By the controlling of variable, the influences on the film interface strength that filmline molding process had were investigated. The interfacial bonding strength under the circumstance where various of processing parameters (temperature, film thickness, injecting speed) were combined was measured through a normalized 90° peel test. And we used Superhigh magnification lens zoom 3D microscope to observe the Interface structure around the interface and the section of interface was observed too. To profoundly study the interfacial bonding strength mechanism, using the numerical simulation method, we analysed the temperature changes of the interface. And the crystallinities in different processing parameters combination situations were monitored by thermal characterization DSC. And then we calculated the crystallinities of the melt at the interface, drawing a conclusion about the relations between crystallinity and interface strength. The results show that the process conditions are favorable for improving the crystallinity of the interface and have obvious effects on the strength of the interface.