Dislocation Evolution Research Articles

Research on nanocutting mechanism of polycrystalline γ-TiAl alloy at different temperatures

The γ-TiAl alloy is widely used in the aerospace industry due to its remarkable properties. However, its deformation mechanism during nanocutting is significantly influenced by temperature variations. This study utilizes molecular dynamics simulations to investigate the nanocutting processes of polycrystalline γ-TiAl alloy across a range of low and high temperatures. The focus is on how the initial equilibrium temperature affects cutting force, cutting temperature, Von Mises stress, shear strain, atomic phase transformation, and dislocation evolution during the nanocutting of the alloy.The results indicate that at lower temperatures, a decrease in initial equilibrium temperature leads to a gradual increase in the number of atoms in intermediate states, accompanied by diminished heat diffusion. Conversely, in high-temperature cutting scenarios, the initial equilibrium temperature is negatively correlated with the cutting force (Fx); specifically, the average Fx at 300K is 1.72 times that at 1050K. At elevated temperatures, as the initial equilibrium temperature increases, the chip formation mode transitions from fracture to shear, resulting in higher internal Von Mises stress and shear strain within the chips, as well as a wider shear line. Additionally, further increases in the initial equilibrium temperature lead to a broader atomic flow bandwidth in the shear region.At 173K, the counts of BCC and HCP structured atoms reach their minima, comprising 62.5 % and 55 % of their respective maximum values. Moreover, the densities of 1/2<110> (perfect) dislocations and 1/3<111> (Frank) dislocations decrease with rising initial equilibrium temperatures, showing growth rates exceeding 80 % as the temperature increases from 300K to 1050K.

Dislocation Evolution in Cyclic-Loaded Cu Nanopillars with Different Configurations.

Small-sized metals generally exhibit unusual deformation responses subjected to cyclic loading, since their limited volume cannot effectively accommodate micro-sized dislocation patterns typically found in their bulk counterparts. Here, the cyclic behaviors in Cu nanopillars with different configurations are investigated using in situ transmission electron microscopy fatigue test. Dislocation tangles formed in single- and twinned-crystal nanopillars as a result of cycling-induced operations of multiple slip systems and further unpinning and absorption of pinned dislocations. While, nanopillars configured with low-angle grain boundary (LAGB) underwent the degradation and eventual decomposition of the LAGB due to the cycling-induced emission of grain boundarydislocations, which resulted in high-density mobile dislocations to withstand the cyclic loading. These findings contribute to a systematic and comprehensive understanding of the micro-mechanics of dislocation-related phenomena in the cyclic response of nanoscale metals.

Study on micro-deformation in micro-grinding of selective laser melting FeCoCrNi high-entropy alloy based on molecular dynamics

Microscopic deformation behavior is an important part of the study of micro-grinding processing. This paper investigates the removal mechanism in the micro-grinding of selective laser melting FeCoCrNiAl0.5 high-entropy alloy. The micro-grinding process is analyzed through simulation using the molecular dynamics simulation method. The study examines how the thickness of the undeformed chip and the grain size affect the microdeformation behaviors of shear strain, micro-grinding force, the evolution of dislocations, and microstructural transformation. The experimental results confirm that the molecular dynamics simulation model accurately predicts the micro-deformation behavior of FeCoCrNiAl0.5 high-entropy alloy during micro-grinding. The micro-deformation mechanism involves dislocation slip and twinning deformation, while the removal mechanism mainly includes the elimination of axial and dendritic crystals. During micro-grinding, the grinding force experiences small to large fluctuations, and the total length of dislocations gradually increases. As the undeformed cutting thickness increases, the micro-grinding force also gradually increases. Simultaneously, the type of dislocations and laminar dislocation nuclei increase, leading to growth in the total length of dislocations. The number of high shear strain atoms, the micro-grinding force, and the degree of fluctuation in the single crystal high-entropy alloy are higher than those in the polycrystalline material, but the total dislocation length is significantly smaller.

