Heat-curing adhesives are widely used after being cured by heating to a temperature higher than room temperature. To evaluate the adhesive strength, therefore, it is necessary to consider both the thermal stress generated during heat curing and external loads such as tensile stress. Butt joint specimens are essential for evaluating tensile adhesive strength but also thermal strength. The interfacial strength can be discussed from the stress intensity factor (SIF) of a fictitious edge interfacial crack assumed at the interface end. This is because the SIF is controlled by the intensity of singular stress field (ISSF) at the crack-free interface end and a constant term associated with the thermal load. In this paper, a useful thermal SIF solution is proposed by superposing the SIF under tensile stress and the SIF under uniform interface stress associated with thermal loading. This general SIF expression provided under arbitrary material combination can be applied for predicting the tensile strength σc and critical temperature change ΔT without performing new FEM calculations. The usefulness of the expression is confirmed through the adhesive strength of Aluminum/Epoxy butt joint experimentally obtained. Once the critical SIF K1C can be obtained from the tensile strength σc and the temperature change ΔT, the adhesive strength can be expressed as K1C = constant of an assumed fictitious interface, and this can be used to predict critical σc for various temperature change ΔT and for various adhesive bondline thickness h.
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