In the case of high-speed PCB design, the use of electromagnetic band gap (EBG) structure technology is useful in reducing simultaneous switching noise (SSN) in high-frequency applications. In high-frequency processes, parasitic filters are ineffective. Conducted emission is reduced by including the planar EBG structure into PCB plane layers. Various planar structures are taken and simulated in this research, including LC type, Z-Bridge with embedded double square, L-Bridge with slit type, alternating impedance, slit type EBG, Triple square type, and two topology type structures. A frequency sweep of 0 GHz to 10 GHz is used with a FEM solution. Theoretical calculations of the structures are performed and compared to simulation results, which show that they are very similar. Based on the best bandwidth and noise depth, the L-Bridge with slit and Triple square type cases were chosen, constructed, and analyzed using a vector network analyzer; it was discovered that the noise depth and bandwidth are in good accord. In addition, the AC analysis-Electric Field distribution for power and ground planes is explored, and the maximum and minimum field levels may be understood as a consequence.