Microstructure evolution after hot working and heat treatment in 6082 aluminum alloy manufactured by horizontal continuous casting

In this paper, 6082 aluminum alloy manufactured by horizontal continuous casting was subjected to high-temperature plastic deformation under 20–70 % deformation levels with following T6 heat treatment process. Microstructural and phase changes were investigated by light and scanning electron microscopy together with energy dispersive spectroscopy, while grain, grain boundary, dislocation and texture evolution was studied by electron-backscattered diffraction. The results are showing that continuous dynamic recrystallization processes are active during the hot working while influence of static recrystallization is significant only for highest deformation degrees. The abnormally coarse-grained microstructure does locally occur in the subsurface layer after the 70 % deformation and T6 heat treatment. Crystallographic texture components are gradually evolving from the various types (Goss, Brass, D) for the low deformations (up to 40 %) into fiber-type textures (α-fiber, γ-fiber or C2-fiber) for high deformations due to the inhomogeneity of plastic deformation. The formation of AlMnSi dispersoids, CSL-boundaries Σ25b and an increase in fraction of GND, MgSi and Fe-based intermetallic particles was observed during the phase transformation which promotes ongoing nucleation of recrystallization processes.

Dislocation evolution in anisotropic deformation of GaN under nanoindentation

The exceptional performance of GaN semiconductors in lasers, wireless communication, and energy storage systems makes them crucial for future multi-functional devices. However, during the polishing of GaN wafers, abrasive particles can induce subsurface damage, compromising device performance. This study investigates dislocation loops in GaN single crystal to understand dislocation nucleation and glide under external stress. Using nanoindentation for compressive stress, we confirmed multiple slip system activation via transmission electron microscopy after pop-in. We also performed molecular dynamics to simulate the nucleation and multiplication of U-shaped dislocation loops. Furthermore, we developed a theoretical model using Peierls–Nabarro stress to quantify GaN's critical shear stress. Raman spectroscopy was also used to analyze shear stress on U-shaped loops, supporting our model. This study provides insights into GaN dislocation dynamics under mechanical stress, aiding in wafer defect evaluation during machining and offering guidance for dislocation evolution.

Electric current-induced directional slip of dislocation and grain boundary ordering

The evolution of lattice dislocations in metals can be induced by electric current. However, the effect of electric current on the interaction between lattice dislocations and grain boundaries (GBs) remains unclear. Herein, we investigate the evolution of lattice dislocations and grain boundary dislocations (GBDs) induced by electric current in M50 steel via in-situ TEM characterization, density functional theory (DFT) calculations, and molecular dynamics (MD) simulations. Our findings reveal that electric current induces the directional slip of lattice dislocations towards GBs, while the reduction of GB contrast is attributed to the decomposition and reorganization of GBDs. DFT calculations demonstrate that electric current enhances the force on atoms in defect regions. These in-situ TEM observations are well reproduced by MD simulations incorporating electric current, which include a virtual temperature rise at defect regions to reflect the electric current force on defect atoms. Based on these observations, we propose a novel GB accommodation model under electric current. These results provide valuable insights into the mechanisms by which electric current tailors lattice dislocation behavior and enhances GBDs ordering in metallic materials.

Comparison on Hysteresis Loops and Dislocation Configurations in Fatigued Face-Centered Cubic Single Crystals

The aggregation and evolution of dislocations form different configurations, which are the preferred locations for fatigue crack initiation. To analyze the spatial distribution of the same dislocation configuration and the resulting configuration morphologies on different observation planes, several typical hysteresis loops and dislocation configurations in fatigued face-centered cubic single crystals with various orientations were compared. The crystal orientations of these specimens were determined by the electron back-scattering diffraction technique in a Cambridge S360 Scanning Electron Microscope. It is well known that dislocation ladder and wall structures, as well as patch and vein structures, are distributed on their respective observation planes, (12¯1) and (111). These correspond to the point defect direction and line defect direction of dislocations, respectively. Therefore, the wall structures on the (12¯1) and (111) planes consist of point defects and line defects, which can be defined as point walls and line walls, respectively. Furthermore, the walls on the (12¯1) plane consist of Persistent Slip Band ladders connected with each other, corresponding to the formation of deformation bands. The evolution of dislocation patterns follows a process from patch to ladder and from vein to wall. The formation of labyrinths and dislocation cells originates from the activation of different secondary slip systems. In one word, it can help us better understand the physical nature of metal fatigue and failure by studying the distribution and evolution of different configurations.

