GaN Schottky Barrier Diodes Research Articles

Vertical GaN Schottky barrier diodes with ohmic contact on N-polar by the atomic layer deposition of aluminum oxide interfacial layer

In this paper, high-performance vertical GaN on GaN Schottky Barrier Diodes (SBDs) on 2-inch free-standing (FS)-GaN is presented with the specific on-state resistance (Ron) of 1.34 mΩ·cm2, breakdown voltage (Vbr) of 1150 V and figure of merit (FOM) of 0.98 GW/cm2. He-implanted edge termination (ET) structure is introduced to alleviate the peak electric field concentration effect at the anode edge of GaN SBDs. Furthermore, A new ohmic contact structure is explored by atomic layer deposition (ALD)-grown AlOx interfacial layer. Based on the self-cleaning effect of ALD and Ultra-thin AlOx interfacial layer, the Fermi-level Pinning (FLP) effect is alleviated effectively, the specific contact resistivity (ρc) on N-polar GaN was reduced from 1.63 × 10−3 to 7.14 × 10−5 Ω·cm2.The temperature variation test demonstrate the devices has potential of temperature sensors under high voltage and high temperature.

MOS-structured MoS2/GaN Schottky barrier diodes with high on/off current ratio and low threshold voltage

GaN Schottky barrier diodes (SBDs) have been investigated for a variety of power applications. However, the problems of low on/off current ratio and high threshold voltage caused by the difficult high-quality doping restrict its utilization in power devices. In this work, quasi-vertical MoS2/GaN SBDs with Metal-Oxide-Semiconductor (MOS) structure have been proposed. The MOS structure is formed by the part of anode (Ni/Au) over the Al2O3, Al2O3, and monolayer MoS2. Monolayer MoS2 exhibits n-type doping and p-type doping under forward bias and reverse bias, respectively, which realizes an adjustment in the Fermi level of the monolayer MoS2, resulting in a change in the resistance of the SBDs. The as-prepared SBDs present a high on/off current ratio of 2.40 × 1011, a low threshold voltage of 0.55 V at 1 A/cm2, and a low reverse leakage current of 2.50 × 10−10 A/cm2 at −1 V. This work shows that the MOS-structured MoS2/GaN SBDs are promising for next-generation power electronics.

Leakage current in GaN-on-GaN vertical GaN SBDs grown by HVPE on native GaN substrates

This study investigates leakage mechanisms in vertical GaN-on-GaN Schottky barrier diodes (SBDs) and demonstrates effective mitigation strategies. The fabricated devices exhibit low reverse leakage current (1 × 10−5 A/cm2 at −200 V) and a high Ion/Ioff ratio (∼1010), surpassing the performance of GaN SBDs on foreign substrates. We elucidate dominant leakage mechanisms—thermionic emission, Poole–Frenkel emission, and variable-range hopping—and their evolution with temperature and bias. Optimized fabrication processes, including defect etching and a novel dual-layer passivation technique, achieve over a 1000-fold reduction in leakage current.

Effects of contactless photoelectrochemical reaction on repair of etching damage in GaN SBD

This research investigates the reparative impact of photoelectrochemical (PEC) reactions on damage induced by inductively coupled plasma (ICP) etching in process of the Schottky barrier diodes (SBDs). After the PEC reaction repair, the reverse leakage current of the devices exhibited a significant reduction, typically ranging from 1 to 3 orders of magnitude. The ideality factor decreased from approximately 5 to 2, accompanied by a simultaneous decrease in series resistance. SBDs subjected to PEC processing displayed a notable decline in frequency dispersion. Quantitative analysis from capacitance-frequency measurements indicated that the PEC process effectively rectified the damage caused by dry etching on the GaN surface. The results of X-ray Photoelectron Spectroscopy (XPS) showed that the gallium oxide formed on a GaN surface by PEC treatment and the ratio of N/(Al + Ga) becomes larger, which indicates that fewer nitrogen vacancies (NV) after PEC repair process. The mechanism of the repair effects of PEC for the SBDs were discussed and analyzed. The observed improvements underscore the efficacy of PEC reactions in mitigating the adverse effects of etching, providing some inspirations for the enhancement of SBD performance in GaN-based devices.

