In this paper, we investigate the use of the cold spray additive manufacturing technique to deposit micron-sized composite particles of high-density polyethylene (HDPE) compounded with either micron or nanometer sized particles of silicon dioxide (SiO2) or copper (Cu). In this study, the mass fraction of the SiO2 and copper particles added into the final composite powders was varied between 0.5 % and 9.1 % and the deposition efficiency of each composite powder was measured. Deposition of the composite powders onto an HDPE substrate was successful even at the highest particle loadings tested. In each case, an optimal mass fraction of silicon dioxide or copper particles was observed with a maximum value of deposition efficiency larger than that of the pure HDPE. For the silicon dioxide composite powders, the deposition efficiency nearly doubled compared to the pure HDPE powders. The improvement of deposition efficiency at moderate particle loadings is likely due to the increase in the impact kinetic energy of the particles resulting from the increase in the density of the composite powders. While the decrease in deposition efficiency at high particle loadings is likely the result of the increased coverage of the silicon dioxide and copper particles on the surface of the HDPE powders limiting the interaction between the HDPE of the composite powder with the HDPE substrate. SEM images show that it is possible to create a smooth, dense, and uniform thin-film polymer composite coating using cold spray.
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