Preparing gradient microstructure to achieve enhanced performance in GH4586 superalloy: Experiments and models

In this present study, a combined method of controlling strain deformation (CSD) and gradient-temperature heat treatment (GTHT) was adopted to prepare gradient microstructure in GH4586 superalloy. Consequently, it brought enhanced tensile strength from 1313.1±18.7 MPa at intermediate transition (IT) region to 1506.3±15.7 MPa at high-strain and low-temperature (HS-LT) region, presenting an improvement of 11.6%. And it also enhanced fracture toughness from 77.7±0.3 MPa⋅m1/2 at IT region to 86.7±3.7 MPa⋅m1/2 at low-strain and high-temperature (LS-HT) region, presenting an improvement of 14.7%. The formation of gradient microstructure along the longitudinal direction of CSD+GTHT-treated sample was thoroughly investigated from perspectives of precipitates distribution, activated slip systems and dislocations evolution. During CSD, the size and volume fraction of γ′ precipitates decreased under the effect of strain-induced dissolution behavior. The activation of (1‾ 11)[101] and (11‾ 1)[011] slip systems dominated dislocation movement at each region and there retained increasing dislocation density due to more extensively activated slip systems at HS region. During GTHT, the high-density dislocations promoted recrystallization while the concentratedly distributed γ′ precipitates obstructed movement of recrystallized front, leading to formation of heterogeneous structure with high-density grain boundaries and dislocations at HS-LT region. Finally, a model reflecting the effect of grain boundary strengthening, precipitation strengthening and dislocation strengthening on mechanical property of gradient microstructure was established and successfully applied to property prediction of GH4586 superalloy.

A crystal plasticity-based creep model considering the concurrent evolution of point defect, dislocation, grain boundary, and void

Creep poses a significant threat to the integrity and longevity of structural components at high-temperature. The most current understanding of creep mainly focuses on the coupled dynamics of point defects and dislocation, which may well describe the first and second stage of creep. However, the behavior of the three stages of creep is jointly controlled by point defect (vacancy) diffusion, dislocation glide, dislocation climb, grain boundary (GB) sliding, and void evolution. A critical knowledge gap still exists regarding how these different creep mechanisms are simultaneously coupled during the three stages of creep. In this work, a multi-physical mechanisms-based crystal plasticity model is proposed to consider the concurrent evolution of point defect, dislocation, GB, and void based on a unified thermodynamic framework. In-situ scanning electron microscope creep experiments and macroscopic creep experiments of Ti-6Al-4V were conducted to validate our model. The in-situ creep experiment directly revealed the GB sliding creep failure behavior of Ti-6Al-4V for the first time. The proposed model well predicts both the microscopic and macroscopic experimental behavior of creep. The contribution of different microstructure evolutions is discussed, and a phase diagram of the dominated creep mechanism is obtained. An in-depth analysis was conducted on the coupling effects and microstructure characteristics of different creep mechanisms. This work not only deepens our understanding of the micro creep mechanism but also offers valuable insights for designing materials with specific microstructures to enhance their creep resistance.