Reverse Leakage Current Hysteresis in GaN Schottky Barrier Diodes Interpreted in Terms of a Trap Energy Band

Reverse Leakage Current Hysteresis in GaN Schottky Barrier Diodes Interpreted in Terms of a Trap Energy Band

Recess-free thin-barrier AlGaN/GaN Schottky barrier diodes with ultra-low leakage current: Experiment and simulation study

In GaN Schottky barrier diodes (SBD), there is a trade-off between the turn-on voltage and the leakage current. In this study, recess-free 4 nm-thin-barrier AlGaN/GaN SBDs with minimal leakage current as well as excellent turn-on voltage homogeneity are developed, which enable better electrical control to pinch off the 2DEG channel under the anode region and avoids trap introduced in the barrier etching process. In detail, the effect of reverse stress on the SBD performance is initially explored by using differential conductance, and then, the anode-to-cathode distances and temperatures dependence of SBDs output characteristics are systematically studied. The fabricated thin-barrier GaN SBDs show a turn-on voltage of ∼0.75 V and a low level leakage current of 9.66 × 10−10 (1.91 × 10−8) A/mm at 300 (423) K, which is among the lowest reported values at the comparable reverse bias voltage and temperature. Moreover, structure parameters of the thin-barrier AlGaN/GaN SBD are systematically modeled and optimized by the TCAD simulations, including anode metal work function, Al mole fraction, the anode-to-cathode distance, and slanted anode angle. The introduction of slanted anode is found to have significant effect on the improvement of reverse breakdown voltage and leakage current characteristics.

Effect of annealing on the electrical performance of N-polarity GaN Schottky barrier diodes

A nitrogen-polarity (N-polarity) GaN-based high electron mobility transistor (HEMT) shows great potential for high-frequency solid-state power amplifier applications because its two-dimensional electron gas (2DEG) density and mobility are minimally affected by device scaling. However, the Schottky barrier height (SBH) of N-polarity GaN is low. This leads to a large gate leakage in N-polarity GaN-based HEMTs. In this work, we investigate the effect of annealing on the electrical characteristics of N-polarity GaN-based Schottky barrier diodes (SBDs) with Ni/Au electrodes. Our results show that the annealing time and temperature have a large influence on the electrical properties of N-polarity GaN SBDs. Compared to the N-polarity SBD without annealing, the SBH and rectification ratio at ±5 V of the SBD are increased from 0.51 eV and 30 to 0.77 eV and 7700, respectively, and the ideal factor of the SBD is decreased from 1.66 to 1.54 after an optimized annealing process. Our analysis results suggest that the improvement of the electrical properties of SBDs after annealing is mainly due to the reduction of the interface state density between Schottky contact metals and N-polarity GaN and the increase of barrier height for the electron emission from the trap state at low reverse bias.

Reverse-bias current hysteresis at low temperature in GaN Schottky barrier diodes

In this paper, we report an analysis of reverse current mechanisms observed in GaN Schottky barrier diodes leading to hysteretic behavior of the I–V curves at low temperature. By means of DC measurements from 33 to 475 K, we demonstrate the presence of two leakage mechanisms when comparing the experiments with the results obtained using a unified model to predict the ideal reverse current of the diode. Poole–Frenkel emission is the dominant mechanism for temperatures above 200 K, while trap-assisted tunneling prevails for lower temperatures, where also, hysteresis cycles are revealed by means of DC dual-sweep voltage measurements. The energy of the corresponding traps has also been determined, being around 0.2 and 0.45 eV, respectively. The hysteresis phenomenon is attributed to the bias-induced occupancy of the energy states originating the leakage-current processes, which leads to the reduction of the reverse current after a high negative voltage is applied to the diode.

Lateral polarity controlled quasi-vertical GaN Schottky barrier diode with sidewalls absence of plasma damages

In this Letter, a high-performance quasi-vertical GaN Schottky barrier diode (SBD) with low leakage current and high on/off ratio based on a unique lateral polarity structure (LPS) is presented. The SBD features with the III-polar domain as the active region and the partially wet etched N-polar domain as the current-spreading region, completely eliminating plasma damages. Compared to the SBD fabricated by the conventional plasma etching technique, the leakage current of the LPS-based SBD is two orders of magnitude lower. A high Ion/Ioff of 107, an ideality factor of 1.04, a breakdown voltage of 290 V, and a critical electric field of 2.1 MV/cm were demonstrated for the proposed structure.

