High Through-plane Thermal Conductivity Research Articles

Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation.

High-power-density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) for efficient heat dissipation. However, integrating low hardness, high damping, and superior heat transfer capability into one TIM is highly challenging. Herein, soft, damping, and thermally conductive TIMs are designed and prepared by constructing a honeycomb-board-mimetic boron nitride nanosheet (BNNS) network in a dynamic polyimine via one-step horizontal centrifugal casting. The unique filler network makes the TIMs perform a high through-plane thermal conductivity (> 7.69W m-1 K-1) and a uniform heat transfer process. Meanwhile, the hierarchical dynamic bonding of the polyimine endows the TIMs with low compressive strength (2.16MPa at 20% strain) and excellent damping performance (tan δ > ≈0.3 at 10-2-102Hz). The resulting TIMs also exhibit electrical insulation and remarkable recycling ability. Compared with the commercial ones, the TIMs provide better heat dissipation (4.1°C) for a high-power 5G base station and less temperature fluctuation (1.8°C) for an automotive insulated gate bipolar transistor (IGBT) under vibrations. This rational design offers a viable approach to prepare soft and damping TIMs for effective heat dissipation of high-power-density electronic devices under vibrations.

Thermal conductivity of epoxy composites containing 3D honeycomb boron nitride filler

Polymer matrix composites with excellent thermal management performance have emerged as remarkable materials in the realms of microelectronic devices and wireless communication technologies. However, achieving high thermal conductivity in most composites often requires a high filling load, which will compromise other desirable properties. Herein, utilizing physical foaming and vacuum infiltration methods, we introduce a 3D honeycomb composite consisting of surface-hydroxylated hexagonal boron nitride (OH-BN) and epoxy. The 3D OH-BN honeycomb foam in the composite features a lightweight design (0.33 g/cm3), high strength (7178 times its own weight) and prominent heat transfer performance. Significantly, these composites achieve notable thermal properties, including high through-plane thermal conductivity (2.073 W m−1 K−1) and relatively low thermal resistance (0.995 °C/W) at a reduced filling load (17.2 vol%). In comparison with pure epoxy, the through-plane thermal conductivity is enhanced by an impressive 894 %, while the thermal resistance is reduced to 1/9.4 of that observed in pure epoxy. Besides, the 3D honeycomb composites combine outstanding mechanical performance, low dielectric properties and excellent insulation, underscoring their potential in the field of thermal management applications in microelectronic devices, wireless communication systems and integrated circuits.

Phase change composites with ultra-high through-plane thermal conductivity achieved by vertically-aligned graphite film and double-shelled microcapsules

The heat dissipation in electronic devices has become bottleneck problem. One of the best solutions is to develop high performance materials which can not only dissipate the heat away, but also absorb heat energy. This kind of double function materials can be obtained by simultaneously using high thermal conductivity (TC) materials and phase change materials. The formation of continuous network of thermally conductive fillers is demonstrated as one of the most effective methods for fabricating highly thermally conductive composites. Here, graphite films (GF) are stacked and vertically cut to endow the composites with high through-plane TC. The obtained composites exhibit a through-plane TC of 51.55 W m−1 K−1 and a low thermal resistance of 0.398 °C cm2 W−1. Besides, double-shelled PDA@SiO2@paraffin (Pa) microcapsules are embedded into the composite to give its good heat-absorption capacity. Via a CPU thermal stress test, the composites demonstrate satisfactory temperature controlling performance.

Stable self-crosslinking phase change composites with vertically aligned boron nitride for high thermal conductivity thermal interface materials

Thermal interface materials (TIMs) must have a high through-plane thermal conductivity in order to efficiently transfer the heat generated by electronic components to heat sinks. Nevertheless, the achievement of high through-plane thermal conductivity is still a great challenge due to the inadequate thermal conductivity network as well as the lack of thermal response from the polymer matrix. Herein, we have developed a solid-solid phase change polymer matrix achieved through self-crosslinking polyethylene glycol (SCPEG). Subsequently, high-performance TIMs based on the SCPEG matrix and vertically aligned boron nitride (BN) nanosheets are obtained by bidirectional freezing, hot pressing, and longitudinal slicing. The prepared BN/SCPEG composites (BN content of 80 vol%) with a vertically oriented network achieved a through-plane thermal conductivity of 23.03 W m-1 K-1. More importantly, the vertically aligned BN nanosheets improve the thermal conductivity of composites, while the SCPEG matrix can reduce the hardness of composites by absorbing the heat, thus decreasing the contact thermal resistance.

Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics.

Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m-1 K-1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.

Highly thermally conductive and soft thermal interface materials based on vertically oriented boron nitride film

Thermal interface materials (TIMs) with high through-plane thermal conductivity (TC), softness, and electrical insulation are highly desired for modern electronics. However, it is challenging to simultaneously achieve these properties. Boron nitride (BN)-based polymer composites are promising candidates for advanced TIMs owing to the high TC and great electrical insulation of BN. However, previous works perform either low TC (< 8 W m−1 K−1) or high stiffness. The ultimate properties of BN-based TIMs remain largely unclear and unrealized. Here, we fabricate BN film-filled silicone rubber composites by a facile stacking-cutting method, which maintains the high degree of orientation the BN film, so that a record-high though-plane TC of 19.1 W m−1 K−1 and a low compressive modulus of 5.42 MPa are achieved. The low BN content (37 vol%) ensures the softness and resilience of the as-prepared TIMs. This work presents a highly efficient strategy to enhance the performance of BN based TIMs, promoting their large-scale manufacturing and practical applications.

Tree-ring structured phase change materials with high through-plane thermal conductivity and flexibility for advanced thermal management

Phase change materials (PCMs) as one of the most promising latent heat storage materials have been applied for thermal management of electronic devices. Nonetheless, simultaneously endowing PCMs with high through-plane thermal conductivity and flexibility remains challenging. Herein, a coupling strategy combining scraping, hot compression, and roll-cutting is proposed to fabricate polydimethylsiloxane/paraffin/boron nitride (PDMS/PW/BN) composites. The BN alignment across the in-plane (x-y direction) was firstly obtained via scraping, then hot compression and roll-cutting were introduced to induce BN aligned across the through-plane (z-direction). Consequently, PW was wrapped by the cross-linked PDMS/BN network, thus forming a similar tree-ring structure to natural wood. The tree-ring structure effectively avoided the liquid leakage of PW, thus showing a high dimension retention ratio of 98 %. The vertical orientation of the BN network imparted the PCMs improved through-plane thermal conductivity of the PCMs to 2.16 W·m−1·K−1 at a BN loading of 13.0 wt%, showing a remarkable improvement of 943 % in comparison with PDMS/PW. Interestingly, the PCMs exhibited tunable thermal conductivity by triggering the melting-crystallization transition of PW. The in-situ X-ray diffraction indicated that the BN network rearrangement occurred during the phase transition. Furthermore, the good thermal management capability of PCMs was practically confirmed on working chips and via finite element simulation. This work presents a cost-effective approach for producing flexible PCMs with high through-plane thermal conductivity, which have the potential to be used in the thermal management of advanced electronics.

Thin paints for durable and scalable radiative cooling

Passive daytime radiative cooling (PDRC) is environment-friendly without energy input by enhancing the coating’s solar reflectance (R¯solar) and thermal emittance (ε¯LWIR) in the atmosphere’s long-wave infrared transmission window. However, high R¯solar is usually achieved by increasing the coating’s thickness, which not only increases materials’ cost but also impairs heat transfer. Additionally, the desired high R¯solar is vulnerable to dust pollution in the outdoors. In this work, a thin paint was designed by mixing hBN plates, PFOTS, and IPA.R¯solar = 0.963 andε¯LWIR = 0.927 was achieved at a thickness of 150 μm due to the high backscattering ability of scatters. A high through-plane thermal conductivity (∼1.82 W m−1 K−1) also can be obtained. In addition, the porous structure coupled with the binder PFOTS resulted in a contact angle of 154°, demonstrating excellent durability under dust contamination. Outdoor experiments showed that the thin paint can obtain a 2.3 °C lower temperature for sub-ambient cooling than the reference PDRC coating in the daytime. Furtherly, the above-ambient heat dissipation performance can be enhanced by spraying the thin paint on a 3D heat sink, which was 15.7 °C lower than the reference 1D structure, demonstrating excellent performance for durable and scalable PDRC applications.

