High-temperature Co-fired Ceramics Technology Research Articles

A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application.

This paper introduces a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end. The SIP adopts the packaging scheme of an inner heat-dissipation gasket and multi-layer substrate in the high temperature co-fired ceramics (HTCC) shell with a metal heat sink at the bottom. The gasket effectively solves the heat-dissipation problem of high-power transceiver chips, and the multi-layer substrate achieves the interconnection between multiple chips. Within the limited size of 14.0 × 14.0 × 2.5 mm3, the SIP integrates five bidirectional amplifier chips, an amplitude-phase control multi-function chip, and two power modulation chips to realize the Ku-band four-channel RF transceiver front-end. Transmitting power over 0.5 W (27dBm) and receiving noise figure of 3.4 dB are achieved in the Ku-band. The efficient heat dissipation, high air tightness, and excellent integration are simultaneously realized in this SIP. The measurement results show that the performance is stable in the receiving and transmitting states, and the SIP based on HTCC technology has specific prospects for radar transceiver application.

Manufacturing and characterization of a ceramic single-use microvalve

We present the manufacturing and characterization of a ceramic single-use microvalve with the potential to be integrated in lab-on-a-chip devices, and forsee its utilization in space and other demanding applications. A 3 mm diameter membrane was used as the flow barrier, and the opening mechanism was based on cracking the membrane by inducing thermal stresses on it with fast and localized resistive heating.Four manufacturing schemes based on high-temperature co-fired ceramic technology were studied. Three designs for the integrated heaters and two thicknesses of 40 and 120 μm for the membranes were considered, and the heat distribution over their membranes, the required heating energies, their opening mode, and the flows admitted through were compared. Furthermore, the effect of applying +1 and −1 bar pressure difference on the membrane during cracking was investigated. Thick membranes demonstrated unpromising results for low-pressure applications since the heating either resulted in microcracks or cracking of the whole chip. Because of the higher pressure tolerance of the thick membranes, the design with microcracks can be considered for high-pressure applications where flow is facilitated anyway. Thin membranes, on the other hand, showed different opening sizes depending on heater design and, consequently, heat distribution over the membranes, from microcracks to holes with sizes of 3–100% of the membrane area. For all the designs, applying +1 bar over pressure contributed to bigger openings, whereas −1 bar pressure difference only did so for one of the designs, resulting in smaller openings for the other two. The energy required for breaking these membranes was a few hundred mJ with no significant dependence on design and applied pressure. The maximum sustainable pressure of the valve for the current design and thin membranes was 7 bar.

Platform to develop exhaust gas sensors manufactured by glass-solder-supported joining of sintered yttria-stabilized zirconia

Abstract. A manufacturing process for a planar binary lambda sensor is shown. By joining the heating and the sensing components via glass soldering with a joining temperature of 850 °C, a laboratory platform has been established that allows the manufacturing of two independent parts in high-temperature co-fired ceramics technology (HTCC) with electrodes that are post-processed at lower temperatures, as is required for mixed-potential sensors. The final device is compared to a commercial sensor with respect to its sensing performance. Important processes and possible origins of problems as well as their solutions during sensor development are shown, including heater design and joining process.

An Embedded Passive Resonant Sensor Using Frequency Diversity Technology for High-Temperature Wireless Measurement

This paper presents an embedded wireless passive temperature sensor for measurements in high-temperature applications, such as compressors and turbine engines. The performance of the sensor was improved by optimizing its performance parameters. A high-temperature-resistant material was used, and an embedded structure design was introduced to enable the sensor to operate in high-temperature environments. A series <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">LC</i> resonant circuit containing a fixed inductance coil and variable capacitance that varies with temperature was embedded in an alumina ceramic substrate using high-temperature cofired ceramic technology. The temperature in the high-temperature environment was detected wirelessly via the frequency diversity of the sensor. Furthermore, the experimental results showed that the sensor can measure temperatures ranging from room temperature to 1000 °C, and the average sensitivity of the sensor is <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\sim 2$ </tex-math></inline-formula> KHz/°C.

Fabrication and measurement of wireless pressure-sensitive micro-device based on high temperature co-fired ceramics technology

Purpose– The paper aims to highlight a wireless pressure-sensitive micro-device with high pressure sensitivity and accuracy. It is based on the partially stabilized Zirconia (PSZ) ceramic material which is capable of excellent elasticity and robustness.Design/methodology/approach– The paper begins with a general introduction to the wireless interrogating method and then the fabrication processes of the device using high temperature co-fired ceramic (HTCC) technology are described in detail.Findings– A passive wireless micro-device made from a novel material-PSZ ceramic on pressure monitoring is fabricated and tested and the authors proved that the device possesses an advantages over some proposed wireless sensors on interrogating distance. The pressure sensitivity of the device is 336 kHz/bar at readout distance 2.5 cm and that is an excellent property.Originality/value– The paper shows a new design scheme for wireless pressure measurement. The future application of the wireless device indicates the problem on external packaging and wire connection could be avoided. The allowable interrogation distance between the device and readout circuit reaches 2.5 cm which is mentioned for the first time so far. The distance is long enough to insert a thermal insulation material which can protect the vulnerable readout circuit from harsh environment, so the research finding is meaningful for the modern measurement technology.