Fabrication Of Microstructures Research Articles

Fabrication and Characterization of PZT Thick Film Microstructure and T-Shaped Generator by Electrohydrodynamic Jet Printing

Fabrication and Characterization of PZT Thick Film Microstructure and T-Shaped Generator by Electrohydrodynamic Jet Printing

Focused microstructure analysis and fabrication for monolithic integration with high-speed MUTC photodiode

Back-incidence high-speed photodiodes with small mesa diameter use back-integrated microstructures, which utilize the convergence and high transmittance function of the microstructures on the light beam to compensate for the incident light alignment deviation and improve the optical coupling efficiency. Two kinds of microstructures integrated with the modified uni-traveling-carrier photodiode (MUTC-PD), microlens and two-dimensional concentric annular convergence grating, are designed theoretically and compared by simulation. It is found that the microlens have better optical performance when integrated. InP microlenses meeting the requirements were fabricated using the photoresist hot melt method and inductively coupled plasma (ICP) etching. Testing revealed that the microlens could reduce the incident light spot size to one-third of its original size. By optimizing the thickness and doping concentration of the PD layer structure, and prepared a high-speed MUTC-PD with monolithic integrated InP microlens, with a mesa diameter of 18 μm. The measured 3 dB bandwidth of the integrated chip is 43 GHz. Experimental results using incident light fiber movement showed that the responsivity of the integrated microlens MUTC-PD increased by 66.76 % when horizontally offset by 10 μm compared to the non-integrated microlens case. When shifted vertically by 20 μm, the MUTC-PD responsivity of the integrated microlens decreases to 83.7 % of the maximum value, which is 18.2 % higher than that of the one without integrated microlens.

Mechanical Behavior of Additive Manufacturing (AM) and Wrought Ti6Al4V with a Martensitic Microstructure

Processing and microstructure are fundamental in shaping material behavior and failure characteristics. Additively manufactured materials, due to the rapid heating and solidification process, exhibit unique microstructures compared to their as-cast counterparts, resulting in distinct material properties. In this work, the response of the titanium alloy Ti6Al4V has been investigated for different processing conditions through quasi-static testing. AM Ti6Al4V was fabricated by employing Selective Laser Sintering (SLS) and Selective Laser Melting (SLM) techniques. Both materials present a similar microstructure consisting of an acicular martensitic α′-phase. Commercial Ti6Al4V-grade 5 (supplied as bars) was also examined after heat treatment to achieve a microstructure akin to the AM material. The heat treatment involved rapid heating above the β-phase region and water quenching to obtain a full martensite microstructure. A similar constitutive behavior and tensile–compressive asymmetry in strength were noted for the investigated materials. However, AM alloys exhibited a significantly higher deformation at failure, reaching nearly 40%, compared to only 6.1% for the wrought martensitic material, which can be attributed to the dissimilar distribution of both α′ laths and prior-β grain boundaries in the investigated materials. The results indicate that AM can be implemented for the fabrication of martensitic microstructures with mechanical properties superior to those obtained with conventional water-quenching.

Fabrication and Temporal Dependency Osteogenic Regulation of Dual-Scale Hierarchical Microstructures on Medical Metal Surface.

The structural characteristics at the interface of bone implants can guide biological regulation. In this study, a dual-scale hierarchical microstructure is proposed and customized using hybrid machining to achieve temporal dependency osteogenic regulation. It is observed that osteoblasts induced by dual-scale hierarchical structure exhibit adequate protrusion development and rapid cell attachment through the modulation of mechanical forces in the cell growth environment, and further promot the upregulation of the cell membrane receptor PDGFR-α, which is related to cell proliferation. Afterward, transcriptomic analysis reveals that during the differentiation stage, the DSH structure regulates cellular signaling cascades primarily through integrin adhesion mechanisms and then accelerates osteogenic differentiation by activating the TGF-β pathway and cAMP signaling pathway. Furthermore, the calcium nodules are preferentially deposited within the lower honeycomb-like channels, thereby endowing the proposed dual-scale hierarchical structure with the potential to induce oriented deposition and improve the long-term stability of the implant.

