Epoxy resins are essential polymeric materials for various industrial applications owing to their excellent adhesion, thermal properties, and processability. Reported improvement methods for overcoming the limitations of epoxy-resin adhesives involve incorporating fillers such as silica, clay, carbon nanotubes, and graphene. While silica nanoparticles are commonly used in industrial applications, their properties often require enhancement. In this study, mesoporous silica nanoparticles (MSNs) were synthesized using cetyltrimethylammonium bromide and novel swelling agents, 2,6-dihydroxybenzoic acid and decane, to control pore sizes within the 2–4 nm range. Transmission electron microscope and nitrogen adsorption analyses confirmed pore sizes of 2.0, 3.1, and 3.9 nm. Applying MSNs as nanofillers to epoxy resin adhesive resulted in enhanced adhesive properties with increasing pore size, particularly with 0.5 wt% MSN-4 nm, achieving a 51.4 % improvement in shear strength compared to that of bare epoxy resin. This enhancement is attributed to the increased specific surface area of the MSNs, providing more interaction sites with the epoxy resin and improving resin penetration and interaction. These findings highlight the critical role of nanopore size in optimizing adhesion in nanofiller applications and emphasize the potential of MSNs as superior nanofillers for future industrial applications.