Excellent Thermal Mechanical Properties Research Articles

Fabrication and properties of recyclable tung oil–based polymer coatings based on dual cross-linked dynamic covalent polymer networks

The exploration of reprocessability and high-adhesion biomass polymer coatings is in line with the concept of green materials and is conducive to energy conservation and environmental protection. Here, a series of novel recyclable tung oil–based polymer coatings based on dual cross-linked dynamic covalent networks were reported. Tung oil polymerized maleic anhydride (TOA) was firstly prepared and further reacted with furfuryl alcohol. Then tung oil-polymerized maleic furanol ester (TOAFA) containing reactive conjugated double bond and carboxyl groups was prepared. FTIR and 1H NMR demonstrated the reactive monomer TOAFA was successfully synthesized. Then TOAFA was cross-linked with bismaleimide and different epoxy resins to fabricate target polymer networks based on dynamic Diels-Alder(D-A) bonds and dynamic transesterification. The shape memory, reprocessing, and mechanical and thermal stability of the copolymerized systems with different crosslinking states were investigated. The coating performances were characterized with solvent resistance, adhesion strength, hardness and glossiness tests. It was found that the dynamic D-A covalent bonds were perfectly combined with transesterification in the polymerization systems. The copolymerized systems possessed excellent thermal stability and mechanical properties. The rigid and flexible properties of the polymer networks can be controlled by adjusting the component weight ratios and the type of epoxy resin in the polymerization system. The rigid polymerization system had the highest tensile strength of 28 MPa, and its elongation at break was up to 57 % of the flexible polymerization system. Coating adhesion test showed the adhesion property reached level 1. The polymer coatings displayed excellent solvent corrosion resistance, and relative high gloss. The polymer networks also showed certain reprocessing performance and excellent shape memory effect.

Lightweight and robust cellulose/MXene/polyurethane composite aerogels as personal protective wearable devices for electromagnetic interference shielding

The increasing electromagnetic pollution is urgently needed as an electromagnetic interference shielding protection device for wearable devices. Two-dimensional transition metal carbides and nitrides (MXene), due to their interesting layered structure and high electrical conductivity, are ideal candidates for constructing efficient conductive networks in electromagnetic interference shielding materials. In this work, lightweight and robust cellulose/MXene/polyurethane composite aerogels were prepared by mixing cellulose nanofiber (CNF) suspensions with MXene, followed by freeze-drying and coating with polyurethane. In this process, CNF effectively assembled MXene nanosheets into a conductive network by enhancing the interactions between MXene nanosheets. The prepared aerogel exhibited the shielding effectiveness of 48.59 dB in the X-band and an electrical conductivity of 0.34 S·cm−1. Meanwhile, the composite aerogel also possessed excellent thermal insulation, infrared stealth, mechanical and hydrophobic properties, and can be used as a wearable protective device to protect the human body from injuries in different scenarios while providing electromagnetic interference shielding protection.

Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages

AbstractThermoplastic polyimides (TPIs) can meet the requirements of advanced electronic packaging such as flexible copper clad laminate (FCCL) applied under extreme conditions, attributed to their excellent thermal stability, mechanical properties, electrical insulation and chemical resistance. With the increasing demands for electronic devices, such as applications in high‐frequency communication, it is highly desirable to develop high‐performance TPI with good thermoplasticity, thermal stability, mechanical properties and dielectric properties. However, there is a trade‐off between thermoplasticity and other properties. Herein, we introduce an effective strategy to afford TPIs with good performance by copolymerization of a diamine monomer consisted of a coplanar aromatic carbazole group and a short flexible linkage methylene group. On the one hand, short flexible linkages help improve the flexibility of polymer chains and are not too much to enable small‐scale molecular motions below Tg. On the other hand, coplanar aromatic donor groups benefit to strong charge transfer complex (CTC) interaction and π‐π stacking interaction. Based on this strategy, the resultant TPI possesses good thermoplasticity with a proper Tg of 348 °C. Meanwhile, it preserves a low coefficient thermal expansion of 48 ppm K−1, low dielectric constant/dielectric loss factor of 3.27/0.0073 at 10 GHz, and tensile strength of ca. 78 MPa.