Study on the grain development and dislocation evolution from dynamic to post-dynamic stage in IN718Plus superalloy; the role of second-phase

The introduction of hexagonal η-Ni3(Al,Ti)0.5Nb0.5 phase can refine and homogenize the microstructure of IN718Plus superalloy during hot working, but produces more complicated recrystallization behavior associated with second-phase modified structural mechanisms. Derived from this perspective, the role of η phase on recrystallization mechanisms and grain development from dynamic deformation to post-dynamic dwell was systematically investigated. The results indicated that η phase delayed the throughout recrystallization procedure and grain development. During dynamic deformation, boundary η inhibited discontinuous dynamic recrystallization via preventing the bulging of original grain boundaries, while intragranular lamellar η promoted heterogeneous strain concentration, stimulated random dislocations for continuous dynamic recrystallization and dislocation walls for banded dislocation substructures, which limited recrystallization occurrence in dynamic stage. During post-dynamic dwell, boundary η dissolution increased the nucleation sites for discontinuous static recrystallization, and η phase restricted grain boundary migration to provide abundant nucleation sites for continuous static recrystallization (CSRX). The banded dislocation substructures slowly evolved into subgrains to further form banded CSRX grains, which reduced grain size during early post-dynamic stage. After fully recrystallization, the residual η protected the small grains and impeded grain growth, meanwhile controlled the grain distribution. As a result, η phase induced sluggish dislocation evolution and recrystallization nucleation, consequently suppressed grain development and obtained the more homogeneous and fine grain configuration.

Mechanical properties of AlCoCrCuFeNi high-entropy alloys using molecular dynamics and machine learning

High-entropy alloys (HEAs) stand out from multi-component alloys due to their attractive microstructures and mechanical properties. In this investigation, molecular dynamics (MD) simulation and machine learning (ML) were used to ascertain the deformation mechanism of AlCoCrCuFeNi HEAs under the influence of temperature, strain rate, and grain sizes. First, the MD simulation shows that the yield stress decreases significantly as the strain and temperature increase. In other cases, changes in strain rate and grain size have less effect on mechanical properties than changes in strain and temperature. The alloys exhibited superplastic behavior under all test conditions. The deformity mechanism discloses that strain and temperature are the main sources of beginning strain, and the shear bands move along the uniaxial tensile axis inside the workpiece. Furthermore, the fast phase shift of inclusion under mild strain indicates the relative instability of the inclusion phase of hexagonal close-packed (HCP). Ultimately, the dislocation evolution mechanism shows that the dislocations are transported to free surfaces under increased strain when they nucleate around the grain boundary. Surprisingly, the ML prediction results also confirm the same characteristics as those confirmed from the MD simulation. Hence, the combination of MD and ML reinforces the confidence in the findings of mechanical characteristics of HEA. Consequently, this combination fills the gaps between MD and ML, which can significantly save time, human power, and cost to conduct real experiments for testing HEA deformation in practice.

Effect of crystallographic orientation on the deformation and mechanical behavior of CoCrFeNi in Berkovich nanoindentation

The hardness and plastic deformation behavior of single-phase concentrated solid solution alloy CoCrFeNi were studied for selected crystallographic orientations (⟨001⟩, ⟨011⟩ and ⟨111⟩) using Berkovich nanoindentation. The integration of transmission electron microscopy (TEM) and molecular dynamics (MD) simulations was carried out to elucidate comprehensively the distinction in the deformation mechanisms, the evolution of dislocation structures, and the pile-up of differently oriented CoCrFeNi alloys subjected to indentation by a Berkovich indenter. In MDs, a Berkovich indenter, meticulously crafted to replicate its real geometry, was effectively employed in investigating the nanoindentation. The ⟨001⟩-oriented CoCrFeNi exhibited the highest hardness and the lowest magnitude of pop-in events, followed by the ⟨011⟩ and then the ⟨111⟩ orientations. The pile-up behavior was strongly dependent on the crystallographic orientation and occurred by three sequential processes. The deformation twinning was activated only in the ⟨001⟩ orientation and inclined toward the center direction of the indent due to the force inclining toward the radial direction of the indent. The clear manifestation of the evolution of dislocations in the three orientations during indentation was elucidated. More SFTs or Stair-rods were observed in the ⟨001⟩ orientation, attributable to the intensified reaction of Shockley partials stemming from its higher density of Shockley partials, followed by the ⟨011⟩ and then the ⟨111⟩ orientations. The anisotropic nanoindentation-hardness was correlated with the microstructures. The highest hardness and lowest magnitude of pop-in events of the ⟨001⟩ orientation could be ascribed to its intense dislocation interactions, high-density SFTs and the formation of twins. In the ⟨111⟩ orientation, the three-fold symmetry emission of prismatic dislocation loops along the three slip directions not parallel to the surface leaded to a weak interaction between dislocations, and then resulted in the lowest hardness. This research may be helpful to enhance our comprehension of the intricate mechanical behaviors exhibited by different oriented FCC high entropy alloys under Berkovich indentation.

