The threshold voltage for short channel MOSTs has been derived by two-dimensional numerical computation. The results can be expressed in normalised form with the reduced threshold voltage, V T − V FB − 2 φ, given as a fraction of the reduced long-channel threshold voltage, V T∞ − V FB − 2 φ, where V FB and φ are the flat-band and bulk Fermi potentials respectively. An extremely good fit to the theoretical predictions is then given by V T−V FB−2φ V T∞−V FB−2φ =1− aW sr L b where a≃0.94−0.17 W s rj 1 2 b≃0.90−0.66 log 10 W s r j +0.37 X ox W s where the junction depth, r j , and oxide thickness, x ox , are expressed as fractions of the source depletion layer thickness, W s , and where the channel length, L, is given as a fraction of the one-dimensional theoretical spread, W sr , of a depletion region around a cylindrical step-junction. This empirical expression is valid over a wide range of normalised device geometries (0.4 < L/ W sr < 40, 0.1 < r j / W s < 10, 0.01 < x ox / W s < 0.2) and, except for very shallow junctions ( r j / W s ≲ 1), differs only slightly from the simple model proposed by Yau. A comparison of the theory with experimental results shows good agreement for MOSTs fabricated with channel lengths between 2 and 5 μm using conventional photolithography.