Eco-friendly preparation of polyimide/boron nitride composite films with excellent thermal conductivity and mechanical properties

Polyimide/hexagonal boron nitride (PI/BN) composite films have attracted interest as heat dissipation materials for advanced microelectronic devices. However, conventional preparations of PI/BN composite films employ harmful and expensive high-boiling organic solvents. In this work, thermally conductive PI/BN composite films were, for the first time, prepared using a nontoxic, eco-friendly, and inexpensive aqueous solvent. BN was ultrasonically exfoliated in a mixed solvent of water and tert-butanol to obtain aqueous BN suspensions, in which a poly(amic acid) salt (PAAS) was synthesized. The PAAS/BN suspensions were then drop-casted, and thermally imidized into PI/BN composite films. The PI/BN films exhibited excellent in-plane and out-of-plane thermal conductivities (up to 15.043 W/mK and 1.142 W/mK, respectively), which is attributed to the effective exfoliation and dispersion of BN in the aqueous solvent. Furthermore, these films exhibited high tensile strength, flexibility, and thermal stability.

Rare-earth high-entropy magnetoplumbite structure hexaluminates (La1/5Nd1/5Sm1/5Eu1/5Gd1/5)MAl11O19 (M = Mg, Zn) for thermal barrier coating applications with enhanced mechanical and thermal properties

By applying the high-entropy strategy, one can develop stable mixed oxide by populating a single sublattice with many distinct cations. Two kinds of rare-earth high-entropy hexaaluminates (La1/5Nd1/5Sm1/5Eu1/5Gd1/5)MAl11O19 (M = Mg and Zn) were successfully synthesized, and their mechanical and thermal properties were analyzed. We highlight that the Zn-containing sample displays a significant increase in fracture toughness (2.48 MPa m1/2) and a decrease in thermal conductivity (1500 °C, 1.2 W m−1 K−1) as compared to the Mg-containing sample. The diffusion of fine grains in platelet-like grains observed only in the Zn-containing sample is considered to be responsible for its outstanding mechanical properties. This work demonstrates the excellent thermal-mechanical properties of the Zn-containing sample and indicates the promising use of high-entropy hexaaluminate in the aerospace field acting as thermal barrier coating materials.

High thermally conductive polyimide film designed with heterostructural Cring-C3N4 filler and multilayer strategy

With the emerging of advanced flexible electronic, the PI film with excellent thermally conductive, flexible, lightweight, electrically insulating qualities is in high demand as a potential substrate and encapsulation material. Conventional thermally conductive fillers such as ceramic, metal and carbon material with high hardness, high density or electrical conductivity are unsuitable to prepare the advanced PI film. Furthermore, the confined loading of thermally conductive filler in PI matrix limited by its film-forming property is another obstacle to optimizing the thermal conductivity of PI film. In this work, the development of novel filler (carbon nitride in-plane grafted by two-dimensional carbon material, Cring-C3N4) with intrinsic thermal conductivity and a design of three-layer structure for the introduction of high filler loading have dramatically improved the thermal conductivity of PI film. Benefitting by the planar heterostructure construction of g-C3N4 and Cring, the existence of Cring increases the phonon transfer rate in g-C3N4, and the presence of g-C3N4 prevents the electron movement in the facet of Cring-C3N4 endowing its excellent electrical insulation property. The design of three-layer structure in which the first and third layers served as mechanical support layers with a fixed filler content (20 wt%). The second layer has the higher filler content to enhance the quantity of thermally conductive filler in PI film. Resultantly, the maximum out-of-plane thermal conductivity of the PI/Cring-C3N4 composite film is 1.35 Wm−1K−1, which is 10 times higher than the pure PI film. In addition, the PI/Cring-C3N4 composite film exhibit excellent photothermal conversion ability in which the saturation temperature of PI/Cring-C3N4 can reach 283.6 °C under 0.75 W/cm2 laser radiation being 6 times higher than that of the corresponding PI film. After the incorporation of Cring-C3N4, the PI composite film still has excellent thermal stability, low CTE, electrical insulation and mechanical properties. This work provides a novel idea for the preparation of advanced high thermal conductivity PI film.

