Fatigue Resistance Of Solder Joints Research Articles

Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints

This paper uses a multi-scale crystal plasticity modelling approach to investigate the role of microstructure in the damage of Sn-3Ag-0.5Cu (wt%, SAC305) solder joints subject to thermal cycling. Faithful microstructure modelling has been developed to explicitly represent the complex microstructure characterized in the experiments. The mechanisms for the experimental finding that single crystal joints systematically outperform interlaced and beachball joints, in terms of damage development during thermal cycling, are found to be the localization of stored energy due to the grain boundaries. Interlaced regions, however, benefit the lifetime of solder joints versus a beachball microstructure by virtue of energy diffusion. The modelling results, together with experimental characterization, provide practical suggestions on how the microstructure could be designed to optimize the in-service lifetime of solder joints subject to thermal fatigue.

A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths

Integrated circuit systems are always suffering the temperature cycling environment caused by frequent power on and off. Mismatch in thermal expansion coefficients among chip package components will cause severe cyclic stress to the solder joints. During thermal fatigue, β-Sn grains tended to generate thermal fatigue cracks at the grain boundaries. This work proposed a strategy of using amorphous Co-15 at.% P coating as the interface layer to inhibit the initiation and propagation of thermal fatigue cracks and improve the shear strength of solder joints by numerous endogenous CoSn3 laths. Mechanistically, based on the amorphous structure of the Co-P coating, Co atoms would massively and rapidly diffuse into the molten solder during the liquid-solid diffusion stage of reflow soldering, and the eutectic solidification together with β-Sn spontaneously precipitated numerous laths of CoSn3 intermetallic compounds (IMC), which were evenly distributed and became the skeleton of the solders. The skeleton-like CoSn3 laths with high elastic modulus were the reinforcing phase of Sn-based solder, but also refined the grains of β-Sn. The refinement of β-Sn grains and the strengthening of CoSn3 laths played an important role in inhibiting the initiation and propagation of thermal fatigue cracks. In addition, a discontinuous Co-Sn IMC layer was formed between the amorphous Co-P and the solder. The alternating appearance of CoSn3 and relatively soft β-Sn at the interface avoided the generation of cracks at the interface during temperature cycling.

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

During soldering and service, intermetallic compounds (IMCs) have an important impact on the performance and reliability of electronic products. A thin and continuous intermetallic layer facilitates the formation of reliable solder joints and improves the creep and fatigue resistance of solder joints. However, if the IMCs overgrow, the coarse IMC becomes brittle and tends to crack under stress, leading to a decrease in solder joint reliability. Based on the latest developments in the field of lead-free solders at home and abroad, this paper comprehensively reviews the interfacial reaction between SnAgCu Pb-free solders and different substrates and the growth behavior of IMCs and clarifies the growth mechanism of interfacial IMCs. The effects of the modification measures of lead-free solder on the IMCs and reliability of SnAgCu/substrate interface are analyzed, which provide a theoretical basis for the development and application of new lead-free solder.

Sn–3.0Ag–0.5Cu Nanocomposite Solder Reinforced With Bi2Te3Nanoparticles

Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn–3.0Ag–0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of −40 °C to 115 °C.

Research advances in nano-composite solders

Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite solders in the electronic packaging industry and the research advances of the composite solders developed. The rationale for the preparation of nano-composite solders are presented at first. Examples of two nano-composite solder fabrication methods, a mechanical mixing method and an in-situ method, are explained in detail. The achievements and enhancements in the nano-composite prepared solders are summarized. The difficulties and problems existing in the fabrication of nano-composite solders are discussed. Finally, a novel nano-structure composite solder, which attempts to solve the problems encountered in the fabrication of nano-composite solders, is introduced in detail. Guidelines for the development of nano-composite solders are then provided.

Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly

In this paper, we study board-level thermomechanical reliability of a high performance flip-chip ball grid array package assembly subjected to an accelerated thermal cycling test condition. Different control factors are considered for an optimal design towards enhancement of the thermal fatigue resistance of solder joints. These factors include solder composition, underfill, substrate size, lid thickness, stiffener ring width, test board size, soldermask opening on the substrate side, and pad size on the test board. The shape of solder joints after reflow is estimated using Surface Evolver. The optimal design is obtained using an L 18 orthogonal array according to the Taguchi optimization method. Importance of these control factors on the board-level thermomechanical reliability of the package is also ranked.

Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages

In this paper we study board-level thermomechanical reliability of a wafer-level chip-scale package subjected to an accelerated thermal cycling test condition. Different control factors are considered for a robust design towards enhancement of the thermal fatigue resistance of solder joints. These factors include diameter, pitch, and standoff of the solder joints, size of the solder connection opening on the die side, thickness of the pad on the test board, thickness of the test board, and dimension of the die. The Taguchi method along with the technique of analysis of variance are applied in the robust design process. Importance of these factors on the thermomechanical reliability of the package is ranked and the resulting robust design is further verified.

Fatigue resistance of soldered joints: A methodological study

Objectives. In this investigation, the fatigue resistance of solder joints under cyclic loading was evaluated. Methods. Auz.sbnd;Pd alloy rods were machined, prepared for soldering and joined using 735 solder. After trueing and polishing the joints, the SN diagram (cycles to failure vs. applied stress) was generated. A conventional endurance limit ( S N ) was determined for 10 6 load cycles. Testing was carried out in a machine specifically designed to apply flexural fatigue loading to cantilevered test speciments. These were rotated around their main axes, and the device applied a sinusoidal, reverse-bending stress to the solder joints. The applied stress ranged from 300 MPa to 75 MPa in decrements of 25 MPa. Twelve specimens were cycled for each stress level until fracture occurred or 10 6 cycles were sustained (run-outs). In this first series of tests, the cycling speed corresponded to an average chewing rate, i.e., 1 Hz (60 rpm). In order to reduce the time required for testing, the cycling speed was then increased to 5, 10 and 15 Hz (300, 600 and 900 rpm). Results. At 1 Hz, S N was 133.0 MPa, while at the higher cycling speeds, S N increased to 139.3, 160.8 and 175.8 MPa. Significance. It was concluded that ratational fatigue tests as applied in this study were a feasible fatigue testing procedure. However, S N 's gathered at faster rates might need correction factors if relationships with data pertaining to clinically relevant chewing rates are to be established.