Ga-polar GaN Camel diode enabled by a low-cost Mg-diffusion process

In this letter, we show that low-cost physical vapor deposition of Mg followed by a thermal diffusion annealing process increases the effective barrier height at the metal/Ga-polar GaN Schottky interface. Thus, for the first time, GaN Camel diodes with improved barrier height and turn-on voltage were realized compared to regular GaN Schottky barrier diodes. Temperature-dependent current–voltage characteristics indicated a near-homogeneous and near-ideal behavior of the GaN Camel diode. The analysis performed in this work is thought to be promising for improving the performance of future GaN-based unipolar diodes.

1 kV GaN-on-Si Quasi-Vertical Schottky Rectifier

This work demonstrates quasi-vertical GaN Schottky barrier diodes (SBDs) on 6-inch Si substrate with a breakdown voltage (BV) over 1 kV, the highest BV reported in vertical GaN-on-Si SBDs to date. The deep mesa inherently in quasi-vertical devices is leveraged to form a self-aligned edge termination, and the mesa sidewall is covered by the p-type nickel oxide (NiO) as a reduced surface field (RESURF) structure. This novel termination enables a parallel-plate junction electric field of 2.8 MV/cm, being close to the material limit for GaN. The device also shows a high on/off ratio of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">10</sup> , low turn-on voltage of 0.5 V, and low specific on-resistance of 1.1 mΩ∙cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . Moreover, the device exhibits excellent overvoltage robustness under the continuous 800 V stress in the unclamped inductive switching test. These results show the good promise of the low-cost vertical GaN-on-Si power diodes.

Degradation of vertical GaN diodes during proton and xenon-ion irradiation

We investigated the material stability of a vertical GaN Schottky barrier diode (SBD) against proton irradiations by making real-time measurements. The reverse current gradually decreased with increasing proton fluence. The current of the GaN SBD was reduced by 18% after proton irradiations with a displacement-damage dose (D d) of 1012 MeV g−1. We also examined signal and current degradation occurring in a vertical GaN-on-GaN p–n diode (PND) during xenon-ion irradiations. The signal gradually decreased with increasing xenon-ion fluence. Xenon-ion irradiations of D d = 1012 MeV g−1 reduced the collected charge in the PND by 11%. This signal degradation was close to the current degradation in the GaN SBD caused by the proton irradiations. We found that irradiations with D d > ∼1012 MeV g−1 degraded the performance of the GaN devices.

Lateral p-type GaN Schottky barrier diode with annealed Mg ohmic contact layer demonstrating ideal current–voltage characteristic

We have demonstrated the fabrication process for a lateral p-type Schottky barrier diode (SBD) with the annealed Mg ohmic contact layer on a MOVPE-grown p-GaN wafer and measured the electrical characteristic of the diode. Because of the selective-area ohmic contact, the interface between the Schottky electrode and p-type GaN is well protected from any damage introduced by dry-etching or regrowth. The ideality factor of the forward current–voltage characteristic is as low as 1.09 at room temperature and an on–off ratio above 109 is also achieved. Various metals are deposited as the Schottky electrode and the work function dependence of the Schottky barrier height is confirmed with a pinning factor of 0.58. The temperature dependence of the current–voltage characteristic indicates that the GaN p-type SBD still fits the thermionic emission mode at 600 K with an ideality factor of 1.1. The reverse current of the p-SBD is also studied with the Poole–Frenkel emission model, and the trap energy level in the p-GaN is confirmed.

Trap analysis on Pt-AlGaN/GaN Schottky barrier diode through deep level transient spectroscopy

Trap characterization on GaN Schottky barrier diodes (SBDs) has been carried out using deep-level transient spectroscopy (DLTS). Selective probing by varying the ratio of the rate window values (r) incites different trap signatures at similar temperature regimes. Electron traps are found to be within the values: 0.05–1.2 eV from the conduction band edge whereas the hole traps 1.37–2.66 eV from the valence band edge on the SBDs. In the lower temperature regime, the deeper electron traps contribute to the capacitance transients with increasing r values, whereas at the higher temperatures >300 K, a slow variation of the trap levels (both electrons and holes) is observed when r is varied. These traps are found to be mainly contributed to dislocations, interfaces, and vacancies within the structure.

