, the proposed neuron utilizing BE-RST requires an energy consumption of 0.36 pJ/spike, which is approximately six times lower than 2.08 pJ/spike of pure silicon-RST based neuron. In addition, the spiking properties can be tuned by modulating the leakage rate and threshold through gate bias, which contributes to energy-efficient sparse-activity and high learning accuracy. As a result, our proposed neuron can be a promising candidate for executing various spiking neural network applications.

Impact ionization coefficients and excess noise in Al0.55Ga0.45As0.56Sb0.44 lattice matched to InP

The avalanche multiplication and noise characteristics of Al0.55Ga0.45As0.56Sb0.44p–i–n and n–i–p structures grown lattice matched on InP have been investigated. From measurements undertaken using 530 nm illumination on several devices, the electron (α) and hole (β) impact ionization coefficients have been determined. While α only shows a relatively small increase compared to the higher Al composition alloys of AlxGa1−xAsSb, β is found to increase significantly. Although the β/α ratio is increased to ∼0.125–0.2, higher than the ∼0.003–0.02 seen in the higher-Al alloys, a relatively low excess noise factor of 2.2 was measured in the p-i-n with electron-initiated multiplication of 20. This noise performance is significantly lower than that predicted using a local-field model and comparable to some commercial silicon APDs. This avalanching material with a bandgap of ∼1.24 eV will have the advantages of a smaller band discontinuity with the absorber region and should also operate at a lower voltage.

Anomalous excess noise behavior in thick Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes

Al0.85Ga0.15As0.56Sb0.44 has recently attracted significant research interest as a material for 1550 nm low-noise short-wave infrared (SWIR) avalanche photodiodes (APDs) due to the very wide ratio between its electron and hole ionization coefficients. This work reports new experimental excess noise data for thick Al0.85Ga0.15As0.56Sb0.44 PIN and NIP structures, measuring low noise at significantly higher multiplication values than previously reported (F = 2.2 at M = 38). These results disagree with the classical McIntyre excess noise theory, which overestimates the expected noise based on the ionization coefficients reported for this alloy. Even the addition of ‘dead space’ effects cannot account for these discrepancies. The only way to explain the low excess noise observed is to conclude that the spatial probability distributions for impact ionization of electrons and holes in this material follows a Weibull–Fréchet distribution function even at relatively low electric-fields. Knowledge of the ionization coefficients alone is no longer sufficient to predict the excess noise properties of this material system and consequently the electric-field dependent electron and hole ionization probability distributions are extracted for this alloy.

Non-Markovian Hole Excess Noise in Avalanche Amorphous Selenium Thin Films.

Enhancing the signal-to-noise ratio in avalanche photodiodes by utilizing impact ionization gain requires materials exhibiting low excess noise factors. Amorphous selenium (a-Se) as a wide bandgap at ∼2.1 eV, a solid-state avalanche layer, demonstrates single-carrier hole impact ionization gain and manifests ultralow thermal generation rates. A comprehensive study of the history dependent and non-Markovian nature of hot hole transport in a-Se was modeled using a Monte Carlo (MC) random walk of single hole free flights, interrupted by instantaneous phonon, disorder, hole-dipole, and impact-ionization scattering interactions. The hole excess noise factors were simulated for 0.1-15 μm a-Se thin-films as a function of mean avalanche gain. The hole excess noise factors in a-Se decreases with an increase in electric field, impact ionization gain, and device thickness. The history dependent nature of branching of holes is explained using a Gaussian avalanche threshold distance distribution and the dead space distance, which increases determinism in the stochastic impact ionization process. An ultralow non-Markovian excess noise factor of ∼1 was simulated for 100 nm a-Se thin films corresponding to avalanche gains of 1000. Future detector designs can utilize the nonlocal/non-Markovian nature of the hole avalanche in a-Se, to enable a true solid-state photomultiplier with noiseless gain.

