The vapor chamber is a high thermal conductivity device with significant potential for enhancing the power density of permanent magnet synchronous motors. Practical installation requirements and the heat curing process of thermal conductive adhesive impose strict demands on vapor chambers, such as precise 3D profiles and resistance to expansion. This paper presents a novel 3D wave vapor chamber with high thermal conductivity, a design not previously reported. Special internal support structures are engineered to ensure the vapor chamber with performances of thermal conductivity, anti-expansion, and bendability. Simulation results show an anti-expansion deformation of 6.28 % at 125 °C. Heat transfer experiments demonstrate that the 3D vapor chamber achieves an effective thermal conductivity of 4426.73 W/m·K and a thermal resistance of 0.136 °C/W under a 100 W heating load. Furthermore, the 3D vapor chamber-based cooling strategy manages a heat load of 143.93 W at a cutoff temperature of 90 °C, marking an 82.1 % improvement over traditional cooling methods.
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