Precipitation and tensile behaviors of Allvac 718Plus superalloy during long-term thermal exposure

Allvac 718Plus alloy is a promising Ni-based superalloy with excellent thermal stability and mechanical properties up to 704 °C. The γ′ coarsening, σ precipitation and the resulting degraded tensile properties at room and elevated (704 °C) temperatures during long-term thermal exposure at 704 and 760 °C are systematically investigated in this work. The results showed that a higher exposure temperature and a longer exposure time significantly accelerate the γ′ coarsening and σ precipitation. The σ particles were detrimental to the alloy by acting as the preferential nucleation sites for cracks, and the reduction in tensile strengths was mainly caused by the increasing size of γ′ precipitates during thermal exposure. Furthermore, there were significant differences between the deformation mechanisms of room-temperature and elevated-temperature (760 °C) tensile tests. Concerning the deformation mechanism of γ-matrix, planar slipping dominates during tensile testing at room temperature, while the formation of stacking faults and microtwinning are primary during tensile testing at elevated temperature (760 °C). The dominant precipitation strengthening mechanism depended on the γ′ characteristics of different thermal exposure conditions and the tensile temperature. The 704 °C/100 h exposure sample shows a dislocation shearing mechanism when tested at room or elevated (760 °C) temperature. Notably, the 760 °C/1000 h exposure sample exhibits a mixed precipitation strengthening mechanism of Orowan bypassing and superlattice stacking faults shearing when tensile tested at room temperature while showing a dislocation and superlattice stacking faults shearing mechanism when tensile tested at elevated (760 °C) temperature.

Facile strategy for intrinsic low-κ dielectric polymers: molecular design based on space charge conservation.

The growing need for high-power and compact-size microelectronic integrated circuits (ICs) in modern microelectronic industries and 5G communication systems demands low dielectric constant (κ) polymer dielectrics with excellent temperature capability, mechanical property and processability. However, conventional molecular design strategies often face difficulties of a trade-off between optimizing the dielectric performance of polymers and maintaining the aforementioned properties. Herein, we present an innovative and facile strategy that utilizes the space charge distribution characteristics of the target co-monomer to solve this trade-off. Based on this design strategy, a novel polyaryl ether ketone (PAEK) with two different charge distribution units (BAF and SBI) was designed and synthesized. Both the experimental results and computational simulations confirm that these two components serve to weaken the polarization of molecular chains in the electric field, induce higher molecular chain packing density and fewer weaknesses, and synchronously regulate the κ, dielectric loss (tan δ), thermal and mechanical properties and processability by generating a strong inter-chain electrostatic interaction. The resultant copolymer, PAEK-4F6S, exhibits exceptional low κ and tan δ values of 1.98 and 0.0024 at 1 MHz, respectively, and these values remain stable over a broad frequency (1-106 Hz, 8.2-12.4 GHz) and temperature range (30-150 °C). Furthermore, the resultant copolymer demonstrates excellent thermal stability and mechanical properties, with a glass transition temperature (Tg) of 195 °C, 5 wt% decomposition temperature (Td5%) of 498 °C under N2, tensile strength of 63.5 MPa and tensile modulus of 1011.2 MPa, respectively. The synthesis procedure of these resultant copolymers is facile, and they are found to have favorable solution and melt processing properties, making them suitable for processing and scalable production. More importantly, this design strategy is beneficial for lowering the κ and tan δ values, and simultaneously enhancing the comprehensive performances of the objective polymers, which provides a completely novel and facile approach for the design and fabrication of high performance low-κ polymers suitable for the needs of microelectronics and communication fields.

Fabrication of fluorinated graphene based aramid nanofibers films with excellent thermal conductivity and mechanical properties

The rapid advancement of technology has spurred the development of a wide range of sophisticated electronic devices leading to an increasing demand for the utilization of thermoconductive materials to address thermal management. However, most of the available thermoconductive materials possess inadequate mechanical properties and low resistance to temperatures. To address this limitation, this study focuses on fabricating the thermoconductive films using aramid nanofiber (ANF) as strengthening components and fluorinated graphene (FG) as a thermoconductive filler. The films are prepared through the simple vacuum filtration method. The obtained FG/ANF film with 40 wt% of FG reached the in-plane thermal conductivity of 9 W/mK. Additionally, the FG40/ANF film exhibits excellent mechanical properties, including a tensile strength exceeding 110 MPa and toughness greater than 7.2 MJ/m³. Given these remarkable characteristics, the FG/ANF film holds significant promise as a material for dissipating heat in electronic devices, particularly in applications that demand high mechanical performance and temperature stability.