Fabrication of luminescent disc-shaped microstructures via wet-chemical etching of hybrid sol–gel layers for potential photonic applications

Sol–gel materials based on SiO2 and TiO2 precursors are attractive as a new platform for planar photonics. Particularly interesting are those based on organically modified silica (ORMOSIL), which may improve the luminescent properties of organic dyes. However, their microstructurization remains a challenge as it requires optimization of various technological stages. Here, we report the structurization of thin layers based on ORMOSIL precursor and titanium(IV) ethoxide (TET) containing luminescent rhodamine B (RhB) dye. Films were fabricated using sol–gel synthesis and dip-coating method. Depending on the time of annealing performed at 200 °C, layers with different thicknesses (300–760 nm) and refractive indices (RI) (1.51–1.68) were obtained. Combining photolithography and wet-chemical etching processes made it possible to fabricate well-separated sol–gel waveguides and discs of different diameters. The etching time in buffered hydrofluoric acid (BHF) affected the depth of the etched luminescent microstructures. Additionally, it was found that a longer layer’s annealing time increased the etching selectivity of the substrate over the sol–gel layer. This enabled the obtaining of under-etched sol–gel goblet microstructures. Selected samples were investigated using scanning electron microscopy (SEM). UV–Vis photoluminescence measurements showed that long heat treatment also influenced the emission spectrum’s shape. The stability of the films under ambient conditions was established using spectroscopic ellipsometry. It was proven that films heat-treated at 200 °C did not change their properties during storage time of around 2 months. Relatively high RI, luminescent properties, and structurization potential make these microstructures interesting for application in integrated photonic devices, e.g., light amplifiers or sensing systems.

Laser Direct Writing for Micromachining of Freeform Surface on n-Type GaAs via Photoelectrochemical Etching

The fabrication of microstructures featuring freeform surfaces on semiconductor substrates confronts substantial obstacles due to their inherent material difficulties, including considerable hardness and brittleness, as well as geometric complexity. In this investigation, we leverage laser direct writing (LDW) combined with photoelectrochemical etching to achieve precise material removal from semiconductor surfaces. By conducting a series of experiments on a home-made LDW apparatus under varying conditions, we established a correlation between the etching depth and both the power intensity and motion speed of the laser spot. The analysis revealed that the etching depth exhibited linearly with the power intensity of the laser spot and inversely with the motion speed. Additionally, the half widths of the grooves maintained consistently within the range of 1–2 μm. By leveraging this methodology, we successfully fabricated a freeform micro-optical structure on an n-GaAs wafer by precisely adjusting the power intensity of the laser spot during scanning, thus demonstrating the feasibility for achieving nanoscale machining precision. This research underscores the promise of this technique in significantly advancing the fabrication processes of semiconductor devices.

Screen-Printable Iontronic Pressure Sensor with Thermal Expansion Microspheres for Pulse Monitoring.

Constructing microstructures to improve the sensitivity of flexible pressure sensors is an effective approach. However, the preparation of microstructures usually involves inverted molds or subtractive manufacturing methods, which are difficult in large-scale (e.g., in screen printing) preparation. To solve this problem, we introduced thermally expandable microspheres for screen printing to fabricate flexible sensors. Thermally expandable microspheres can be constructed into microstructures by simple heating after printing, which simplifies the microstructure fabrication step. In addition, the added microspheres can also be used as ionic liquid reservoir materials to further increase the capacitance change and improve the sensitivity. The prepared sensors exhibited superior performance, including ultrahigh sensitivity (Smax = 49999.5 kPa-1) and wide detection range (0-350 kPa). Even after 30,000 cycles at a high pressure of 300 kPa and a low pressure of 30 kPa, the sensor showed minimal signal degradation, demonstrating long-term cycling stability. In order to verify the practical potential of the sensors, we performed human radial artery beat detection experiments using these sensors. The variations in the intensity of the 3D radial artery pulse wave can be observed very clearly, which is important for human health monitoring. The above demonstrates that our strategy can provide an effective approach for the large-scale preparation of high-performance flexible pressure sensors.

