Designing thermal systems for space platforms is a challenging task due to the wide variability in thermal conditions during the orbit and the strict constraints imposed by other subsystems. Several strategies have been developed to address these challenges while minimizing the thermal control subsystem’s signature, encompassing different algorithms optimize components positions in the platform. When relocation is not possible, thermal couplings between components can be modified to enhance heat transfer and achieve more uniform temperature distribution. To design optimal thermal paths in 2D space structures, in this paper a topology optimization framework based on the Heaviside Projection Method is introduced, using the Lumped Parameter Method (LPM) and taking the radiation heat transfer into account. The algorithm’s performance is tested on a Printed Circuit Board (PCB) by designing an optimal copper layer to meet specific thermal requirements under both extreme hot and cold conditions. Results show a significant improvement in thermal compliance for all components with the addition of this high-conductivity layer. Additionally, a reduction method is introduced to transfer the material distribution from the optimization to a coarser mesh of any size, which is useful to facilitate its implementation in existing software, where a large number of degrees of freedom can be a limitation.
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