Triple‐chain segments regulation enable shape memory and photo deformation of smart polyimide

AbstractIntegration of controllable deformation with excellent thermal stability, mechanical, and insulation properties can greatly expand the versatility of smart polyimides (PIs). However, the unique molecular structure of PI makes it difficult for its molecular chain to move, which is not conducive to the reversible transformation of highly stable PI under environmental conditions. In this study, a PI film integrating shape memory and photo deformation is prepared by constructing a chemical network with PI oligomer as the hard, hexamethylene diisocyanate (HDI) as the soft, and azobenzene as the functional chain segment. The PI films still have a high glass transition temperature Tg ~ 225°C, a high Young's modulus E ~ 3.5 GPa, and a good breakdown strength Eb ~ 176 kV/mm. Moreover, as the network point of the chemical network, the trifunctional crosslinking agent makes the PI produce the shape memory effect induced by light and heat. UV light can drive crosslinked photoresponsivity PI film to have special shape transformation under specific conditions, using azobenzene as photoresponsivity group. This study provides a new idea for the preparation of multifunctional PI, which makes it potentially applicable in the field of smart electric and electronic engineering.

Facile construction strategy for intrinsically fire-safe and thermal-insulating bio-based chitosan aerogel

Bio-based aerogels have become a research hotspot in the emerging fields because of their remarkable biocompatibility, degradability and light weight, but their low strength and flammability limits their further application. In this study, chitosan (CS) containing flame retardant element was selected as the matrix, and a lightweight, flame retardant and thermal insulating CS aerogel was successfully prepared by the ion exchange between methylphosphonic acid (MPA) and acetic acid (HAc), and directional freeze-drying technology. The compressive strength and elastic modulus of CS@MPA aerogel were 15.2% and 8.5% higher than that of CS@HAc aerogel due to the 3D cross-linking structure between MPA and CS. Compared with CS@HAc aerogel, CA@MPA1.1 aerogel demonstrated excellent thermal insulating properties, and its thermal conductivity (25.46 mW/mK) was significantly lower than that of air (26.7 mW/mK). The introduction of MPA promoted the degradation and charring of CA@MPA aerogel, and the formation of high quality char layer efficiently exerted the barrier effect. Meanwhile, the phosphorus oxygen radicals and inert gases from the decomposition of CS@MPA aerogels effectively decreased the combustion intensity in gas phase. Therefore, the PHRR and THR of CS@MPA1.1 aerogels were decreased by 91.7% and 69.5% compared to CS@HAc aerogels. In summary, CS@MPA aerogel not only conforms to the current concept of sustainable development, but also possessed excellent thermal insulation, mechanical, and fire safety properties. It is expected to replace the traditional petrochemical-based materials, and shows broad application prospects in the fields of building insulation and energy storage.

Flexible and photo-responsive composite phase change materials for thermal therapy

The medical dressings with appropriate temperature can relieve body pain by promoting blood circulation. In order to endow the thermal compress dressings with multifunction and facilitate their application in different scenarios, the flexible films employing paraffin (PF) as thermal energy storage medium, styrene-ethylene/butylene-styrene (SEBS) triblock copolymer as matrix and graphene as photo-thermal conversion agents were fabricated. The film containing 77 wt% of PF has high latent heat of 157.26 J·g−1 and exhibits smooth and dense morphology. The film also exhibits tensile strain of 2576.75 %, photothermal conversion efficiency of 70.52 % and enviable self-healing properties, which makes it possible to meet the needs of different body parts and reuse in practical applications. In addition, under natural sunlight, the thickness of 3 mm thermal film can maintain the temperature ranging from 40 °C to 50 °C for more than 25 min; under the action of an electrically heated film, the film can maintain at 40 °C to 50 °C for about 22 min. The extraordinarily long thermal therapy time and suitable thermal therapy temperature are remarkable. In summary, the excellent thermal storage properties, mechanical properties, self-healing properties and photothermal conversion properties make it a good application prospect for thermal therapy.

Design and preparation of shape memory phenol–formaldehyde foam composites with excellent thermal stability and mechanical properties

Design and preparation of shape memory phenol–formaldehyde foam composites with excellent thermal stability and mechanical properties

Epoxy composites based on phase change microcapsules with high thermal conductivity and storage efficiency by dispersing with cellulose nanofibrils

The incorporation of microencapsulated phase change materials (MPCMs) into electronic packaging materials has demonstrated the potential to reduce the transient increase in temperature of electronic devices under thermal loading. However, because of their high specific surface area, MPCMs tend to form severe aggregates in polymer matrices, resulting in poor thermal conductivity and energy storage efficiency. Therefore, in this paper, cellulose nanofibers (CNF) were used as dispersants to effectively disperse MPCMs in the epoxy resin matrix to synthesize epoxy composites with superior thermal conductivity and thermal storage properties (referred to as EBM-C). The results demonstrated that the addition of CNF improved the dispersion of MPCMs as well as the thermal conductivity and thermal storage capacity of the composites. The thermal conductivity and energy storage efficiency of the composites with 3 wt% CNF were increased by 100 %, and 97 %, respectively, compared to those of composites without CNF. In addition, the EBM-C composites also had excellent thermal stability and mechanical properties. The experimental results conclusively demonstrate that the EBM-C composites have tremendous application potential as thermal management materials.