Study of Impact Ionization Coefficients in Silicon With Low Gain Avalanche Diodes

Impact ionization in silicon devices has been extensively studied and several models for a quantitative description of the impact ionization coefficients have been proposed. We evaluate those models against gain measurements on Low Gain Avalanche diodes (LGADs) and derive new parameterizations for the impact ionization coefficients optimized to describe a large set of experimental data. We present pulsed IR-laser based gain measurements on 5 different types of $50\mu m$-thick LGADs from two different producers (CNM and HPK) performed in a temperature range from $-15^oC$ to $40^oC$. Detailed TCAD device models are conceived based on SIMS doping profiles measurements and tuning of the device models to measured C-V characteristics. Electric field profiles are extracted from the TCAD simulations and used as input to an optimization procedure (least squares fit) of the impact ionization model parameters to the experimental data. It is demonstrated that the new parameterizations give a good agreement between all measured data and TCAD simulations which is not achieved with the existing models. Finally, we provide an error analysis and compare the obtained values for the electron and hole impact ionization coefficients against existing models.

Vertical Architecture Solution-Processed Quantum Dot Photodetectors with Amorphous Selenium Hole Transport Layer

Colloidal quantum dots (CQDs) provide wide spectral tunability and high absorption coefficients owing to quantum confinement and large oscillator strengths, which along with solution processability, allow a facile, low-cost, and room-temperature deposition technique for the fabrication of photonic devices. However, many solution-processed CQD photodetector devices demonstrate low specific-detectivity and slow temporal response. To achieve improved photodetector characteristics, limiting carrier recombination and enhancing photogenerated carrier separation are crucial. In this study, we develop and present an alternate vertical-stack photodetector wherein we use a solution-processed quantum dot photoconversion layer coupled to an amorphous selenium (a-Se) wide-bandgap charge transport layer that is capable of exhibiting single-carrier hole impact ionization and is compatible with active-matrix readout circuitry. This a-Se chalcogenide transport layer enables the fabrication of high-performance and reliable solution-processed quantum dot photodetectors, with enhanced charge extraction capabilities, high specific detectivity (D* ∼ 0.5–5 × 1012 Jones), fast 3 dB electrical bandwidth (3 dB BW ∼ 22 MHz), low dark current density (JD ∼ 5–10 pA/cm2), low noise current (in ∼ 20–25 fW/Hz1/2), and high linear dynamic range (LDR ∼ 130–150 dB) across the measured visible electromagnetic spectrum (∼405–656 nm).

Hard- and soft-breakdown modeling in <001> oriented β-Ga2O3 Schottky barrier diode

Gallium oxide (Ga2O3) attracts considerable technological interest because of its high Baliga’s figure-of-merit and high breakdown voltages. As the models for the breakdown behavior of n-doped Ga2O3 that consider soft (barrier lowering) and hard (avalanche effect) breakdowns are still lacking, in this study, we model the breakdown operations in <001> oriented Schottky barrier diodes considering both the soft- and hard-breakdown phenomena. The completion of the impact ionization model of β-Ga2O3 in <001> orientation is proposed by determining the hole impact ionization coefficient, thereby reproducing hard breakdown operations. Moreover, a barrier lowering model is determined for reproducing soft breakdown operations. The outcomes of the proposed modeling investigation are expected to be crucial for predicting the reverse-biased operations of β-Ga2O3 in <001> orientation to facilitate further technological development and applications of Ga2O3.

Impact of Band Anticrossing on Band-to-Band Tunneling in Highly Mismatched Semiconductor Alloys

We theoretically analyze band-to-band tunneling (BTBT) in highly mismatched, narrow-gap dilute nitride and bismide alloys, and quantify the impact of the $\mathrm{N}$- or $\mathrm{Bi}$-induced perturbation of the band structure---due to band anticrossing (BAC) with localized impurity states---on the electric-field-dependent BTBT generation rate. For this class of semiconductors, the assumptions underpinning the widely employed Kane model of BTBT break down, due to strong band-edge nonparabolicity resulting from BAC interactions. Via numerical calculations based on the Wentzel-Kramers-Brillouin approximation we demonstrate that BAC leads, at fixed band gap, to reduced (increased) BTBT current at low (high) applied electric field compared to that in a conventional ${\mathrm{In}\mathrm{As}}_{1\ensuremath{-}x}{\mathrm{Sb}}_{x}$ alloy. Our analysis reveals that BTBT in ${\mathrm{In}\mathrm{N}}_{x}{\mathrm{As}}_{1\ensuremath{-}x}$ and ${\mathrm{In}\mathrm{As}}_{1\ensuremath{-}x}{\mathrm{Bi}}_{x}$ is governed by a field-dependent competition between the impact of $\mathrm{N}$ ($\mathrm{Bi}$) incorporation on (i) the dispersion of the evanescent Bloch band linking the valence and conduction band edges, which dominates at low field strengths, and (ii) the conduction- (valence-) band-edge density of states, which dominates at high field strengths. The implications of our results for applications in long-wavelength avalanche photodiodes (APDs) and tunneling field-effect transistors (TFETs) are discussed. For APDs, we describe that leakage currents in ideal dilute nitride and bismide devices are likely comparable to those in devices based on conventional III-V materials, but that the expected reduction of the hole impact ionization rate in ${\mathrm{In}\mathrm{As}}_{1\ensuremath{-}x}{\mathrm{Bi}}_{x}$ is promising from the perspective of obtaining low excess noise factor. For TFETs, we describe that $\mathrm{Bi}$ incorporation provides the potential to obtain both reduced subthreshold swing and increased on-state current, making ${\mathrm{In}\mathrm{As}}_{1\ensuremath{-}x}{\mathrm{Bi}}_{x}$ of interest for the development of low-power, high-speed devices.

