Temperature-rise history control technology is widely applied in rapid thermal process and material thermal assessment. We present an open-loop temperature rise history control method. The fundamental concept involves loading a heat flux history onto the sample’s surface, inversed from the target temperature rise history, to regulate the sample’s temperature through programming the energy flux history of the scanning electron beam. We reconstructed the temperature-rise history of the leading edge of an aircraft during the HIFIRE-5b flight test with a relative deviation of 1%. Additionally, we reconstructed a typical temperature rise curve of a silicon wafer during rapid thermal processing with a relative deviation of 1%. In theory, this temperature control method can be extended to two-dimensional and three-dimensional heat transfer processes to achieve transient control of sample surface/cross-section temperature field with one- or two-dimensional distribution characteristics. This research can provide a high-performance temperature control technology for a wide range of industrial fields, and lay a theoretical foundation for the development of related technologies based on temperature history analysis.
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