Multifunctional Hydrogel with 3D Printability, Fluorescence, Biodegradability, and Biocompatibility for Biomedical Microrobots.

As micron-sized objects, mobile microrobots have shown significant potential for future biomedical applications, such as targeted drug delivery and minimally invasive surgery. However, to make these microrobots viable for clinical applications, several crucial aspects should be implemented, including customizability, motion-controllability, imageability, biodegradability, and biocompatibility. Developing materials to meet these requirements is of utmost importance. Here, a gelatin methacryloyl (GelMA) and (2-(4-vinylphenyl)ethene-1,1,2-triyl)tribenzene (TPEMA)-based multifunctional hydrogel with 3D printability, fluorescence imageability, biodegradability, and biocompatibility is demonstrated. By using 3D direct laser writing method, the hydrogel exhibits its versatility in the customization and fabrication of 3D microstructures. Spherical hydrogel microrobots were fabricated and decorated with magnetic nanoparticles on their surface to render them magnetically responsive, and have demonstrated excellent movement performance and motion controllability. The hydrogel microstructures also represented excellent drug loading/release capacity and degradability by using collagenase, along with stable fluorescence properties. Moreover, cytotoxicity assays showed that the hydrogel was non-toxic, as well as able to support cell attachment and growth, indicating excellent biocompatibility of the hydrogel. The developed multifunctional hydrogel exhibits great potential for biomedical microrobots that are integrated with customizability, 3D printability, motion controllability, drug delivery capacity, fluorescence imageability, degradability, and biocompatibility, thus being able to realize the real in vivo biomedical applications of microrobots.

Coating-assisted picosecond laser ablation for microstructure fabrication of SiC ceramics

Silicon carbide (SiC) ceramics have emerged as critical materials in the production of high-precision components. Ultrafast laser processing is deemed the optimal technique for micro-nano manufacturing of SiC. However, the permanent deposition layer induced by laser ablation can critically impact the precision of the component. In this work, a coating-assisted picosecond laser ablation (CAPLA) method was proposed, in which sacrificial photoresist coating was utilized to improve surface quality without efficiency loss. The coating serves to prevent the uncooled plasma from contacting with the substrate, thereby preventing the formation of a permanent deposition layer. By comparing the CAPLA method with laser direct ablation, the influence of laser parameters and photoresist coating characteristics on the deposition layer was investigated systematically. A processed surface devoid of deposition layers can be achieved by CAPLA with low pulse energy and a high number of scans. The uniformity is critical to ensure the transmission of the laser beam, and a larger thickness can improve the processing efficiency by increasing the limit of pulse energy capacity. Pin arrays and vacuum grooves for SiC ceramic vacuum chucks were fabricated to demonstrate the superiority of the CAPLA method. These results suggest that this method can be a novel and promising approach for high-precision component manufacturing.

Uniform intensity chiral optical field by multifocal synthesis.

Chiral optical beams that carry orbital angular momentum (OAM) have a broad range of applications such as optical tweezers, chiral microstructure fabrication, and optical communications. However, some chiral optical beams have inhomogeneous intensity distribution that limits the application in these fields. In this Letter, two different types of chiral optical fields with uniform intensity and arbitrary length were proposed based on the amplitude encoding method and multifocal synthesis. The intensity distribution of the chiral optical fields is determined by the distance between the focal points that can greatly extend the modulation length of the chiral optical field. Moreover, since each focal point contains modulable amplitude and phase, an arbitrary interception of the optical field can be realized by selectively retaining a part of the focal points. By partitioning the chiral optical field and assigning different topological charges, the OAM space-division multiplexing and independent tunability of the topological charges can be realized. In addition, the composite multi-petal vortex array formed by combining two different chiral optical fields can greatly enhance the information capacity of the optical communications and may have potential applications in fields such as particle manipulation.