Modeling Dark Current Conduction Mechanisms and Mitigation Techniques in Vertically Stacked Amorphous Selenium-Based Photodetectors.

Amorphous selenium (a-Se) with its single-carrier and non-Markovian, hole impact ionization process can revolutionize low-light detection and emerge to be a solid-state replacement to the vacuum photomultiplier tube (PMT). Although a-Se-based solid-state avalanche detectors can ideally provide gains comparable to PMTs, their development has been severely limited by the irreversible breakdown of inefficient hole blocking layers (HBLs). Thus, understanding of the transport characteristics and ways to control electrical hot spots and, thereby, the breakdown voltage is key to improving the performance of avalanche a-Se devices. Simulations using Atlas, SILVACO, were employed to identify relevant conduction mechanisms in a-Se-based detectors: space-charge-limited current, bulk thermal generation, Schottky emission, Poole-Frenkel activated mobility, and hopping conduction. Simulation parameters were obtained from experimental data and first-principle calculations. The theoretical models were validated by comparing them with experimental steady-state dark current densities in avalanche and nonavalanche a-Se detectors. To maintain bulk thermal generation-limited dark current levels in a-Se detectors, a high-permittivity noninsulating material is required to substantially decrease the electric field at the electrode/hole blocking layer interface, thus preventing injection from the high-voltage electrode. This, in turn, prevents Joule heating from crystallizing the a-Se layer, consequently avoiding early dielectric breakdown of the device.

Low Noise Short Wavelength Infrared Avalanche Photodetector Using SB-Based Strained Layer Superlattice

We demonstrate low noise short wavelength infrared (SWIR) Sb-based type II superlattice (T2SL) avalanche photodiodes (APDs). The SWIR GaSb/(AlAsSb/GaSb) APD structure was designed based on impact ionization engineering and grown by molecular beam epitaxy on a GaSb substrate. At room temperature, the device exhibits a 50% cut-off wavelength of 1.74 µm. The device was revealed to have an electron-dominated avalanching mechanism with a gain value of 48 at room temperature. The electron and hole impact ionization coefficients were calculated and compared to give a better prospect of the performance of the device. Low excess noise, as characterized by a carrier ionization ratio of ~0.07, has been achieved.

Mid-wavelength infrared avalanche photodetector with AlAsSb/GaSb superlattice

In this work, a mid-wavelength infrared separate absorption and multiplication avalanche photodiode (SAM-APD) with 100% cut-off wavelength of ~ 5.0 µm at 200 K grown by molecular beam epitaxy was demonstrated. The InAsSb-based SAM-APD device was designed to have electron dominated avalanche mechanism via the band structure engineered multi-quantum well structure based on AlAsSb/GaSb H-structure superlattice and InAsSb material in the multiplication region. The device exhibits a maximum multiplication gain of 29 at 200 K under -14.7 bias voltage. The maximum multiplication gain value for the MWIR SAM-APD increases from 29 at 200 K to 121 at 150 K. The electron and hole impact ionization coefficients were derived and the large difference between their value was observed. The carrier ionization ratio for the MWIR SAM-APD device was calculated to be ~ 0.097 at 200 K.