The influence of high strain rates on mechanical properties and microstructure of CuCrZr alloy under strong current carrying condition

The extreme condition of high-speed metal deformation under intense current flow is commonly encountered in the realms of national defense, military, and industry. However, there has always been a lack of effective research method for the micro deformation mechanism of metal under this extreme condition. We have developed a high current and high strain rate tensile (HCHST) testing platform based on RC circuits, which is used to research the micro-deformation mechanisms of CuCrZr alloy under this extreme condition. The dynamic tensile tests of CuCrZr alloy at different high strain rates (1401s−1, 2957 s−1, 5503 s−1, 8012 s−1) under the high current density (6550 A/mm2) condition were conducted using the HCHST experimental platform. The mechanical properties and microstructure of CuCrZr alloy under the HCHST were analyzed by combining TEM and EBSD. The research results indicate that the microhardness of the alloy in the HCHST #1 environment (6550 A/mm2,1401s−1) is almost the same as the original state. This is attributed to the strong current promoting the movement of dislocations and reducing the accumulation of dislocations. Under condition like HCHST#1, the dislocation annihilation rate and dislocation formation rate of CuCrZr alloy almost reach equilibrium. At higher strain rates, the dislocation multiplication rate is much higher than the dislocation annihilation rate caused by strong current. This imbalance leads to dislocation entanglement and the formation of dislocation cells, resulting in an increase in the microhardness of the material. Additionally, EBSD was used to analyze the changes in grain size, average volume fraction of LAGBs, average KAM value, and texture of the samples, further verifying the dislocation evolution and microhardness changes of copper alloys under HCHST conditions. Our research results provide strong theoretical for the application of CuCrZr in the field of electrical thermal mechanical coupling.

Deformation Mechanisms Dominated by Decomposition of an Interfacial Misfit Dislocation Network in Ni/Ni3Al Multilayer Structures.

Ni/Ni3Al heterogeneous multilayer structures are widely used in aerospace manufacturing because of their unique coherent interfaces and excellent mechanical properties. Revealing the deformation mechanisms of interfacial structures is of great significance for microstructural design and their engineering applications. Thus, this work aims to establish the connection between the evolution of an interfacial misfit dislocation (IMD) network and tensile deformation mechanisms of Ni/Ni3Al multilayer structures. It is shown that the decomposition of IMD networks dominates the deformation of Ni/Ni3Al multilayer structures, which exhibits distinct effects on crystallographic orientation and layer thickness. Specifically, the Ni/Ni3Al (100) multilayer structure achieves its maximum yield strength of 5.28 GPa at the layer thickness of 3.19 nm. As a comparison, the (110) case has a maximum yield strength of 4.35 GPa as the layer thickness is 3.01 nm. However, the yield strength of the (111) one seems irrelevant to layer thickness, which fluctuates between 10.89 and 11.81 GPa. These findings can provide new insights into a deep understanding of the evolution and deformation of the IMD network of Ni/Ni3Al multilayer structures.

Molecular Dynamics Study on Wear Resistance of High Entropy Alloy Coatings Considering the Effect of Temperature.