Preparation of brittle ITO microstructures using Laser-Induced forward transfer technology

The performance of transparent conductive microstructures plays a significant role in determining the device efficiency. The fabrication of ITO microstructures on the flexible optoelectronic devices remains challenging because of the high-temperature processing requirements and brittleness of the ceramic material. This paper highlights a three-dimensional microfabrication technique that combines sacrificial layer etching and laser-induced transfer. By studying the donor material thickness and the laser energy density, control of the sacrificial layer transfer thrust was achieved to yield an optimal microstructure performance. Different shapes of ITO transparent conductive microstructures were fabricated on polydimethylsiloxane (PDMS) surfaces, demonstrating structural integrity, visible light transmittances > 90 %, and resistivities of ≤ 8 × 10−4 Ω·cm. Finite element analysis was employed to simulate the impact transfer of the donor material onto the receiving substrate, thereby elucidating the energy-absorbing protective role of the flexible PDMS layer. Effective control of the transfer force was identified as a crucial factor in achieving the successful transfer of brittle films. This high-precision and rapid array processing approach meets the demands of automated batch manufacturing, indicating its potential for use in patterned processing on flexible substrates, as an alternative to lithographic techniques. This technique could be applied in the preparation of electronic skins and flexible devices. Additionally, for the first time, a 3 × 3 pixel resistive array sensor was integrated on a Ag nanowires/PDMS surface, demonstrating array pressure-sensing capabilities at pressures of 0–80 kPa. This study represents a significant step towards the development of multifunctional flexible optoelectronic devices.

Additive manufacturing of transparent conductive indium tin oxide by sol-gel and multiphoton absorption polymerization

Many optoelectronic devices, such as solar cells and LEDs, require materials that possess both transparency and conductivity. Indium tin oxide (ITO), the most commonly used transparent conductor, is limited to flat thin films and, therefore, cannot be used in 3D electronics. Herein, we present the fabrication of complex 3D ITO structures at sub-micron resolution via multiphoton absorption polymerization (MAP), a vat photopolymerization technology, by combining sol-gel chemistry and radical polymerization. Following the MAP fabrication, heat treatment is applied to convert the gel into a ceramic ITO. The sintering temperature affects the porosity, electrical conductivity, and transparency of the printed ITO structures. Electrical conductivity was measured for printed objects sintered at temperatures starting at 700 °C up to 1150 °C with a maximum bulk conductivity of 14.47 ± 1.54 S/cm at 1000 °C and maximal transparency above 90 %. Enabling the fabrication of full 3D conductive ITO micro-structures via MAP, this work unlocks new possibilities and perspectives for the fabrication of 3D optoelectronic devices with transparent and conductive components.

Development of Micro Electrical Discharge Machine and Micro-hole Machining Using Multiple Micro Electrodes

Recent advances in microtechnology have highlighted the need for fabricating microscopic parts with complex three-dimensional structures. This, in turn, has increased the demand for innovative tools. Micro electrical discharge machining (MEDM) is one such technique that has proven to be effective in producing parts that are difficult to fabricate using traditional manufacturing methods, such as micro shafts and micro holes. Therefore, this study focuses on the development of a specialized MEDM system that incorporates an optimized wire electrical discharge grinding (WEDG) module. Additionally, the study successfully fabricates microelectrodes for use as cutting tools using the MEDM/WEDG system. These micro-electrodes are then utilized in the precise fabrication of various types of multiple micro electrodes through the use of reverse electrical discharge machining (REDM). These multiple micro electrodes are subsequently employed in precise hole machining operations using MEDM. The application of REDM signifies a significant technological advancement in the precision fabrication of microstructures. Furthermore, it is expected to greatly enhance the versatility and efficiency of microtechnology manufacturing processes. Overall, REDM represents a new approach to manufacturing that is capable of producing more complex and high-precision microstructures.