Interface-state suppression of AlGaN/GaN Schottky barrier diodes with post-anode-annealing treatment

Owing to the high density and high mobility of two-dimensional electron gas (2DEG) induced by strong spontaneous polarization and piezoelectric polarization effect, AlGaN/GaN Schottky barrier diodes (SBDs) with high output current density and low on-resistance have proved to be a promising candidate. Anode of GaN SBD is the core structure, which affects the device performance such as turn-on voltage, reverse current, on-resistance, and breakdown voltage. Therefore, idealized Schottky junction with low interface state density is very important in achieving high-performance GaN SBD. In this work, AlGaN/GaN SBD with low work-function metal W as anode is fabricated, and the post-anode-annealing (PAA) treatment is found to be effective in promoting the bonding reaction between anode metal and GaN in the anode region. Comparing with GaN SBDs without PAA treatment, the interface state density decreases from 9.48×10&lt;sup&gt;15&lt;/sup&gt; eV&lt;sup&gt;–1&lt;/sup&gt;·cm&lt;sup&gt;–2&lt;/sup&gt; to 1.77×10&lt;sup&gt;13&lt;/sup&gt; eV&lt;sup&gt;–1&lt;/sup&gt;·cm&lt;sup&gt;–2&lt;/sup&gt; after PAA treatment. The reverse leakage current is reduced by two orders, which ascribes to the idealized anode interface with low interface state density. Meanwhile, the influence of interface state on carriers in the forward conduction process is also suppressed, and the differential on-resistance of the fabricated GaN SBDs decreases from 17.05 Ω·mm to 12.57 Ω·mm. It is obvious that the PAA process proves to be an effective method to suppress the interface states density at M/S interface, thus significantly improving the performance of GaN SBD, which is the key technology in fabricating the high-performance GaN device.

Low leakage current and high breakdown voltage of AlGaN/GaN Schottky barrier diodes with wet-etching groove anode

AlGaN/GaN heterojunction epitaxies with wide bandgap, high critical electric field as well as high density and high mobility two-dimensional electron gas have shown great potential applications in the next-generation high-power and high-frequency devices. Especially, with the development of Si-based GaN epitaxial technique with big size, GaN devices with low cost also show great advantage in consumer electronics. In order to improve the rectification efficiency of AlGaN/GaN Schottky barrier diode (SBD), low leakage current and low turn-on voltage are important. The GaN Schottky barrier diode with low work-function metal as anode is found to be very effective to reduce turn-on voltage. However, the low Schottky barrier height makes the Schottky interface sensitive to damage to groove surface, which leads to a high leakage current. In this work, a novel wet-etching technique with thermal oxygen oxidation and KOH corrosion is used to prepare the anode groove, and the surface roughness of groove decreases from 0.57 to 0.23 nm, compared with that of the dry-etching surface of groove. Meanwhile, the leakage current is suppressed from 1.5 × 10&lt;sup&gt;–6&lt;/sup&gt; to 2.6 × 10&lt;sup&gt;–7&lt;/sup&gt; A/mm. Benefiting from the great corrosion selectively of hot KOH solution to AlGaN barrier layer and GaN channel layer after thermal oxygen oxidation, the spikes of the edge of groove region caused by the nonuniform distribution of plasma in the cavity is improved, and the breakdown voltage of the fabricated AlGaN/GaN SBDs is raised from –1.28 to –1.73 kV.

Mg-implanted vertical GaN junction barrier Schottky rectifiers with low on resistance, low turn-on voltage, and nearly ideal nondestructive breakdown voltage