High entropy alloys have excellent wear resistance, so they have great application prospects in the fields of wear resistance and surface protection. In this study, the wear resistance of the FeNiCrCoCu high entropy alloy coating was systematically analyzed by the molecular dynamics method. FeNiCrCoCu high entropy alloy was used as a coating material to adhere to the surface of a Cu matrix. The friction and nanoindentation simulation of this coating material were carried out by controlling the ambient temperature. The influence of temperature on its friction properties was analyzed on five aspects: lattice structure, dislocation evolution, friction coefficient, hardness, and elastic modulus. The results show that with the increase of temperature, the disorder of the lattice structure increases, which leads to an increase of the tangential force and friction coefficient in the friction process. At 300 K and 600 K, the ordered lattice structure of the high entropy alloy coating material is basically the same, and thus its hardness is basically the same. However, the dislocation density at 600 K is significantly reduced compared with that at 300 K, resulting in an increase of the elastic modulus of the material from 173 GPa to 219 GPa. At temperatures of 900 K and 1200 K, lattice disorder takes place rapidly, and dislocation density also decreases significantly, resulting in a significant decrease in the hardness and elastic modulus of the material. When the temperature reaches 900 K, the wear resistance of the FeNiCrCoCu high entropy alloy coating decreases sharply. This work is of great value in the analysis of wear resistance of high entropy alloys at high temperature.

Mechanical properties improvement of titanium alloy and its grain boundary dislocation evolution mechanism by novel electroshock treatment

Titanium alloys are extensively utilized in the aerospace industry due to their exceptional strength and resistance to corrosion. However, litmited performance and high dispersion has always existed for the traditional manufacturing process. A novel Electroshock Treatment (EST) procedure proposed by author's team can synergistically improve the mechanical properties and its consistency of titanium alloys under limited temperature rise, but the relevant mechanism is not yet clear. In present work, the effects of various EST conditions on the mechanical characteristics were investigated by uniaxial tensile testing, and the effect mechanism was revealed using multi-scale microstructure characterization of titanium alloys, such as SEM, EBSD and TEM. The uniaxial tensile test results show that, compared with the sample without EST, the average elongation after fracture improved by 12.5%, the strength-plastic product improved by 16.1%, and the consistency of UTS and elongation after fracture improved by 63.4% and 57.1%, respectively, with a slight increase of tensile strength (30 MPa) after appropriate treatment (current density of 0.93 × 108A/m2, and pulse duration of 300 ms). The multi-scale microscopic characterization reveals a more uniform distribution of stress concentration in TC11 titanium alloy following the appropriate EST process. Besides, the entanglement of dislocations is reduced with some dislocations being annihilated. Especially, the remaining dislocations undergoing orderly rearrangement at grain boundaries after EST. The homogenization of local lattice distortion distribution and orderly rearrangement of dislocations at grain boundaries are the primary factors contributing to the comprehensive improvement in the mechanical properties and consistency of TC11 Titanium alloy.

Investigation of the Dislocation Behavior of 6- and 8-Inch AlGaN/GaN HEMT Structures with a Thin AlGaN Buffer Layer Grown on Si Substrates

Developing cost-effective methods to synthesize large-size GaN films remains a challenge owing to the high dislocation density during heteroepitaxy. Herein, AlGaN/GaN HEMTs were grown on 6- and 8-inch Si(111) substrates using metal–organic chemical vapor deposition, and their basic properties and dislocation evolution characteristics were investigated thoroughly. With the insertion of a 100 nm thin AlGaN buffer layer, bow–warp analysis of the epitaxial wafers revealed excellent stress control for both the 6- and 8-inch wafers. HR-XRD and AFM analyses validated the high crystal quality and step-flow growth mode of GaN. Further, Hall measurements demonstrated the superior transport performance of AlGaN/GaN heterostructures. It is worth noting that dislocations tended to annihilate in the AlN nucleation layer, the thin AlGaN buffer layer, and the GaN buffer layer in the initial thickness range of 200–300 nm, which was indicated by ADF-STEM. To be specific, the heterointerfaces exhibited a significant effect on the annihilation of c-type (b = &lt;0001&gt;) dislocations, which led to the formation of dislocation loops. The thin inserted layers within the AlGaN buffer layer played a key role in promoting the annihilation of c-type dislocations, while they exerted less influence on a-type (b = 1/3&lt;112¯0&gt;) and (a+c)-type (b = 1/3&lt;112¯3&gt;) dislocations. Within an initial thickness of 200–300 nm in the GaN buffer layer, a-type and (a+c)-type dislocations underwent strong interactions, leading to considerable dislocation annihilation. In addition, the EELS results suggested that the V-shaped pits in the AlN nucleation layer were filled with the AlGaN thin layer with a low Al content.