Polyimide films with ultralow dielectric loss for 5G applications: Influence and mechanism of ester groups in molecular chains

Polyimides are ideal candidates for 5G high-frequency communications due to their good thermal stability, mechanical properties and processability. However, the exploration of how to reduce their high-frequency dissipation factor (Df) remains an urgent and alluring challenge. Inspired by the molecular structure of liquid crystal polyester, which is insensitive to high-frequency electric fields, here we design two series of polyimides derived from diamines with multiple ester groups (AXEB, X = 1, 2 or 3) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) or p-phenylene bis (trimellitate anhydride) (TA2EB). We investigated the effects of ester number on the aggregation structure, water absorption, dielectric properties, heat resistance and mechanical properties of the polyimides and find that the Df of the multiple ester-containing polyimides decreases rapidly with increasing frequency and number of ester groups. Wide-angle X-ray diffraction analysis, polarized optical microscopy observations and molecular dynamics simulations show that the unique properties of these polyimides benefit from the tight packing of the molecular chain and the strong intermolecular interaction force caused by the ester group, as well as the resulting prolonged dipole relaxation time and the greatly reduced water absorption. Therefore, the polyimide films show extremely low Df values of 0.0030 for AXEB-6FDA and 0.0013 for AXEB-TA2EB. Furthermore, AXEB-TA2EB also shows excellent thermal stability, mechanical properties, electrical properties and permittivity. More importantly, their ultralow moisture rate (<0.83 %) ensures that the high-frequency Df remains stable in different humid environments, even after soaking in water. This method can also be extended to other polymers, thus providing a new strategy for the design of low dielectric loss materials.

Facile Preparation of a Novel HfC Aerogel with Low Thermal Conductivity and Excellent Mechanical Properties.

Aerogels emerge as captivating contenders within the realm of high-temperature thermal resistance and thermal insulation. Nevertheless, their practical applications are usually constrained by their inherent brittleness when subjected to rigorous conditions. Herein, employing hafnium dichloride oxide octahydrate (HfOCl2·8H2O) as the hafnium source and resorcinol-formaldehyde (RF) as the carbon precursor, hafnium carbide (HfC) aerogels are fabricated via the sol-gel method complemented with carbothermal reduction reaction. Investigations are conducted into the effects of various molar ratios, duration, and temperatures of calcination on the microstructural features and physico-chemical characteristics of the as-prepared HfC aerogel. The aerogel shows a high BET-specific surface area (601.02 m2/g), which is much larger than those of previously reported aerogels. Furthermore, the HfC aerogel exhibits a low thermal conductivity of 0.053 W/(m·K) and a compressive strength of up to 6.12 MPa after carbothermal reduction at 1500 °C. These excellent thermal insulation and mechanical properties ensure it is ideal for the utilization of high-temperature thermal resistance and thermal insulation in the fields of aerospace.

Double-Network MK Resin-Modified Silica Aerogels for High-Temperature Thermal Insulation.

Polymer-reinforced SiO2 aerogel materials exhibit excellent thermal insulation, flame resistance, and mechanical properties; however, the poor thermal stability of organic components limits their application in high-temperature environments. Herein, a double-network MK/SiO2 aerogel was synthesized by direct copolymerization of a methyl-containing silicone resin (MK) and tetraethoxysilane (TEOS) under the cross-coupling of (3-aminopropyl) triethoxysilane (APTES) followed by an atmospheric drying method. The resulting MK/SiO2 aerogel, presenting a double-cross-linked MK and SiO2 network, shows a low density of 0.18 g/cm3, a high specific surface area of 716.6 m2/g, and a low thermal conductivity of 0.030 W/(m K). Especifically, the compressive strength of the MK/SiO2 aerogel (up to 3.24 MPa) is an order of magnitude higher than that of the pristine SiO2 aerogel (0.39 MPa) due to the introduction of the strong MK network and enhanced neck connections of SiO2 nanoparticles. Furthermore, the mutually supportive network endows the MK/SiO2 aerogels with significant resistance to ablation and oxidation up to 1000 °C, showing a high residual rate (89%), a high specific surface area (235.2 m2/g), and structural stability after thermal treatment under air atmosphere. These superior mechanical and thermal properties of the MK/SiO2 aerogels lead to attractive practical applications in energy transportation, thermal insulation, or aviation.