Vertical GaN junction barrier Schottky (JBS) diodes with superior electrical characteristics and nondestructive breakdown were realized using selective-area p-type doping via Mg ion implantation and subsequent ultra-high-pressure annealing. Mg-ion implantation was performed into a 10 μm thick Si-doped GaN drift layer grown on a free-standing n-type GaN substrate. We fabricated the JBS diodes with different n-type GaN channel widths Ln = 1 and 1.5 μm. The JBS diodes, depending on Ln, exhibited on-resistance (RON) between 0.57 and 0.67 mΩ cm2, which is a record low value for vertical GaN Schottky barrier diodes (SBDs) and high breakdown (BV) between 660 and 675 V (84.4% of the ideal parallel plane BV). The obtained low RON of JBS diodes can be well explained in terms of the RON model, which includes n-type GaN channel resistance, spreading current effect, and substrate resistance. The reverse leakage current in JBS diodes was relatively low 103–104 times lower than in GaN SBDs. In addition, the JBS diode with lower Ln exhibited the leakage current significantly smaller (up to reverse bias 300 V) than in the JBS diode with large Ln, which was explained in terms of the reduced electric field near the Schottky interface. Furthermore, the JBS diodes showed a very high current density of 5.5 kA/cm2, a low turn-on voltage of 0.74 V, and no destruction against the rapid increase in the reverse current approximately by two orders of magnitude. This work demonstrated that GaN JBS diodes can be strong candidates for low loss power switching applications.

Comprehensive characterization of vertical GaN-on-GaN Schottky barrier diodes

This paper reports comprehensive characterization of vertical GaN-on-GaN Schottky barrier diodes (SBDs) fabricated on free-standing GaN substrates. The GaN active layer properties are evaluated by atomic force microscopy (AFM), secondary-ion mass spectrometry (SIMS), micro-Raman spectroscopy, cathodoluminescence (CL), and deep-level transient Fourier spectroscopy (DLTFS). The GaN SBDs exhibit near-unity ideality factor (n = 1.1), promising Schottky barrier height (SBH) of ΦB = 0.82 eV, low turn-on voltage ∼0.56 V, leakage current density of JR < 5.5 × 10−6 Acm−2 at −100 V, breakdown voltage VBR < −200 V, and less interface state density (NSS < 5 × 1012 eV−1 cm−2) at the Ni/GaN Schottky contact. The forward and reverse current transport mechanisms of the SBD are identified by fitting analysis of measured J-V. Weak temperature dependence of ΦB and n is detected from I–V-T measurements. Similar traps at EC - 0.18 eV and EC - 0.56 are identified in the various SBDs from DLTFS, signifying that these traps are omnipresent defects in the epilayer.

High-Efficiency D-Band Monolithically Integrated GaN SBD-Based Frequency Doubler With High Power Handling Capability

A high-efficiency <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${D}$ </tex-math></inline-formula> -band monolithically integrated GaN frequency doubler based on a pair of antiseries four-anode planar GaN Schottky barrier diodes (SBDs) has been successfully fabricated. Unlike the traditional hybrid integrated circuit technology, the monolithic integrated circuit technology has been used in the design and fabrication of GaN SBD-based frequency doubler circuits to achieve good alignment and low conversion losses. At room temperature, the experiments show that the peak conversion efficiency reaches 17.0% at 115.6 GHz under a continuous wave (CW) driving which is a critical requirement for many practical applications. The efficiency of 17.0% is the highest efficiency of GaN SBD-based multipliers at present under CW driving mode. This monolithically integrated doubler also exhibits a broadband high efficiency characteristic of more than 4.7% (−5.58 dB from 17%) across a 10% band from 109 to 121 GHz. In addition, high CW power handling capability of the proposed frequency doubler is verified. The experiments show that the frequency doubler can endure a maximum CW input power of 0.5 W.

120 GHz Frequency-Doubler Module Based on GaN Schottky Barrier Diode.

Traditional GaAs-based frequency multipliers still exhibit great challenges to meet the demand for solid-state high-power THz sources due to low breakdown voltage and heat dissipation of the Schottky barrier diode (SBD). In this study, a GaN SBD chain was fabricated with n−/n+-GaN structure. As a consequence, the breakdown voltage of 54.9 V at 1 μA and cut-off frequency of 587.5 GHz at zero bias were obtained. A 120 GHz frequency-doubler module based on the GaN SBD chain was designed and fabricated. When driven with 500 mW input power in a continuous wave, the output power of the frequency-doubler module was 15.1 mW at 120 GHz. Moreover, the experiments show that the frequency-doubler module can endure an input power of 2 W. In addition, it is worth noting that the SBD chain works well at an anode temperature of 337.2 °C.