Moving toward autonomous manufacturing by accelerating hydrodynamic fabrication of microstructures using deep neural networks

Manufacturing of microstructures using a microfluidic device is a largely empirical effort due to the multi-physical nature of the fabrication process. As such, in moving toward autonomous manufacturing, models are desired that will predict microstructure attributes (e.g., size, porosity, and stiffness) based on known inputs, such as sheath and core fluid flow rates. Potentially more useful is the prospect of inputting desired microfiber features into a design model to extract appropriate manufacturing parameters. In this study, we demonstrate that deep neural networks (DNNs) trained with sparse datasets augmented by synthetic data can produce accurate predictive and design models to accelerate materials development. For our predictive model with known sheath and core flow rates and bath solution percentage, calculated solid microfiber dimensions are shown to be greater than 95% accurate, with porosity and Young's modulus exhibiting greater than 90% accuracy for a majority of conditions. Likewise, the design model is able to recover sheath and core flow rates with 95% accuracy when provided values for microfiber dimensions, porosity, and Young's modulus. As a result, DNN-based modeling of the microfiber fabrication process demonstrates high potential for reducing time to manufacture of microstructures with desired characteristics.

Edge smoothness enhancement of digital lithography based on the DMDs collaborative modulation

The rough saw-tooth edge caused by the inherent microstructures of digital micromirror device (DMD) will reduce the quality of the lithography pattern. Comprehensively considering the manufacturing efficiency, precision and cost, we propose a DMDs collaborative modulation lithography method to improve the smoothness of the lithography pattern edge. Through combining two misaligned DMDs to collaboratively modulate exposure dose, the better edge smoothness can be achieved. Collaborative exposure with 1/2 DMD pixel misalignment and 1/4 DMD pixel misalignment are both implemented to form the step-shape lithography patterns. The experimental results show that the saw-tooth edge can approximate to a straight line when increasing the number of times of the collaborative exposure. Further error analysis indicates it is effective to improve the edge smoothness while ensuring the lithography quality by using the collaborative modulation lithography. These results indicate that the DMDs collaborative modulation lithography is a promising technique for fabrication of microstructures, which may be a solution for balancing the fabrication precision, efficiency and cost.

Fabrication of three-dimensional microstructures on GaN surfaces through the integration of femtosecond laser ablation and ICP etching

Gallium nitride (GaN) surface microstructures are crucial for enhancing the performance and reliability of high-power devices. However, the direct fabrication of patterned three-dimensional (3D) microstructures on GaN surfaces remains a significant challenge. This paper introduces an innovative approach, employing a maskless femtosecond laser combined with inductively coupled plasma (ICP) etching, to efficiently fabricate petal-shaped 3D microstructures on GaN surfaces. By fine-tuning the ICP etching and femtosecond laser parameters, we have obtained the regularities of the dimensional variations of these 3D microstructures. Additionally, our investigation reveals that the design of microstructural concavity and convexity characteristics can be flexibly manipulated by controlling the ICP etching rate, which is influenced by the oxide content in the laser-modified zone. This study presents a novel method for straightforward fabrication of microstructures on gallium nitride surfaces.

Microstructure-Assisted Wafer-Scale Fabrication of Perovskite Microlaser Arrays.

All inorganic lead halide perovskites exhibit fascinating optical and optoelectronic characteristics for on-chip lasing, but the lack of precise control of wafer-scale fabrication for perovskite microstructure arrays restricts their potential applications in on-chip-integrated devices. In this work, a microstructure-template assisted crystallization method is demonstrated via a designed chemical vapor deposition process, achieving the controllable fabrication of homogeneous perovskite micro-hemispheroid (PeMH) arrays spanning the entire surface area of a 4-inch wafer. Benefiting from the low-loss whispering gallery resonance and plasmon-enhanced light-matter interactions in well-confined hybrid cavities, this CsPbX3/Ag (X = Cl, Br) plasmonic microlasers exhibit quite low thresholds below 10µJcm-2. Interestingly, these thresholds can be efficiently modulated through the manipulation of plasmonic resonance and electromagnetic field mode in PeMHs owning various diameters. This strategy not only provides a valuable methodology for the large-scale fabrication of perovskite microstructures but also endorses the potential of all-inorganic perovskite nanostructures as promising candidates for on-chip-integrated light sources.