Low noise Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes on InP substrates

We report on the demonstration of Al0.85Ga0.15As0.56Sb0.44 (hereafter, AlGaAsSb) avalanche photodiodes (APDs) with a 1000 nm-thick multiplication layer. Such a thick AlGaAsSb device was grown by a digital alloy technique to avoid phase separation. The current-voltage measurements under dark and illumination conditions were performed to determine gain for the AlGaAsSb APDs. The highest gain was ∼ 42, and the avalanche initiation occurred at 21.6 V. The breakdown voltage was found to be around −53 V. The measured dark current densities of bulk and surface components were 6.0 μA/cm2 and 0.23 μA/cm, respectively. These values are about two orders of magnitude lower than those for previously reported 1550 nm-thick AlAs0.56Sb0.44 APDs [Yi et al., Nat. Photonics 13, 683 (2019)]. Excess noise measurements showed that the AlGaAsSb APD has a low k of 0.01 (the ratio of electron and hole impact ionization coefficients) compared to Si APDs. The k of the 1000-nm AlGaAsSb APD is similar to that of the thick AlAsSb APDs (k ∼ 0.005) and 5–8 times lower than that of 170 nm-thick AlGaAsSb APDs (k ∼ 0.5–0.8). Increasing the thickness of the multiplication layer over 1000 nm can also reduce k further since the difference between electron and hole impact ionization coefficients becomes significant in this material system as the thickness of the multiplication layer increases. Therefore, this thick AlGaAsSb-based APD on an InP substrate shows the potential to be a high-performance multiplier that can be used with available short-wavelength infrared (SWIR) absorption layers for a SWIR APD.

Temperature Dependence of Electron and Hole Impact Ionization Coefficients in GaN

The temperature dependence of the electron and hole impact ionization coefficients in GaN has been investigated experimentally. Two types of p-i-n diodes grown on bulk GaN substrates have been fabricated and characterized, and the impact ionization coefficients for both electrons and holes have been extracted using the photomultiplication method. Both the electron and hole impact ionization coefficients decrease as the temperature increases. The Okuto–Crowell model was used to describe the temperature dependence of the electron and hole impact ionization coefficients. Based on the measured impact ionization coefficients, the temperature dependence of the breakdown voltage of GaN non-punch through p-n diodes can be predicted; good agreement with experimentally reported results is obtained.

Measurement and optimization of clock-induced charge in electron multiplying charge-coupled devices

Electron multiplying charge-coupled devices (EMCCDs) are a variant of standard CCD technology capable of single-optical photon counting at MHz pixel readout rates. For photon counting, thermal dark signal and clock-induced charge (CIC) are the dominant source of noise and must be minimized to reduce the likelihood of coincident events. Thermal dark signal is reduced to low levels through cooling or operation in inverted mode (pinning). However, mitigation of CIC requires precise tuning of both parallel and serial clock waveforms. Here, we present a detailed study of CIC within Teledyne-e2v EMCCDs with a goal of better understanding the physical mechanisms that dominate CIC production in both noninverted and inverted mode operations (IMO). Measurements are presented as a function of parallel and serial clock timings, clock amplitudes, and device temperature. The effects of radiation damage and annealing are also discussed. A widely accepted view is that CIC is signal generated through impact ionization of energetic holes as the clock phase is driven high. While this explanation holds for IMO, we propose that the majority of CIC generated in noninverted mode is in fact due to a secondary effect of light emission from hot carriers. The information from this study is then used to optimize CIC on Teledyne e2v CCD201s operating at 1-MHz pixel rate in NIMO. For the CCD201, we obtained total CIC levels as low as 6.9 × 10 − 4 e − / pix / frame with ≥90 % detective quantum efficiency. We conclude with proposals to further reduce CIC based upon modifications to clocking schemes and device architecture.

Avalanche Photodetector Based on InAs/InSb Superlattice

This work demonstrates a mid-wavelength infrared InAs/InSb superlattice avalanche photodiode (APD). The superlattice APD structure was grown by molecular beam epitaxy on GaSb substrate. The device exhibits a 100 % cut-off wavelength of 4.6 µm at 150 K and 4.30 µm at 77 K. At 150 and 77 K, the device responsivity reaches peak values of 2.49 and 2.32 A/W at 3.75 µm under −1.0 V applied bias, respectively. The device reveals an electron dominated avalanching mechanism with a gain value of 6 at 150 K and 7.4 at 77 K which was observed under −6.5 V bias voltage. The gain value was measured at different temperatures and different diode sizes. The electron and hole impact ionization coefficients were calculated and compared to give a better prospect of the performance of the device.