Intercalation of silsesquioxane surfactant in layered double hydroxide for silicone rubber composites: Enhancing interfacial interactions toward improvement of mechanical, thermal, and gas barrier properties

AbstractThe incorporation of two‐dimensional layered metal hydroxides (LDHs) into nonpolar silicone rubber (SR) is not yet universal, mainly because of their originally hydrophilic surface and limited interlamellar galleries that make nanoparticle dispersion and intercalation of polymer segments more difficult. In this work, we develop a modified Ca‐Mg‐Al LDH form by conjugating the ternary Ca‐Mg‐Al LDH with silsesquioxane (SQ) surfactants containing benzoic acid moieties and polyethylene glycol chains via an in‐situ intercalation process. The bulky anions conjugation to the hydroxide layers dictated both the surface hydrophobicity and interlayer spacing of the modified Ca‐Mg‐Al LDH, enabling strong inter‐constituent interactions within the nanocomposites as well as extensive polymer penetration after incorporation into the SR matrix. The SR/modified LDH nanocomposites show excellent thermal stability and satisfactory mechanical properties due to the homogeneous dispersion and good compatibility of modified Ca‐Mg‐Al LDH. Moreover, we have observed that the shear‐induced orientation of the nano‐layered particles upon application of stress imparts a more notably decreased SR/LDH‐SQ‐40 gas transmission rate (reduced by 55% with respect to that in the unstretched composite films). This result also corroborates the better interfacial bonding and highly efficient load transfer between silsesquioxane‐modified LDH and polymer in melt extrusion mixing of such composites.Highlights Modified Ca‐Mg‐Al LDH with increased layer spacing and reduced hydrophilicity. Modifier enhanced the interfacial adhesion between Ca‐Mg‐Al LDH and SR matrix. SR/modified LDH showed excellent thermal stability and mechanical properties. Orientation and exfoliation enhanced gas barrier properties of SR/modified LDH.

Sintering Temperature Effect of Near-Zero Thermal Expansion Mn3Zn0.8Sn0.2N/Ti Composites.

Metal matrix composites with near-zero thermal expansion (NZTE) have gained significant popularity in high-precision industries due to their excellent thermal stability and mechanical properties. The incorporation of Mn3Zn0.8Sn0.2N, which possesses outstanding negative thermal expansion properties, effectively suppressed the thermal expansion of titanium. Highly dense Mn3Zn0.8Sn0.2N/Ti composites were obtained by adjusting the fabrication temperature. Both composites fabricated at 650 °C and 700 °C exhibited NZTE. Furthermore, finite element analysis was employed to investigate the effects of thermal stress within the composites on their thermal expansion performance.

Lignocellulose Nanofibers Enhanced Mechanical and UV-Blocking Properties of Polyvinyl Alcohol Films

Lignin-containing cellulose nanofibers (LCNFs) from bamboo were prepared by choline chloride–lactic acid solvent treatment at 110–130∘C in combination with ultrasonication. Effects of LCNFs dosages on UV-blocking property, mechanical property, thermal stability and water vapor barrier property of LCNFs/PVA composite film were determined by UV spectrophotometer, universal mechanical testing machine, thermogravimetric analysis and weightlessness method, respectively. The results indicated that PVA film composited 10% LCNFs obtained from 120∘C showed best properties. As compared to pure PVA film, the UV-blocking property of composite film increased from 30% to 53%. LCNFs addition enhanced mechanical properties, resulting increment of tensile strength from 42[Formula: see text]MPa to 81[Formula: see text]MPa and elongation at break from 3% to 9%, respectively. LCNFs also introduced 2.4 times increment of water vapor barrier property of PVA film. The LCNFs/PVA composite films not only have excellent thermal stability and mechanical properties but also have UV-resistance and water vapor barrier properties. It provides a new idea for replacing some petroleum-based packaging materials and also shows the great potential of LCNFs materials.