Fabrication of Microstructure Arrays via Localized Electrochemical Deposition

Localized electrochemical deposition microadditive manufacturing (AM) (LECD-µAM) technology represents a nontraditional manufacturing method applied for the layer-by-layer fabrication of metal microstructures via a fully automatic feedback mechanism. In terms of material utilization and complex structure formation, the proposed technology exhibits great potential for microstructure fabrication. The LECD-µAM technology introduced in this study involves the reduction of metal cations in the electrolyte to form metal microstructures. This study showed the flow simulation of an electrolyte in the cantilever probe and pressure distribution at the probe tip. In addition, the effect of extrusion pressure on the deposition structure was investigated experimentally. Combined with the experimental results, we discussed the effects of LECD-µAM technology on deposition outcomes and optimized parameters and designed a printing route for the deposition of complex metal microstructure arrays with smooth surfaces. The proposed technology attained a deposition rate and a microstructural copper content of 0.961 µm/s and 99.5%. In addition, LECD-µAM technology can be performed at room temperature, has low environmental requirements and cost, provides a good deposition surface, and holds great potential for the manufacture of three-dimensional and other complex microstructure arrays.

Efficient Fabrication of Bioinspired Flexible Pressure Sensors via Electrohydrodynamic Jet Printing Method.

The bioinspired microdevices have made significant strides in various applications including human motion and health detection. However, the facile and highly efficient fabrication approach of flexible pressure sensors remains a great challenge. Herein, inspired by the gecko's foot structure, a flexible pressure sensor with microdomes structures was one-step fabricated by tip-assisted on-demand electrohydrodynamic jet (EHD-jet) printing method. Ascribed to the interlocking electrodes with microdome structure substantially enlarged 3D deformation rates. When the microdromes structure is under pressure, the resistivity of the CNTs film coated on the surface of the microdomes structure will change remarkably. By using the combined effect of assisted tip and ring focusing electrode, the influence and constraints on microstructure fabrication caused by substrate material and morphology are minimized. The desired uniform structures can be adjusted rapidly by changing the printing parameters and liquid properties. The high length-height ratio (0.64) of microdomes, notably enhances the sensitivity, the minimum detection limit is 2Pa and the response time is 40ms. Finally, the bionic flexible sensor shows excellent performance in capable of detecting pressure, sound vibrations, and human motion. This work introduces a previously unexplored method for the high-efficiency fabrication of micro-nano patterns for bionic flexible sensors, with potential applications in wearable devices and human health detection. This article is protected by copyright. All rights reserved.

Performance evaluation in die-sinking EDM of polygonal micro cavities over EN-24 alloy steel using cylindrical electrode and polygon cycle approach

The integration of advanced Electrical Discharge Machining (EDM) technology, incorporating short and electronically pulsed discharges with precise circular electrode movements, has enabled the production of intricate 3D microstructures and cavities. This paper aims to investigate the machining performance of polygonal cavities—triangular, square, pentagon, and hexagon—fabricated on steel samples using a 400 µm cylindrical copper electrode within the polygon cycle approach of EDM. Experimental investigations were conducted to assess shape error, tool wear rate, recast layer formation, and elemental characterization. Various discharge patterns and side discharges were examined to understand their effects on spark gap uniformity, tool deflection, and discharge stability. The results revealed non-uniform spark gaps, tool deflection, and corner rounding due to varying discharge patterns and side discharges. Tool wear rate was found to be directly related to polygon complexity, with higher-order polygons leading to increased wear due to extended machining durations and heat accumulation. The maximum tool wear of 7.69 × 104 µm3/s occurred in case of hexagonal cavities while in case of triangular cavities, the tool wear rate was minimum having value of 5.77 × 104 µm3/s. Scanning Electron Microscopy (SEM) examinations showed the presence of recast layers and micro-cracks, particularly in cavities with higher shape complexities. Energy Dispersive X-ray Spectroscopy (EDS) analysis identified copper deposition, local material evaporation, and foreign element accumulation on the cavity surfaces. This study provides insights into the machining performance of polygonal cavities in EDM processes. The findings underscore the influence of discharge patterns, polygon complexity, and material interactions on tool wear, surface quality, and microstructure integrity. Understanding these factors can inform optimization strategies for EDM processes, leading to enhanced precision and efficiency in microstructure fabrication.