Constructing a highly vertically aligned network of h-BN/CF in silicone rubber composites: Achieving superior through-plane thermal conductivity and electrical insulation

Polymer composites with both high through-plane thermal conductivity (TC) and electrical insulation are desperately needed for the efficient thermal management of modern electronic devices. Herein, a highly vertically aligned network of hexagonal boron (h-BN) nitride/carbon fiber (CF) was constructed in silicone rubber composites via the combination of multistage stretching extrusion, layer-by-layer stacking and hot-pressing procedures. The composites exhibited superior through-plane TC and electrical insulation, simultaneously. The through-plane TC of the composites reached 9.5 W/(m·K) when the content of h-BN and CF was 120 phr and 5 phr, respectively. Meanwhile, the volume resistivity and breakdown voltage of the composites were 1.89 × 1013 Ω cm and 7.7 kV/mm, respectively, since the low content of CF was insufficient to form electrically conductive pathways. Furthermore, both simulation and experimental results indicated that the composites show outstanding heat dissipation performance. The composites with such hybrid networks are very promising for efficient heat dissipation in high-performance electronic devices.

Dual-encapsulated phase change composites with hierarchical MXene-graphene monoliths in graphene foam for high-efficiency thermal management and electromagnetic interference shielding

Multifunctional phase change materials (PCMs) simultaneously combining high-efficiency thermal management and electromagnetic interference (EMI) shielding performance are urgently desirable yet highly challenging for miniaturized and integrated electronics. Herein, an innovative polyethylene glycol (PEG) composite is developed based on a dual-encapsulation design of vertically aligned MXene-graphene monoliths in graphene foam (MGGF hybrid aerogel). The MXene-graphene monoliths are first incorporated with reticulated graphene foam via unidirectional freezing to construct a hybridized semi-interpenetrated framework, followed by thermal annealing and encapsulating molten PEG, synchronously forming orientational-interlinked thermal pathways in PCM matrix. Impressively, the resultant MGGF/PEG composite achieves a high through-plane thermal conductivity of 11.39 W m−1 K−1 and excellent EMI shielding effectiveness of ∼56.6 dB, as well as desirable latent heat density up to 160.3 J g−1, leakage-proof ability, and superior thermal reliability. Additionally, the MGGF/PEG-based device is demonstrated for thermal energy management toward versatile demands in electronics cooling and solar-thermoelectric conversion. This work sheds new light on designing multifunctional composite PCMs and raises tremendous application prospects for electronic thermal management and solar energy utilization.

Aramid nanofiber assisted preparation of 3D-oriented graphite/silicone composite slices with high through-plane thermal conductivity and efficient electromagnetic interference shielding

High-performance electromagnetic interference (EMI) shielding materials with outstanding thermal transfer ability are urgently needed for modern electronics. Here, efficient 3D-oriented graphite/silicone EMI shielding composite slices with high through-plane thermal conductivity were prepared through the construction of 3D-oriented graphite skeletons followed by incorporation of silicone and cutting. The flaky graphite was utilized as functional fillers, and an ultra-low addition of aramid nanofibers (ANFs) was conducted to construct the supporting frameworks to maintain the structure of 3D-oriented graphite skeletons. The strategy of constructing of 3D-oriented graphite skeletons before incorporating of silicone facilitated the forming of efficient electrically conductive network and thermal transfer pathway in the prepared composite slices. The differences in thermal, electrical and EMI shielding properties that originated from the orientation of interconnected flaky graphite were systematically studied. As a result, the composite slices show significant enhancements of EMI SE of 65.28 dB in X-band, 76.62 dB in Ka-band and through-plane thermal conductivity of 10.53 W m−1 K−1 at the graphite fraction of 32.68 vol%. Additionally, the composite slices exhibit a good near-field (NF) shielding performance at the frequency range of 1–9 GHz. The composite slices reveal substantial potential for advanced EMI shielding and thermal management applications.