Mechanical behavior and microstructural deformation mechanisms of Ti-6Al-4V helix springs under prolonged extreme cryogenic temperatures and constant loading

The prolonged mechanical performance degradation and failure of elastic components in mechanical systems can pose significant safety risks and disrupt related operations. While helical compression springs' mechanical behavior and failure mechanisms at high temperatures have been well-studied, their mechanical properties and microstructural deformation mechanisms at extreme cryogenic temperatures remain largely unexplored. This paper conducts experiments to investigate the detailed mechanical properties and microstructural evolution of Ti-6Al-4V helix springs under such conditions. Initially, we examined the mechanical properties at cryogenic temperatures and compared them with those at high temperatures. It was observed that the logarithmic constitutive model applicable at high temperatures does not suitably describe the spring's mechanical behavior at cryogenic temperatures. At extremely low temperatures, the mechanical properties of the spring were enhanced. Furthermore, we characterized the microstructural deformation mechanisms using electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM), including twinning, slip activation, and dislocation evolution. The findings suggest that the deformation mechanism in Ti-6Al-4V springs under cryogenic conditions is predominantly governed by twinning and basal and prismatic slip. Due to the significant increase in the critical resolved shear stress (CRSS) of the pyramidal slip systems at cryogenic temperatures, these slip systems may not be activated during the deformation process. Additionally, the volume fraction of twinning shows a significant positive correlation with both cryogenic temperature and mechanical stress.

Deformation mechanism and properties evolution of a copper alloy with ultra-high strength after cold drawing and subsequent aging treatment

In this study, the microstructure and properties evolution of Cu-2.7Ti-0.2Fe alloy (wt.%) during cold drawing and subsequent aging treatment were investigated. The grain refinement mechanisms of the samples were analyzed in detail and systematically based on EBSD characterization. Dislocation evolution realized the refinement of grains by promoting the transformation of dislocation walls/cell walls to high angle grain boundaries. The twin-twin/dislocation intersections were another important way of refinement. Strong <100> and <111> fiber textures were formed during drawing, which had the volume fractions of 24.9 % and 55.5 %, respectively, in the sample with true strain of 8.4. The <100> fiber texture was mainly associated with the twinning and dislocation slipping in the high Schmid factor condition, while the decrease in the fraction of <100> fiber texture was mainly attributed to the grain refinement. The wire peak-aged at 380 °C for 2 h achieved excellent comprehensive properties with yield strength of 1596 MPa, tensile strength of 1682 MPa and electrical conductivity of 15.5 %IACS.

Study on Mechanical Properties of Nanopores in CoCrFeMnNi High-Entropy Alloy Used as Drug-Eluting Stent.

The CoCrFeMnNi high-entropy alloy is commonly used for vascular stents due to its excellent mechanical support and ductility. However, as high-entropy alloy stents can cause inflammation in the blood vessels, leading to their re-narrowing, drug-eluting stents have been developed. These stents have nanopores on their surfaces that can carry drug particles to inhibit inflammation and effectively prevent re-narrowing of the blood vessels. To optimize the mechanical properties and drug-carrying capacity of high-entropy alloy stents, a high-entropy alloy system with different wide and deep square-shaped nanopore distributions is created using molecular dynamics. The mechanical characteristics and dislocation evolution mechanism of different nanopore high-entropy alloy systems under tensile stress were studied. The results showed that the CoCrFeMnNi high-entropy alloy with a rational nanopore distribution can effectively maintain the mechanical support required for a vascular stent. This research provides a new direction for the manufacturing process of nanopores on the surfaces of high-entropy alloy stents.