Spiropyran is a dynamic organic compound that is distinguished by its reversible conversion between two forms: the colorless closed spiropyran (SP) form and the purple open merocyanine (MC) form. Typically triggered by UV light and reversed by visible light, spiropyran-functionalized surfaces offer reversible conversion in properties including color, polarity, reactivity, and fluorescence, making them applicable to diverse applications in chemical sensors, biosensors, drug delivery, and heavy metal extraction. While spiropyran has been successfully incorporated into various material platforms with SiO2 surfaces, its application on flat surfaces has been limited due to surface area constraints and a lack of standardized evaluation methods, which largely depend on the integration approach and substrate type used. In this study, we systematically review the existing literature and categorize integration methods and substrate types first and then report on our experimental work, in which we developed a streamlined three-step immobilization protocol, which includes surface activation, amination with (3-aminopropyl) triethoxysilane (APTES), and subsequent functionalization with carboxylic spiropyran (SP-COOH). Using SiO2 surfaces as a demonstration, we have also established a robust characterization protocol, consisting of contact angle measurements, X-ray photoelectron spectroscopy (XPS), ellipsometry, and fluorometric analysis. Our results evaluate the newly developed immobilization protocol, demonstrating effective activation and optimal amination using a 2% APTES solution, achieved in 5 min at room temperature. Fluorescence imaging provided clear contrast between the SP and the MC forms. Furthermore, we discuss limitations in the surface density of functional groups and steric hindrance and propose future improvements. Our work not only underscores the versatility of spiropyran in surface patterning but also provides optimized protocols for its immobilization and characterization on SiO2 surfaces, which may be adapted for use on other substrates. These advancements lay the groundwork for on-chip sensing technologies and other applications.