Aligning graphene nanoplates coplanar in polyvinyl alcohol by using a rotating magnetic field to fabricate thermal interface materials with high through-plane thermal conductivity

With the continuous advancement of electronic devices, there is an urgent need for advanced thermal interface materials (TIMs) to prevent high-power density electronics from overheating. The orderly arrangement of thermally conductive fillers in TIMs plays a crucial role in enhancing thermal conduction along preferred directions. However, it is challenging to control the orientation of the fillers, especially for two-dimensional fillers. In this study, graphene nanoplates (GNPs) were co-planarly arranged in polyvinyl alcohol (PVA) using a rotating magnetic field, which significantly increased the thermal conductivity of the composites. The coplanar vertically aligned GNPs/PVA (CVGNPs/PVA) exhibited a through-plane thermal conductivity of 11.78 W m−1 K−1, which is about 10 times higher than that of the composites with disorderly distributed GNPs (1.14 W m−1 K−1). The rotating magnetic field facilitated the alignment of GNPs and increased face-to-face contact between adjacent GNPs, which significantly boosted the through-plane thermal conductivity of the composite. The compressive modulus of the CVGNPs/PVA composites was only 1.06 MPa, and it helped to reduce the thermal interface resistance to 49 mm2 K W−1. These results offer a novel approach for preparing excellent TIMs that could be used in various applications.

Vitrimer-Assisted Construction of Boron Nitride Vertically Aligned Nacre-mimetic Composites for Highly Thermally Conductive Thermal Interface Materials

Modern electronic equipment with high integration and power consumption levels urges for more effective thermal interface materials (TIMs) to tackle its increasingly severe cooling issues. To effectively transfer the heat generated by electronic components to the radiator, the TIM is supposed to have a high through-plane thermal conductivity (λ⊥); however, achieving that proved devilishly challenging. Herein, inspired by the structure of the natural shell nacre and based on the construction of a cis-polybutadiene (BR) vitrimer network with reversible B–O bonds, the nacre-mimetic microstructure with vertically aligned hexagonal boron nitride (BN) was rationally designed and fabricated. Combining the hot-pressed orientation with the stacking-welding method, the vertically aligned BN/BR composite (VAC) was obtained by longitudinal slicing, and the designed microstructure with intense orientation was verified by scanning electron microscopy and small-angle X-ray scattering. As a result, the VAC reached an unprecedented λ⊥ of 14.1 W·m–1·K–1 as the BN content was 52 vol %, and the running chip temperature was greatly reduced compared with that of commercial TIM. Besides the superior thermal conductivity, the BN/BR composite has excellent electrical insulation and flame resistance. It is believed that the simple fabrication and extendibility of the biomimetic composites pave a new way for the design and preparation of high-performance TIMs.

Design of Silicon Rubber/BN Film with High Through-plane Thermal Conductivity and Ultra-low Contact Resistance

Polymer-hexagonal boron nitride (BN) composite has become an ideal thermal interface material (TIM) for electronic devices because of its high thermal conductivity and superior electronic insulation. However, owing to the 2D shape and chemical inertness of BN filler, the vertical alignment of BN and the huge thermal resistance are current challenges, which hinder the efficient heat transfer of polymer/BN composites. Herein, by a novel non-solvent induced phase separation process combined “in-situ welding” strategy, we present the fabrication of silicone rubber film with finger-like continuous BN-welded filler skeleton, which reveals a high through-plane thermal conductivity of 15.4 W m−1K−1 at only ∼ 15 wt% BN. Finite element simulation and nonlinear model analyses theoretically confirm that the filler-to-filler interfacial thermal resistance (ITR) is halved after in-situ welding process. In addition, thanks to the excellent compressibility and conformability of silicon rubber matrix, the contact thermal resistance (<70 Kmm2W−1) of this composite film is much lower than that of the commercial thermal pad under different pressure. The proposed strategy opens up a novel and high-throughput preparation strategy for the high-performance TIM for modern electronic devices.