High Field Carrier Transport Properties of Al0.45Ga0.55N

This work presented Monte Carlo (MC) simulation of Al 0.45 Ga 0.55 N to investigate the carrier transport properties in the high electric field region including impact ionization. The simulation investigates both electron and hole considering two non-parabolic conduction band and valence band respectively. The carriers’ drift velocity, energy and occupancy are simulated with respect to electric field at room temperature. The electron drift velocity peak at 2.70 × 10 7 cm/s with the electric field of 240 kV/cm. The electron starts to excite to higher valley at 170 kV/cm and has a spike in energy at 700 kV/cm due to the occurrence of impact ionization. The impact ionization rates are computed using modified Keldysh equation and it is shown that hole impact ionization rate is higher than that of electron for Al 0.45 Ga 0.55 N. This work also presents the impact ionization coefficient with hole dominating the impact ionization process above the electric field of 2.6 MV/cm.

Optimization of GaAs/AlGaAs staircase avalanche photodiodes accounting for both electron and hole impact ionization

A recently developed nonlocal history dependent model for electron and hole impact ionization is used to compute the gain and the excess noise factor in avalanche photodiodes featuring heterojunctions of III-V compound semiconductors while accounting for both carriers. The model has been calibrated with measurements by our group, as well as on noise versus gain data from the literature. We explore the avalanche photodiode design trade-offs related to the number of GaAs/AlGaAs conduction band steps for X-ray spectroscopy applications.

Carrier Transport Properties of GAN in High Electric Field

The Monte Carlo (MC) simulation of the carrier transport mechanisms including impact ionization at high electric field in GaN is presented. Two non-parabolic conduction and valence bands were considered for the simulation of transport properties of electron and hole respectively. The carriers’ drift velocity and energy are simulated as a function of applied electric field at room temperature. The maximum velocity of electron is 2.85 × 107 cm/s at 140 kV/cm. The velocity of electron is saturated at 2 × 107 cm/s at electric field greater than 300 kV/cm. In our work, the velocity of hole is 5 × 106 cm/s at 500 kV/cm. Electron energy increases as the electric field increase and fluctuated at electric field greater than 600 kV/cm when impact ionization occurred. The impact ionization rates are obtained by using modified Keldysh equation. The hole impact ionization rate is higher than that of electron. This work also shows higher electron impact ionization coefficient than that of hole at electric field greater than 4.04 MV/cm

Experimental determination of impact ionization coefficients of electrons and holes in gallium nitride using homojunction structures

In this study, we experimentally determined the impact ionization coefficients of GaN using homoepitaxially grown p-n diodes with avalanche capability. The extracted hole impact ionization coefficient is obtained as β(E) = 4.39 × 106 exp (−1.8 × 107/E) cm−1, and the electron impact ionization coefficient is obtained as α(E) = 2.11 × 109 exp (−3.689 × 107/E) cm−1. This study also presents the temperature dependence of impact ionization coefficients in GaN. The results presented in this experimental study are an important contribution to the database on the material properties of GaN, which will enable more accurate prediction of the avalanche in GaN devices.

Extremely low excess noise and high sensitivity AlAs0.56Sb0.44 avalanche photodiodes

Fast, sensitive avalanche photodiodes (APDs) are required for applications such as high-speed data communications and light detection and ranging (LIDAR) systems. Unfortunately, the InP and InAlAs used as the gain material in these APDs have similar electron and hole impact ionization coefficients (α and β, respectively) at high electric fields, giving rise to relatively high excess noise and limiting their sensitivity and gain bandwidth product1. Here, we report extremely low excess noise in an AlAs0.56Sb0.44 lattice matched to InP. A deduced β/α ratio as low as 0.005 with an avalanche region of 1,550 nm is close to the theoretical minimum and is significantly smaller than that of silicon, with modelling suggesting that vertically illuminated APDs with a sensitivity of −25.7 dBm at a bit error rate of 1 × 10−12 at 25 Gb s−1 and 1,550 nm can be realized. These findings could yield a new breed of high-performance receivers for applications in networking and sensing.