Ultrathin aluminum-graphite composite foil with high thermal conductivity prepared by hot-extrusion technique

Heat dissipation film/ foil materials with high thermal conductivity in the through-plane direction are in high demand for improving the heat dissipation in the integrated circuits (IC) with high level of integration. In this letter, ultrathin aluminum-graphite (Al-Gr) composite foil with high through-plane thermal conductivity (46 W/m·K) was fabricated using the hot-extrusion technique. Specifically, the ultrathin Al-Gr composite foil was obtained through a high extrusion ratio (∼13:1) using the Al-Gr cylinder, during which the graphite sheets act as an effective self-lubrication media. The high through-plane thermal conductivity of the ultrathin Al-Gr composite foil is attributed to the coupled effects of the clean and tight interfacial bonding state between the Al and graphite sheets as well as the interconnected graphite sheets in the through-plane direction. Ultrathin Al-Gr composite foil with high through-plane thermal conductivity is expected as a competitive candidate for enhancing the heat dissipation capacity of the IC system.

A binder-free ice template method for vertically aligned 3D boron nitride polymer composites towards thermal management

Hexagonal boron nitride (BN) is an attractive filler candidate for thermal interface materials, but the thermal conductivity enhancement is limited by the anisotropic thermal conductivity of BN and disordered thermal pathways in the polymer matrix. Herein, a facile and economic ice template method is proposed, wherein BN modified by tannic acid (BN-TA) directly self-assemble to form vertically aligned nacre-mimetic scaffold without additional binders and post-treatment. The effects of the BN slurry concentration and the ratio of BN/TA on three-dimensional (3D) skeleton morphology are fully investigated. The corresponding polydimethylsiloxane (PDMS) composite via vacuum-impregnation achieves a high through-plane thermal conductivity of 3.8 W/mK at a low filler loading of 18.7 vol%, which is 2433% and 100% higher than that of pristine PDMS and the PDMS composite with randomly distributed BN-TA, respectively. The finite element analysis results theoretically demonstrate the superiority of the highly longitudinally ordered 3D BN-TA skeleton in axial heat transfer. Additionally, 3D BN-TA/PDMS exhibits excellent practical heat dissipation capability, lower thermal expansion coefficient, and enhanced mechanical properties. This strategy offers an anticipated perspective for developing high-performance thermal interface materials to address the thermal challenges of modern electronics.

SiC Nanowires Bridged Graphene Aerogels with a Vertically Aligned Structure for Highly Thermal Conductive Epoxy Resin Composites and Their Mechanism

Thermal conductive composites have a wide application in the electronic packaging field, and fabricating three-dimensional (3D) graphene aerogels by the self-assembly method is a facile way to construct thermal conductive networks in polymer composites. But those self-assembled graphene aerogels can only endow composites with a limited thermal conductivity because (1) abundant defects on RGO sheets reduce their intrinsic thermal conductivity and (2) massive edges and gaps in aerogels cause severe phonon scattering. Many works before have been done to heal the defects by high-temperature annealing, but the works of filling gaps and decreasing phonon scattering are rare. Herein, we designed a facile route to synthesize SiC nanowires on the edges of RGO sheets for connecting adjacent RGO sheets, decreasing phonon scattering, and enhancing thermal conduction efficiency in graphene aerogels. Before that, RGO/Si aerogels with vertically aligned structures were obtained by the chemical reduction method and the freeze-drying method to enhance their through-plane thermal conduction efficiency. When the initial mass ratio of GO solute/silicon powder was 5:1, HGA-5 endowed the EP composite with a high through-plane thermal conductivity of 3.59 W m–1 K–1 at a relatively low filler loading of 2.87 wt %. Finite element analysis was applied to illustrate the thermal conductive mechanism of the hybrid aerogels-filled EP composites. The EMI shielding performance of the composites was also discussed in this work.

A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material

With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical durability. Among all the emerged TIMs, graphene-based TIMs have attracted increasing attention because of the ultrahigh intrinsic thermal conductivity of graphene nanosheets. Despite extensive efforts, developing high-performance graphene-based papers with high through-plane thermal conductivity remains challenging despite their high in-plane thermal conductivity. In this study, a novel strategy for enhancing the through-plane thermal conductivity of graphene papers by in situ depositing AgNWs on graphene sheets (IGAP) was proposed, which could boost the through-plane thermal conductivity of the graphene paper up to 7.48 W m-1 K-1 under packaging conditions. In the TIM performance test under actual and simulated operating conditions, our IGAP exhibits strongly enhanced heat dissipation performance compared to the commercial thermal pads. We envision that our IGAP as a TIM has great potential for boosting the development of next-generation integrating circuit electronics.

Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces

PurposeAlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of processing (energy density, laser power, laser scanning speed, support structure) and build orientation, are not well explored in the literature. This study aims to elucidate the relationship between processing, microstructure, and thermal conductivity.Design/methodology/approachThe thermal conductivity of laser powder bed fusion (L-PBF) AlSi10Mg samples are investigated by the flash diffusivity and frequency domain thermoreflectance (FDTR) techniques. Thermal conductivities are linked to the microstructure of L-PBF AlSi10Mg, which changes with processing conditions. The through-plane exceeded the in-plane thermal conductivity for all energy densities. A co-located thermal conductivity map by frequency domain thermoreflectance (FDTR) and crystallographic grain orientation map by electron backscattered diffraction (EBSD) was used to investigate the effect of microstructure on thermal conductivity.FindingsThe highest through-plane thermal conductivity (136 ± 2 W/m-K) was achieved at 59 J/mm3 and exceeded the values reported previously. The in-plane thermal conductivity peaked at 117 ± 2 W/m-K at 50 J/mm3. The trend of thermal conductivity reducing with energy density at similar porosity was primarily due to the reduced grain size producing more Al-Si interfaces that pose thermal resistance. At these interfaces, thermal energy must convert from electrons in the aluminum to phonons in the silicon. The co-located thermal conductivity and crystallographic grain orientation maps confirmed that larger colonies of columnar grains have higher thermal conductivity compared to smaller columnar grains.Practical implicationsThe thermal properties of AlSi10Mg are crucial to heat transfer applications including additively manufactured heatsinks, cold plates, vapor chambers, heat pipes, enclosures and heat exchangers. Additionally, thermal-based nondestructive testing methods require these properties for applications such as defect detection and simulation of L-PBF processes. Industrial standards for L-PBF processes and components can use the data for thermal applications.Originality/valueTo the best of the authors’ knowledge, this paper is the first to make coupled thermal conductivity maps that were matched to microstructure for L-PBF AlSi10Mg aluminum alloy. This was achieved by a unique in-house thermal conductivity mapping setup and relating the data to local SEM EBSD maps. This provides the first conclusive proof that larger grain sizes can achieve higher thermal conductivity for this processing method and material system. This study also shows that control of the solidification can result in higher thermal conductivity. It was also the first to find that the build substrate (with or without support) has a large effect on thermal conductivity.

Fabrication of Biobased Advanced Phase Change Material and Multifunctional Composites for Efficient Thermal Management

In this study, an advanced phase change material (PCM) was fabricated to combine the properties of a biobased thermoplastic polymer and the heat storage of PCM to overcome the limitations of the existing PCM composites. The novel PCM of erythritol (ET)-grafted polylactic acid (PLA) (ETPLA) was prepared by the in situ polymerization of ET and PLA. The thermally conductive ETPLA composites were fabricated by injection molding using a hybrid filler system of oxidized carbon fiber (CF-OH) and aluminum nitride (AlN), which showed a high through-plane thermal conductivity of 4.25 W/mK, a tensile strength of 16.4 MPa (1953% enhancement comparing pure ET), an elongation at break of 4.4% (189% enhancement comparing pure ET), and latent heat of 170.7 J/g. Thus, the ETPLA/CF-OH/AlN composites facilitate efficient thermal management to combine heat saving and heat dissipation through the large latent heat and high thermal conductivity. Thus, the fabricated PCM composites have potential applications in thermal management systems of next-generation electronic devices.